ICD-SX712, ICD-SX713, ICD-SX813 - Sony Audio Service Manual (repair manual). Page 3

1-1.   Case (Rear) Assy .............................................................   5
1-2.   Panel (Front) Assy ..........................................................   5
1-3.   Sheet Switch ...................................................................   6
1-4.  Liquid Crystal Display Panel (LCD101) ........................   6
1-5.  Audio Board, LED Board ...............................................   7
1-6. Mic 

Sub 

Assy 

..................................................................   7

1-7. System 

Board 

..................................................................   8

1-8. SP001 

..............................................................................   8

1-9. Ornament 

(Mic) 

..............................................................   9

1-10. Cap (Mic) ........................................................................   9
1-11.  Cover (Mic) (Rear) .........................................................   10
1-12.  Cover (Mic) (Front) ........................................................   10
1-13.  Microphone Assy (MIC101, MIC102) ...........................   11

TEST  MODE 

 ............................................................   12

3-1.  Block Diagram –Audio Section– ....................................   17
3-2.  Block Diagram –Digital Section– ...................................   18
3-3.  Block Diagram –Display Section– .................................   19
3-4.  Schematic Diagram –Audio Section (1/3)– ....................   21
3-5.  Schematic Diagram –Audio Section (2/3)– ....................   22
3-6.  Schematic Diagram –Audio Section (3/3)– ....................   23
3-7.  Printed Wiring Boards –Audio Section (1/2)– ................   24
3-8.  Printed Wiring Board –Audio Section (2/2)– .................   25
3-9.  Printed Wiring Board –System Section (1/2)– ...............   26
3-10.  Printed Wiring Board –System Section (2/2)– ...............   27
3-11.  Schematic Diagram –System Section (1/6)– ..................   28
3-12.  Schematic Diagram –System Section (2/6)– ..................   29
3-13.  Schematic Diagram –System Section (3/6)– ..................   30
3-14.  Schematic Diagram –System Section (4/6)– ..................   31
3-15.  Schematic Diagram –System Section (5/6)– ..................   32
3-16.  Schematic Diagram –System Section (6/6)– ..................   33

4-1.  Panel (Front) Section ......................................................   53
4-2.  Case (Rear) Section ........................................................   54
4-3. LCD 

Section 

...................................................................  55

4-4. Chassis 

Section 

...............................................................  56

4-5. Mic 

Section 

.....................................................................  57

  ..............................   58

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

CAUTION
Risk of explosion if battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions of batter-
ies.