ICF-CD837 - Sony Audio Service Manual (repair manual). Page 3

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1-1.   Cord Dressing (Power Cord) ............................................... 5
1-2.   Pointer Alignment ............................................................... 5

............................................................................ 6

3-1.   Cabinet (Upper) Assy .......................................................... 8
3-2.   Front Panel Assy ................................................................. 8
3-3.   Power Board ........................................................................ 9
3-4.   Main Board Section ............................................................ 9
3-5.   Main Board, CD Block Assy ............................................. 10
3-6.   CD Mechanism Deck ........................................................ 10
3-7.   CD Board .......................................................................... 11
3-8.   Optical Pick-up ................................................................. 11
3-9.   Lid (CD) ............................................................................ 12
3-10. LED Holder Assy .............................................................. 12
3-11. LED Indicator Element Unit ............................................. 13
3-12. Indicator Board, Drive Board ............................................ 13

Tuner Section ......................................................................... 14
CD Section ............................................................................ 15

5-1.   Block Diagram – CD Section – ......................................... 17
5-2.   Block Diagram – Main Section – ...................................... 18
5-3.   Circuit Boards Location .................................................... 19
5-4.   Printed Wiring Board – CD Section – ............................... 20
5-5.   Schematic Diagram – CD Section – .................................. 21
5-6.   Printed Wiring Boards – Main Section – .......................... 22
5-7.   Schematic Diagram – Main Section – ............................... 23
5-8.   Printed Wiring Boards – Display Section – ...................... 24
5-9.   Printed Wiring Board – Key Section – .............................. 25
5-10. Schematic Diagram – Display Section – ........................... 26
5-11. Printed Wiring Board – Power Supply Section – .............. 27
5-12. Schematic Diagram – Power Supply Section – ................. 28

6-1.   Cabinet Section ................................................................. 32
6-2.   Front Panel Section ........................................................... 33
6-3.   Upper Cabinet Section ...................................................... 34
6-4.   Lower Cabinet Section ...................................................... 35
6-5.   CD Block Section .............................................................. 36
6-6.   CD Mechanism Section .................................................... 37

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Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.