ICD-SX20, ICD-SX30, ICD-SX40 - Sony Audio Service Manual (repair manual). Page 2

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• Keep the temperature of the soldering iron around 270°C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

✩

Replacement of IC6001 used in this set requires a special tool.

•

The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conven-
tional IC.

•

Lead layouts

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

·········································································· 3

2-1. Cover (jack) ·································································· 4
2-2. Case Block Assy ··························································· 5
2-3. Ornamental Belt Block Assy, SW Board ······················ 6
2-4. AUDIO Board, Microphone Unit (mic2/3) ·················· 7
2-5. Cover (chassis) Block Assy ·········································· 7
2-6. MAIN Board, Liquid Crystal Display Panel ················ 8

······································································ 9

······································································ 12

4-1. Block Diagrams

– MAIN Section -1 – ·················································· 13
– MAIN Section -2 – ·················································· 14
– PANEL Section – ····················································· 15

4-2. Printed Wiring Board – MAIN Board – ····················· 16
4-3. Schematic Diagram – MAIN Board (1/2) – ··············· 17
4-4. Schematic Diagram – MAIN Board (2/2) – ··············· 18
4-5. Printed Wiring Board – AUDIO Board – ···················· 19
4-6. Schematic Diagram – AUDIO Board (1/2) – ·············· 20
4-7. Schematic Diagram – AUDIO Board (2/2) – ·············· 21
4-8. Printed Wiring Board – SW Board – ·························· 22
4-9. Schematic Diagram – SW Board – ····························· 23
4-10. IC Pin Function Descriptions ······································ 27

5-1. Case Block ·································································· 32
5-2. Chassis Block ······························································ 33

······································· 34

surface

Lead layout of

conventional IC

CSP (chip size package)