Read Sony ICF-CD73W Service Manual online
SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
ICF-CD73W
SPECIFICATIONS
WEATHER/FM/AM/CD PORTABLE RADIO
9-889-070-01
2008C05-1
©
2008.03
US Model
Ver. 1.0 2008.03
Model Name Using Similar Mechanism
ZS-X3CP
Optical Pick-up Block Name
KSM-900AAA
CD player section
System: Compact disc digital audio system
Laser diode properties: Material: GaAlAs
Laser diode properties: Material: GaAlAs
Wavelength: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 μW
(This output is the value measur
Emission duration: Continuous
Laser output: Less than 44.6 μW
(This output is the value measur
ed at a
distance of about 200 mm fr
om the objective
lens surface on the optical pick-up block with
7 mm apertur e.)
7 mm apertur e.)
Frequency response: 20 – 20 000 Hz
+1
–1.5
–1.5
dB
Wow and flutter: Below measurable limit
Radio section
Frequency range:
Band
Range
Channel
step
step
WEATHER
1 – 7 ch
1 channel
FM
87.5 – 108 MHz
0.1 MHz
AM
530 – 1 710 kHz
10 kHz
General
Time display: 12-hour system
Speaker: 50 mm (2 inches) dia, 6
Speaker: 50 mm (2 inches) dia, 6
Ω
Power outputs:
400 mW + 400 mW (at 10% harmonic
distortion)
distortion)
Power requirements:
6 V DC, four Size C (R14) batteries
External power source: DC IN 6 V
Dimensions:
Dimensions:
Appr ox. 151.5
× 248 × 84 mm (w/h/d)
(Appr ox. 6
× 9
7
/
8
× 3
3
/
8
inches) incl.
projecting parts and controls
Mass: Approx. 1 350 g (2 lb 16 oz) incl. batteries
Supplied accessories:
Suction cup (1), Strap (1)
Supplied accessories:
Suction cup (1), Strap (1)
Design and specifications are subject to change
without notice.
without notice.
ICF-CD73W
2
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 6
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 7
3-2. Cabinet (Front) Block ..................................................... 7
3-3. Cabinet (Upper) Block .................................................... 8
3-4. Chassis
3-3. Cabinet (Upper) Block .................................................... 8
3-4. Chassis
(Main)
Block
...................................................... 8
3-5. LCD
Board
...................................................................... 9
3-6. Optical Pick-up Block (KSM-900AAA) ........................ 9
3-7. Speaker (5 cm) (SP101)/(SP201) .................................... 10
3-7. Speaker (5 cm) (SP101)/(SP201) .................................... 10
4.
TEST MODE
............................................................ 11
5. ELECTRICAL
ADJUSTMENTS
........................ 14
6. DIAGRAMS
6-1. Block Diagram - CD Section - ........................................ 16
6-2. Block Diagram - TUNER Section - ................................ 17
6-3. Block Diagram - MAIN Section - ................................... 18
6-4. Printed Wiring Boards - CD Board - .............................. 20
6-5. Schematic Diagram - CD Section - ................................. 21
6-6. Printed Wiring Boards - TUNER Board - ....................... 22
6-7. Schematic Diagram - TUNER Board - ........................... 23
6-8. Printed Wiring Boards - MAIN Section - ....................... 24
6-9. Schematic Diagram - MAIN Section - ........................... 25
6-10. Printed Wiring Boards - POWER Section - .................... 26
6-11. Schematic Diagram - POWER Section - ........................ 27
6-2. Block Diagram - TUNER Section - ................................ 17
6-3. Block Diagram - MAIN Section - ................................... 18
6-4. Printed Wiring Boards - CD Board - .............................. 20
6-5. Schematic Diagram - CD Section - ................................. 21
6-6. Printed Wiring Boards - TUNER Board - ....................... 22
6-7. Schematic Diagram - TUNER Board - ........................... 23
6-8. Printed Wiring Boards - MAIN Section - ....................... 24
6-9. Schematic Diagram - MAIN Section - ........................... 25
6-10. Printed Wiring Boards - POWER Section - .................... 26
6-11. Schematic Diagram - POWER Section - ........................ 27
7.
EXPLODED VIEWS
7-1. Overall
Section
............................................................... 32
7-2. Cabinet (Front) Section ................................................... 33
7-3. Chassis
7-3. Chassis
(Main)
Section
................................................... 34
7-4. Cabinet (Upper) Section ................................................. 35
7-5. CD
7-5. CD
Lid
Section
............................................................... 36
7-6. Optical Pick-up Block Section (KSM-900AAA) ........... 37
7-7. Cabinet (Rear) Section .................................................... 38
7-7. Cabinet (Rear) Section .................................................... 38
8.
ELECTRICAL PARTS LIST
.............................. 39
TABLE OF CONTENTS
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
About CD-Rs/CD-RWs
This unit is compatible with CD-Rs/CD-RWs but playback capa-
bility may vary depending on the quality of the disc,the recording
device and application software
This unit is compatible with CD-Rs/CD-RWs but playback capa-
bility may vary depending on the quality of the disc,the recording
device and application software
ICF-CD73W
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S701. (push switch type)
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
1. Open the lid.
2. Push the S551 as shown in Fig.1.
3. Press the [CD
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S701. (push switch type)
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
1. Open the lid.
2. Push the S551 as shown in Fig.1.
3. Press the [CD
u
] button.
4. Check the object lens for confi rming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.
power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 2
times along with inward motion for the focus search.
times along with inward motion for the focus search.
S551
Fig.1 Method to push the S551
NOTES ON EXCHANGING THE FLEXIBLE FLAT CA-
BLE (13 CORE)
When the fl exible fl at cable which has connected the LCD board
(CNP402) and CD board (CNP702) is exchanged, please attach to
a set according to the following after bending.
BLE (13 CORE)
When the fl exible fl at cable which has connected the LCD board
(CNP402) and CD board (CNP702) is exchanged, please attach to
a set according to the following after bending.
Turn the character side up and bend in the direction
(back side) of A from an end in the position of about 9mm.
back side
character side
character side
character side
Bend in the direction of B from an end in the position
of about 70mm.
Attach in a set.
LCD board
(CNP402)
(CNP402)
CD board
(CNP702)
(CNP702)
± 9mm
± 70mm
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ICF-CD73W
4
INSTRUCTION OF POSITION IN WHICH ADHESIVE AGENT IS PAINTED
Some places must be applied with an adhesive agent when the set was disassembled or parts were replaced.
Apply an adhesive agent in accordance with respective fi gures.
Some places must be applied with an adhesive agent when the set was disassembled or parts were replaced.
Apply an adhesive agent in accordance with respective fi gures.
Part of Adhesive agent: 7-600-006-17 ADHESIVE AGENT (TSE3975C) 100G
adhesive agent
– CABINET (REAR) SECTION –
– BATTERY CASE LID –
– CD LID –
cover (DC)
sheet (buckle)
cabinet (rear)
cabinet (rear)
cabinet (rear)
cabinet (rear)
cover (DC): protrusion
Apply along the groove.
Apply along the groove.
– SECTIONAL VIEW –
– CABINET (REAR): INSIDE –
Note: Attach the sheet (buckle) and cover (DC) to the cabinet (rear), and then apply an adhesive agent.
Note: Do not apply an adhesive agent
except the specified range.
Note: Apply an adhesive agent before attaching the packing (battery) to the battery case lid.
Note: Apply an adhesive agent before attaching the packing (CD) to the CD lid.
adhesive agent
hole
battery case lid
battery case lid
packing (battery)
packing (CD)
CD lid
CD lid
Apply so as to be flush
with this surface.
with this surface.