ICD-UX200, ICD-UX200F, ICD-UX300, ICD-UX300F, ICD-UX400F - Sony Audio Service Manual (repair manual)

2010C04-1

© 

2010.03

Photo: ICD-UX400F

Capacity (User available capacity)
ICD-UX200/UX200F:
 

2 GB (approx. 1.79 GB =1,928,822,784 Byte)

ICD-UX300/UX300F:
 

4 GB (approx. 3.59 GB =3,860,922,368 Byte)

ICD-UX400F:
 

8 GB (approx. 7.19 GB =7,725,416,448 Byte)

A part of the memory capacity is used as a
management area.

Maximum recording time*

*

ST mode

STSP mode

STLP mode

22 hr. 15 min.

33 hr. 25 min.

89 hr. 15 min.

SP mode

LP mode

133 hr. 55 min. 535 hr. 45 min.

ST mode

STSP mode

STLP mode

44 hr. 40 min.

67 hr. 

178 hr. 40 min.

SP mode

LP mode

268 hr. 5 min.

1,072 hr. 25 min.

ST mode

STSP mode

STLP mode

89 hr. 20 min.

134 hr. 5 min.

357 hr. 35 min.

SP mode

LP mode

536 hr. 25 min. 2,145 hr. 55 min.

 

 

(hr. : hours/min. : minutes)

*

1

 When you are going to record continuously

  for a long time, you may have to replace
  the battery with a new one in the midst of
 recording.

*

2

 The maximum recording time varies if you re-

cord messages in mixed recording mode.

z

  ST : 40 Hz - 20,000 Hz

z

  STSP : 40 Hz - 15,000 Hz

z

  STLP : 60 Hz - 7,500 Hz

z

  SP : 60 Hz - 10,000 Hz

z

  LP : 60 Hz - 3,400 Hz

Bit rates and sampling frequencies for
MP3 fi les*

Bit rate: 32 - 320 kbps, VBR
Sampling frequencies: 16/22.05/24/32/44.1/
48 kHz

*

3

 The playback of MP3 fi les recorded using the

  IC recorder is also supported.
  Not all encoders are supported.

Bit rate and sampling frequencies*

WMA fi les
Bit rate: 32 - 192 kbps*

5

, VBR

Sampling frequencies: 44.1 kHz

*

4

 WMA Ver. 8 Class2A is compatible, however,

  MBR (Multi Bit Rate), Lossless, Professional,
  and Voice are not supported.
  This IC recorder cannot play back DRM pro-

tected contents. Not all encoders are supported.

*

5

 The NoiseSubstitution function is not

  supported, therefore, playback becomes
  simple playback with 32 kbps bit rate.
  Bit rate and sampling frequencies for AAC-LC 

fi les*

6

  Bit rate: 16 kbps - 320 kbps,VBR
  Sampling frequencies: 11.025/12/16/22.05/24/

32/44.1/48 kHz

*

6

 Not all encoders are supported.

Frequency range
87.50 - 108.00 MHz
IF 150 kHz

Antenna
Stereo headphone cord antenna

Speaker
Approx. 16 mm (

21/32

 in) dia.

z

  Microphone jack (minijack, stereo)

–  input for plug in power, minimum input
  level 0.9 mV, 3 kilohms or lower impedance 
 microphone

z

  Headphone jack (minijack, stereo)

–  output for 8 - 300 ohms headphones

z

 USB connector

–  High-Speed USB compatible

Playback speed control (DPC)
+100% to –50% (MP3)
0% to –50% (WMA/AAC-LC)

Power output
90 mW

– Continued on next page –

Note:
Be sure to keep your PC used for service and 
checking of this unit always updated with the 
latest version of your anti-virus software.
In case a virus affected unit was found during 
service, contact your Service Headquarters. 

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

Power requirements
One NH-AAA rechargeable battery (supplied):
1.2 V DC
One LR03 (size AAA) alkaline battery (not
supplied): 1.5 V DC

Operating temperature
5˚C - 35˚C

Dimensions (w/h/d) (not incl.
projecting parts and controls) (JEITA)*

36.6 

× 98.5 × 14.6 mm

(1 

1/2

 in. 

× 4 in. × 

19/32

 in.)

Mass (JEITA)*

Approx. 58 g (2 oz) including NH-AAA rechargeable 
battery

*

6

 Measured value by the standard of JEITA

  (Japan Electronics and Information
 Technology 

Industries 

Association)

Design and specifi cations are subject to
change without notice.

NOTE  FOR  REPLACEMENT  OF THE MAIN  BOARD
When the main substrates are exchanged, it is necessary to write 
the fi rmware newly.
Refer to each service headquarters about details.

Remove the film on the display window 
before you use the IC recorder.

If the IC recorder cannot be connected to a
computer directly, use the supplied USB
connection support cable. 

1-1. Front 

Case 

Assy 

..............................................................   4

1-2. SW 

Board 

........................................................................   5

1-3. LCD 

Assy 

........................................................................   5

1-4. Main 

Board 

.....................................................................   6

1-5. USB 

Assy 

........................................................................   6

1-6. USB 

Board 

Assy 

.............................................................   7

1-7. USB 

Board 

......................................................................   7

TEST  MODE 

 ............................................................   8

3-1.  Block Diagram –Main Section– .....................................   11
3-2.  Block Diagram –Power/Display Section– ......................   12
3-3.  Printed Wiring Board –Main Section (1/2)– ...................   13
3-4.  Printed Wiring Board –Main Section (2/2) .....................   14
3-5.  Schematic Diagram –Main Section (1/5)– ......................   15
3-6.  Schematic Diagram –Main Section (2/5)– ......................   16
3-7.  Schematic Diagram –Main Section (3/5)– ......................   17
3-8.  Schematic Diagram –Main Section (4/5)– ......................   18
3-9.  Schematic Diagram –Main Section (5/5)– ......................   19
3-10.  Printed Wiring Board –SW/USB Section– .....................   20
3-11.  Schematic Diagram –SW/USB Section– ........................   21

4-1.  Front Case Section ..........................................................   32
4-2. LCD 

Assy 

Section 

...........................................................  33

4-3.  Main Board Section ........................................................   34
4-4.  USB Board Section .........................................................   35
4-5.  Rear Case Section ...........................................................   36

  ..............................   37

•  This set can be disassembled in the order shown below.

Note: Follow the disassembly procedure in the numerical order given.

3 screw

4 screw

5 claw

6 claw

9 claw

0 claw

qa claw

qs claw

7 two claws

8 two claws

qd front case assy

1

2 battery lid