Read Sony MDS-B5 Service Manual online
— 127 —
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
R961
1-216-001-00 METAL CHIP
10
5%
1/10W
R962
1-216-001-00 METAL CHIP
10
5%
1/10W
R963
1-216-001-00 METAL CHIP
10
5%
1/10W
R977
1-216-026-00 METAL GLAZE
110
5%
1/10W
R978
1-216-026-00 METAL GLAZE
110
5%
1/10W
R983
1-216-049-91 METAL GLAZE
1K
5%
1/10W
R984
1-216-049-91 METAL GLAZE
1K
5%
1/10W
R986
1-216-033-00 METAL CHIP
220
5%
1/10W
R987
1-216-033-00 METAL CHIP
220
5%
1/10W
**************************************************************
*
1-662-428-11 HP BOARD
********
< CAPACITOR >
C841
1-164-159-11 CERAMIC
0.1uF
50V
C842
1-164-159-11 CERAMIC
0.1uF
50V
< CONNECTOR >
* CN811
1-564-337-61 PIN, CONNECTOR 3P
* CN818
1-568-955-11 PIN, CONNECTOR 6P
< DIODE >
D807
8-719-109-85 DIODE RD5.1ES-B2
D808
8-719-109-85 DIODE RD5.1ES-B2
< FERRITE BEAD >
FB809
1-236-163-11 ENCAPSULATED COMPONENT
FB810
1-236-163-11 ENCAPSULATED COMPONENT
FB811
1-236-163-11 ENCAPSULATED COMPONENT
FB812
1-236-058-21 ENCAPSULATED COMPONENT
FB813
1-236-058-21 ENCAPSULATED COMPONENT
< JACK >
J805
1-770-306-11 JACK (LARGE TYPE)(PHONES)
J806
1-778-314-11 CONNECTOR, DIN (KEY BOARD)
< COIL >
L802
1-412-473-21 INDUCTOR
0uH
L803
1-412-473-21 INDUCTOR
0uH
L804
1-424-122-11 FILTER, NOISE
L805
1-424-122-11 FILTER, NOISE
< VARIABLE RESISTOR >
RV805
1-241-031-11 RES, VAR, CARBON 1K/1K (PHONES)
**************************************************************
*
A-4699-175-A JACK BOARD, COMPLETE
*********************
< CAPACITOR >
C803
1-104-664-11 ELECT
47uF
20%
25V
C804
1-104-664-11 ELECT
47uF
20%
25V
C805
1-104-665-11 ELECT
100uF
20%
16V
C806
1-104-665-11 ELECT
100uF
20%
16V
C807
1-104-664-11 ELECT
47uF
20%
25V
C808
1-104-664-11 ELECT
47uF
20%
25V
C817
1-104-664-11 ELECT
47uF
20%
25V
C818
1-104-664-11 ELECT
47uF
20%
25V
C819
1-104-664-11 ELECT
47uF
20%
25V
C820
1-104-664-11 ELECT
47uF
20%
25V
C821
1-126-941-11 ELECT
470uF
20%
16V
C822
1-126-941-11 ELECT
470uF
20%
16V
C823
1-104-665-11 ELECT
100uF
20%
16V
C824
1-104-665-11 ELECT
100uF
20%
16V
C831
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C832
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C837
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C838
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C843
1-124-120-11 ELECT
220uF
20%
25V
C883
1-165-319-11 CERAMIC CHIP
0.1uF
50V
C884
1-165-319-11 CERAMIC CHIP
0.1uF
50V
C889
1-165-319-11 CERAMIC CHIP
0.1uF
50V
C890
1-165-319-11 CERAMIC CHIP
0.1uF
50V
C893
1-163-251-11 CERAMIC CHIP
100PF
5%
50V
C894
1-163-251-11 CERAMIC CHIP
100PF
5%
50V
C895
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
< CONNECTOR >
* CN802
1-695-241-31 PIN, CONNECTOR (PC BOARD) 8P
* CN814
1-569-495-11 SOCKET, CONNECTOR 9P
* CN816
1-569-397-11 SOCKET, CONNECTOR 4P
< DIODE >
D804
8-719-210-39 DIODE EC10QS-04
< GROUND TERMINAL >
EB801
1-537-770-21 TERMINAL BOARD, GROUND
< FERRITE BEAD >
FB875
1-236-058-21 ENCAPSULATED COMPONENT
FB876
1-236-058-21 ENCAPSULATED COMPONENT
FB877
1-236-058-21 ENCAPSULATED COMPONENT
< IC >
IC802
8-759-636-55 IC M5218AFP
IC803
8-759-636-55 IC M5218AFP
JACK
DUP OUT
HP
Click on the first or last page to see other MDS-B5 service manuals if exist.