Read Sony ICF-B01 (serv.man2) Service Manual online
2
TABLE OF CONTENTS
1. GENERAL
Location of Controls ................................................................ 3
2. SERVICE NOTE
................................................................ 5
3. DISASSEMBLY
3-1. Window (Diffusion) ............................................................ 7
3-2. Panel (L) Assy ..................................................................... 8
3-3. Panel (R) .............................................................................. 8
3-4. Cabinet (Rear) Section ........................................................ 9
3-5. DYNAMO Assy (M1) ......................................................... 9
3-6. Main Board Section .......................................................... 10
3-7. JACK Board ...................................................................... 10
3-8. MAIN Board, LED Board ................................................. 11
3-9. Pointer Setting ................................................................... 11
3-2. Panel (L) Assy ..................................................................... 8
3-3. Panel (R) .............................................................................. 8
3-4. Cabinet (Rear) Section ........................................................ 9
3-5. DYNAMO Assy (M1) ......................................................... 9
3-6. Main Board Section .......................................................... 10
3-7. JACK Board ...................................................................... 10
3-8. MAIN Board, LED Board ................................................. 11
3-9. Pointer Setting ................................................................... 11
4. ELECTRICAL ADJUSTMENTS
................................. 12
5. DIAGRAMS
5-1. Printed Wiring Boards — Main Section — ...................... 14
5-2. Printed Wiring Board — Sub Section — .......................... 15
5-3. Schematic Diagram ........................................................... 16
5-2. Printed Wiring Board — Sub Section — .......................... 15
5-3. Schematic Diagram ........................................................... 16
6. EXPLODED VIEWS
6-1. Main Section ..................................................................... 18
6-2. Cabinet (Front) Section ..................................................... 19
6-3. Cabinet (Rear) Section ...................................................... 20
6-4. Main Board Section .......................................................... 21
6-2. Cabinet (Front) Section ..................................................... 19
6-3. Cabinet (Rear) Section ...................................................... 20
6-4. Main Board Section .......................................................... 21
7. ELECTRICAL PARTS LIST
........................................ 22
ICF-B01
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
HOW TO CHANGE THE CERAMIC FILTERS
This model is used two ceramic filters of CF2 and CF3.
You must use same type of color marked ceramic filters in order to
meet same specifications.
Therefore, the ceramic filter must change two pieces together since
it’s supply two pieces in one package as a spare parts.
You must use same type of color marked ceramic filters in order to
meet same specifications.
Therefore, the ceramic filter must change two pieces together since
it’s supply two pieces in one package as a spare parts.
mark1
mark2
Center
Frequency
Frequency
red
10.70 MHz
blue
10.67 MHz
orange
10.73 MHz
black
10.64 MHz
white
10.76 MHz
white
white
10.75 MHz
yellow
10.79 MHz
mark1 mark2
mark1 mark2
CF2
CF3
Click on the first or last page to see other ICF-B01 (serv.man2) service manuals if exist.