ICD-SX750, ICD-SX750D, ICD-SX850, ICD-SX850D, ICD-SX950 - Sony Audio Service Manual (repair manual)

2010A04-1

© 

2010.01

Note:
Be sure to keep your PC used for service and 
checking of this unit always updated with the 
latest version of your anti-virus software.
In case a virus affected unit was found during 
service, contact your Service Headquarters. 

Capacity (User available capacity)
ICD-SX750/SX750D: 2 GB
(approx. 1.9GB = 2,047,737,856 Byte)
ICD-SX850/SX850D: 4 GB
(approx. 3.82 GB = 4,108,156,928 Byte)
ICD-SX950: 8 GB
(approx. 7.66 GB = 8,234,827,776 Byte)
A part of the memory capacity is used as a
management area.

Maximum recording time
When all messages are recorded with
the same recording mode, the maximum
recording time of all the folders is as
follows.

ICD-SX750/SX750D
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
3 hr. 10 min.

6 hr. 25 min.

23 hr. 35 min.

35 hr. 25 min.

94 hr. 40 min.

34 hr. 55 min.

92 hr. 15 min.

177 hr. 40 min.

281 hr. 20 min.

LPEC LP mode
750 hr. 15 min.

ICD-SX850/SX850D
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
6 hr. 25 min.

12 hr. 50 min.

47 hr. 30 min.

71 hr. 15 min.

190 hr. 5 min.

70 hr. 10 min.

185 hr. 20 min.

356 hr. 45 min.

564 hr. 40 min.

LPEC LP mode
1,505 hr. 55 min.

Photo: ICD-SX750

ICD-SX950
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
12 hr. 55 min.

25 hr. 50 min.

95 hr. 15 min.

142 hr. 50 min.

381 hr. 5 min.

140 hr. 45 min.

371 hr. 35 min.

715 hr. 20 min.

1,132 hr. 15 min.

LPEC LP mode
3,019 hr. 25 min.

(hr. : hours/min. : minutes)

Frequency range
•  LPCM 44/16: 50 - 20,000 Hz
•  LPCM 22/16: 50 - 10,000 Hz
•  MP3 192k: 50 - 16,000 Hz
•  MP3 128 k: 50 - 16,000 Hz
•  MP3 48 k: 50 - 14,000 Hz
•  LPEC STHQ: 50 - 20,000 Hz
•  LPEC ST: 50 - 16,500 Hz
•  LPEC STLP: 50 - 7,000 Hz
•  LPEC SP: 50 - 6,000 Hz
•  LPEC LP: 50 - 3,500 Hz

Bit rates and sampling frequencies for
MP3 fi les*

2

Bit rate: 32 - 320 kbps, VBR
Sampling frequencies: 16/22.05/24/32/44.1/
48 kHz

*

2

  The playback of MP3 fi les recorded using 

 

the IC recorder is also supported.

 

Not all encoders are supported.

Bit rate and sampling frequencies*

3

WMA fi les
Bit rate: 32 - 192 kbps, VBR
Sampling frequencies: 44.1 kHz

*

3

  WMA Ver. 9 is compatible, however, MBR

 

(Multi Bit Rate), Lossless, Professional, and

 

Voice are not supported.

 A 

fi le of which copyright is protected cannot

 

be played back.

 

Not all encoders are supported.

Speaker
Approx. 16 mm dia.

Power output
150 mW

Input/Output
•  Microphone jack (minijack, stereo)
  – input for plug in power, minimum input
    level 0.9 mV, 3 kilohms or lower impedance
  microphone
•  Headphone jack (minijack, stereo)
  – output for 8 - 300 ohms headphones
• USB connector
  – High-Speed USB compatible

Playback speed control (DPC)
–75% to +200%

– Continued on next page –

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

Power requirements
Two LR03 (size AAA) alkaline batteries (not supplied): 3.0 V DC
Two NH-AAA rechargeable batteries (supplied): 2.4 V DC

Operating temperature
5 ˚C - 35 ˚C 

Dimensions (w/h/d) (not incl.
projecting parts and controls) (JEITA)*

4

31.3 

× 130.0 × 15.4 mm 

Mass (JEITA)*

4

Approx. 77 g including NH-AAA rechargeable batteries

*

4

  Measured value by the standard of JEITA

  (Japan Electronics and Information
 Technology 

Industries 

Association)

Supplied accessories
IC Recorder (1)
 Remove 

the 

fi lm on the display window

  before you use the IC recorder.
LR03 (size AAA) alkaline batteries (2) or
NH-AAA (size AAA) rechargeable batteries (2)
Stereo headphones* (1) (Except AEP model)
Wind Screen (1)
Use this to cover the built-in microphones.
USB connecting cable (1)
Application Software, Digital Voice Editor (CD-ROM)
Application Software, Sound Forge Audio Studio LE (CD-ROM)*
(SX750: US, Canadian model/SX850: AEP model)
Application Software, Dragon Naturally Speaking (DVD-ROM)*
(SX750D/SX850D)
Cradle* (1) (SX750D/SX850D)
Stand (1) 
Carrying pouch (1)
Telephone recording microphone* (1) (E, Chinese, Korea, Taiwan model)
Battery case* (Except SX750: US, Canadian, Latin American model)
Operating Instructions

* The stereo headphones, the cradle , the battery case and

 the microphone, and some of the software are supplied with some models           
in some regions only.

Design and specifi cations are subject to change without notice.

CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

1-1.   Speaker Assy (SP001) .....................................................   5
1-2.   Battery Case Lid Assy .....................................................   5
1-3.   Case Assy ........................................................................   6
1-4.  Audio Board Section, Chassis Section, Switch Board ....   6
1-5. Main 

Board 

.....................................................................   7

1-6.  Liquid Crystal Display Panel (LCD101) ........................   7
1-7. Audio 

Board 

....................................................................   8

1-8. Jack 

Board 

.......................................................................   8

1-9.  Microphone Cap, Microphone Holder ............................   9
1-10.  MIC101, MIC102, MIC103 ............................................   9

TEST  MODE 

 ............................................................   10

3-1.  Block Diagram –Main1 Section– ...................................   13
3-2.  Block Diagram –Main2 Section– ...................................   14
3-3.  Printed Wiring Board –Audio Section (1/2)– .................   16
3-4.  Printed Wiring Board –Audio Section (2/2)– .................   17
3-5.  Schematic Diagram –Audio Section (1/2)– ....................   18
3-6.  Schematic Diagram –Audio Section (2/2)– ....................   19
3-7.  Printed Wiring Board –Main Section (1/2)– ...................   20
3-8.  Printed Wiring Board –Main Section (2/2)– ...................   21
3-9.  Schematic Diagram –Main Section (1/5)– ......................   22
3-10.  Schematic Diagram –Main Section (2/5)– ......................   23
3-11.  Schematic Diagram –Main Section (3/5)– ......................   24
3-12.  Schematic Diagram –Main Section (4/5)– ......................   25
3-13.  Schematic Diagram –Main Section (5/5)– ......................   26
3-14.  Printed Wiring Boards –Function Section– ....................   27
3-15.  Schematic Diagram –Function Section– .........................   28

4-1. Case 

Section 

....................................................................  41

4-2. Chassis 

Section 

...............................................................  42

4-3. Microphone 

Section 

........................................................  43

  ..............................   44

•  This set can be disassembled in the order shown below.