Read Sony ICD-ST30 Service Manual online
11
11
ICD-ST30
SECTION 4
DIAGRAMS
Note on Schematic Diagrams:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
• Power voltage is dc 3V and fed with regulated dc power
supply from DC IN jack (J5001).
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : PB
[
no mark : PB
[
] : REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PB
L
: REC
✩
Replacement of IC6001 used in this set requires a spe-
cial tool.
cial tool.
•
The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
cannot be measured, because its lead layout is different
from that of conventional IC.
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(SIDE B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
•
MAIN board is multi-layer printed board. However, the
patterns of intermediate-layer have not been included in
the diagram.
patterns of intermediate-layer have not been included in
the diagram.
✩
Replacement of IC6001 used in this set requires a spe-
cial tool.
cial tool.
•
Lead layouts
• WAVEFORMS
surface
Lead layout of
conventional IC
CSP (chip size package)
1
IC6003
3
(XXT)
2
IC6003
1
(FOUT)
3
IC3004
6
(MCLK)
4
IC7003
<z/,
(XTAL)
5
IC8001
qd
(X OUT)
(When the USB is connected)
6
IC7004
5
(FOUT)
1 V/DIV, 40 ns/DIV
3.3 Vp-p
88.5 ns
1 V/DIV, 40 ns/DIV
88.5 ns
4.1 Vp-p
1 V/DIV, 40 ns/DIV
88.5 ns
4.1 Vp-p
1 V/DIV, 100 ns/DIV
3.4 Vp-p
244 ns
1 V/DIV, 40 ns/DIV
3.7 Vp-p
8.33 ns
1 V/DIV, 10
µ
s/DIV
30.5 ns
3.2 Vp-p
Note on Printed Wiring Boards:
• Y
: parts extracted from the conductor side.
• b
: Pattern from the side which enables seeing.
The other layers’ patterns are not indicated.
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