ICD-ST10, ICD-ST20 - Sony Audio Service Manual (repair manual). Page 2

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• Keep the temperature of the soldering iron around 270°C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

✩

Replacement of IC6001 used in this set requires a special tool.

•

The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conven-
tional IC.

•

Lead layouts

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

surface

Lead layout of

conventional IC

CSP (chip size package)

·········································································· 3

2-1. Upper Lid Block Assembly ·········································· 4
2-2. F-SW Board ·································································· 5
2-3. MAIN Board ································································· 5
2-4. S-SW Board, Microphone Block Assembly ················· 6
2-5. Microphone Unit ··························································· 6
2-6. The Cautions at the Time of a Microphone Block

Assembly ······································································ 7

······································································ 8

······································································ 11

4-1. Block Diagrams

– Main Section-1 – ······················································ 12
– Main Section-2 – ······················································ 13
– Panel/Power Section – ············································· 14

4-2. Printed Wiring Board – MAIN Board (Side A) – ······· 15
4-3. Printed Wiring Board – MAIN Board (Side B) – ······· 16
4-4. Printed Wiring Board – F-SW Board – ······················· 17
4-5. Printed Wiring Board – S-SW Board – ······················· 18
4-6. Schematic Diagram – MAIN Board (1/5) – ··············· 19
4-7. Schematic Diagram – MAIN Board (2/5) – ··············· 20
4-8. Schematic Diagram – MAIN Board (3/5) – ··············· 21
4-9. Schematic Diagram – MAIN Board (4/5) – ··············· 22
4-10. Schematic Diagram – MAIN Board (5/5) – ··············· 23
4-11. IC Block Diagrams ····················································· 24
4-12. IC Pin Function Descriptions ······································ 27

5-1. Upper Lid Block ························································· 32
5-2. Case Block ·································································· 33

······································· 34