Read Sony JAX-PK33 (serv.man2) Service Manual online
SERVICE MANUAL
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
8 ohms or more
SPEAKER:
accepts impedance of 6 to
16 ohms
16 ohms
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Wavelength
770 – 810 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassettes
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50-kHz step)
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
Mexican models:
Mexican models:
127 V AC, 60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
110 watts
Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/Tape/CD section:
Amplifier/Tuner/Tape/CD section:
Approx. 280
× 325 ×
425 mm
Mass Approx.
8.3
kg
Design and specifications are subject to change
without notice.
without notice.
The following measured at AC 120, 127, 220, 240 V
50/60 Hz
DIN power output (rated): 48 + 48 watts (6 ohms at
50/60 Hz
DIN power output (rated): 48 + 48 watts (6 ohms at
1 kHz, DIN)
Continuous RMS power output (reference):
60 + 60 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
Inputs
VIDEO/MD IN (phono jacks):
VIDEO/MD IN (phono jacks):
voltage 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
Amplifier section
COMPACT DISC DECK RECEIVER
E Model
CX-JPK33
Ver. 1.1 2005.05
9-877-595-02
Sony Corporation
2005E05-1
Personal Audio Group
© 2005.05
Published by Sony Engineering Corporation
SPECIFICATIONS
CX-JPK33 is the amplifier, CD player, tape deck
and tuner section in JAX-PK33.
and tuner section in JAX-PK33.
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM74-F1BD81
Section
Base Unit Name
BU-F1BD81A
Optical Pick-up Name
KSM-215DCP
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CWM43FF13
CX-JPK33
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
CX-JPK33
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case (Side-L/R) ............................................................... 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74-F1BD81) ...................... 11
3-6. Front Panel Block ............................................................ 12
3-7. Back Panel Section .......................................................... 12
3-8. MAIN Board ................................................................... 13
3-9. Tape Mechanism Deck (CWM43FF13) ......................... 13
3-10. Table Assy ....................................................................... 14
3-11. MOTOR (TB) Board ....................................................... 14
3-12. MOTOR (LD) Board ....................................................... 15
3-13. Base Unit (BU-F1BD81A) ............................................. 15
3-14. Motor Gear Assy (Sled) (M102), CD Board .................. 16
3-15. Optical Pick-up (KSM-215DCP) .................................... 16
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74-F1BD81) ...................... 11
3-6. Front Panel Block ............................................................ 12
3-7. Back Panel Section .......................................................... 12
3-8. MAIN Board ................................................................... 13
3-9. Tape Mechanism Deck (CWM43FF13) ......................... 13
3-10. Table Assy ....................................................................... 14
3-11. MOTOR (TB) Board ....................................................... 14
3-12. MOTOR (LD) Board ....................................................... 15
3-13. Base Unit (BU-F1BD81A) ............................................. 15
3-14. Motor Gear Assy (Sled) (M102), CD Board .................. 16
3-15. Optical Pick-up (KSM-215DCP) .................................... 16
4.
TEST MODE
.............................................................. 17
5.
ELECTRICAL ADJUSTMENTS
CD Section ...................................................................... 21
6.
DIAGRAMS
6-1. Block Diagram – SERVO Section – .............................. 22
6-2. Block Diagram – MAIN Section – ................................ 23
6-3. Block Diagram
6-2. Block Diagram – MAIN Section – ................................ 23
6-3. Block Diagram
– PANEL/POWER SUPPLY Section – .......................... 24
6-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
6-5. Printed Wiring Board – CD Board – ............................. 26
6-6. Schematic Diagram – CD Board – ................................ 27
6-7. Printed Wiring Boards – CHANGER Section – ............ 28
6-8. Schematic Diagram – CHANGER Section – ................ 29
6-9. Printed Wiring Board
6-6. Schematic Diagram – CD Board – ................................ 27
6-7. Printed Wiring Boards – CHANGER Section – ............ 28
6-8. Schematic Diagram – CHANGER Section – ................ 29
6-9. Printed Wiring Board
– CDMP3 CONNECT Board – ...................................... 30
6-10. Schematic Diagram
– CDMP3 CONNECT Board – ...................................... 31
6-11. Schematic Diagram – MAIN Section (1/4) – ................ 32
6-12. Schematic Diagram – MAIN Section (2/4) – ................ 33
6-13. Schematic Diagram – MAIN Section (3/4) – ................ 34
6-14. Schematic Diagram – MAIN Section (4/4) – ................ 35
6-15. Printed Wiring Boards – MAIN Section – .................... 36
6-16. Printed Wiring Board – PANEL Section – .................... 37
6-17. Schematic Diagram – PANEL Section (1/2) – .............. 38
6-18. Schematic Diagram – PANEL Section (2/2) – .............. 39
6-19. Printed Wiring Board – POWER AMP Section – ......... 40
6-20. Schematic Diagram – POWER AMP Section – ............ 41
6-21. Printed Wiring Boards – TRANS Section – .................. 42
6-22. Schematic Diagram – TRANS Section – ...................... 43
6-12. Schematic Diagram – MAIN Section (2/4) – ................ 33
6-13. Schematic Diagram – MAIN Section (3/4) – ................ 34
6-14. Schematic Diagram – MAIN Section (4/4) – ................ 35
6-15. Printed Wiring Boards – MAIN Section – .................... 36
6-16. Printed Wiring Board – PANEL Section – .................... 37
6-17. Schematic Diagram – PANEL Section (1/2) – .............. 38
6-18. Schematic Diagram – PANEL Section (2/2) – .............. 39
6-19. Printed Wiring Board – POWER AMP Section – ......... 40
6-20. Schematic Diagram – POWER AMP Section – ............ 41
6-21. Printed Wiring Boards – TRANS Section – .................. 42
6-22. Schematic Diagram – TRANS Section – ...................... 43
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 54
7-2. Tape Mechanism Deck Section (CWM43FF13) ............ 55
7-3. PANEL Board Section .................................................... 56
7-4. Cassette Box Section ...................................................... 57
7-5. Front Panel Section ......................................................... 58
7-6. Back Panel Section .......................................................... 59
7-7. Chassis Section ............................................................... 60
7-8. CD Mechanism Deck Section-1 (CDM74-F1BD81) ..... 61
7-9. CD Mechanism Deck Section-2 (CDM74-F1BD81) ..... 62
7-10. CD Mechanism Deck Section-3 (CDM74-F1BD81) ..... 63
7-11. Base Unit Section (BU-F1BD81A) ................................ 64
7-2. Tape Mechanism Deck Section (CWM43FF13) ............ 55
7-3. PANEL Board Section .................................................... 56
7-4. Cassette Box Section ...................................................... 57
7-5. Front Panel Section ......................................................... 58
7-6. Back Panel Section .......................................................... 59
7-7. Chassis Section ............................................................... 60
7-8. CD Mechanism Deck Section-1 (CDM74-F1BD81) ..... 61
7-9. CD Mechanism Deck Section-2 (CDM74-F1BD81) ..... 62
7-10. CD Mechanism Deck Section-3 (CDM74-F1BD81) ..... 63
7-11. Base Unit Section (BU-F1BD81A) ................................ 64
8.
ELECTRICAL PARTS LIST
............................... 65
4
CX-JPK33
+
–
+
R
L
R
L
–
– Rear View –
PART No.
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
•
MODEL IDENTIFICATION
MODEL
PART No.
Mexican model
4-252-231-2
[]
Chilean and Peruvian models
4-252-231-3
[]
