ICD-SX57, ICD-SX57DR9, ICD-SX67, ICD-SX67DR9, ICD-SX77 - Sony Audio Service Manual (repair manual). Page 2

  ..................................................................   3

2-1. Disassembly 

Flow 

...........................................................   5

2-2.  Knob (HOLD), Speaker Assy (SP001) ...........................   6
2-3.  Chassis Assy, Case Assy .................................................   6
2-4.  Battery Case Lid .............................................................   7
2-5.  Cover (Chassis), MAIN Board .......................................   7
2-6. Chassis 

............................................................................   8

2-7.  SW Board, HPJACK Board ............................................   8
2-8.  MIC-A Assy, MIC-B Assy ..............................................   9
2-9.  Liquid Crystal Display Panel, AUDIO Board ................   9

TEST  MODE 

 ............................................................   10

4-1.  Block Diagram  - MAIN1 Section - ................................   13
4-2.  Block Diagram  - MAIN2 Section - ................................   14
4-3.  Printed Wiring Board  - AUDIO Board (Side A) - .........   15
4-4.  Printed Wiring Board  - AUDIO Board (Side B) - .........   16
4-5.  Schematic Diagram  - AUDIO Board (1/2) - ..................   17
4-6.  Schematic Diagram  - AUDIO Board (2/2) - ..................   18
4-7.  Printed Wiring Board  - MAIN Board (Side A) - ...........   19
4-8.  Printed Wiring Board  - MAIN Board (Side B) - ...........   20
4-9.  Schematic Diagram  - MAIN Board (1/5) - ....................   21
4-10.  Schematic Diagram  - MAIN Board (2/5) - ....................   22
4-11.  Schematic Diagram  - MAIN Board (3/5) - ....................   23
4-12.  Schematic Diagram  - MAIN Board (4/5) - ....................   24
4-13.  Schematic Diagram  - MAIN Board (5/5) - ....................   25
4-14.  Printed Wiring Boards  - HPJACK Board, SW Board - .   26
4-15.  Schematic Diagram  - HPJACK Board, SW Board - ......   27

5-1. Overall 

Assy 

....................................................................  38

5-2. Chassis 

Section 

...............................................................  39

  ..............................   40

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•   Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

•   Strong viscosity
 

Unleaded solder is more viscou-s (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•   Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Notes on chip component replacement
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Flexible Circuit Board Repairing
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

Microsoft, Windows, Outlook, DirectX are registered
trademarks or trademarks of the Microsoft
Corporation in the United States and/or other 
countries.
Apple and Macintosh are trademarks of Apple 
Computer Inc., registered in the USA and other 
countries.
Pentium is a registered trademark of Intel
Corporation.
Intel Core is a trademark or a registered trademark
of Intel Corporation.
Dragon Speech, Dragon NaturallySpeaking are
trademarks owned by Nuance Communications,
Inc. and are registered in the United States and/or 
other countries.
MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and Thomson.
Sonic, Sonic Solution, and Roxio® Powered are
trademarks of Sonic Solutions.

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