ICD-P28 - Sony Audio Service Manual (repair manual)

1

US Model

Canadian Model

 AEP Model

 Tourist Model

Korean Model

Chinese Model

Recording media

Built-in flash memory, Monaural recording

Recording time

SP: 9 hours 40 minutes
LP: 15 hours 45 minutes

Frequency response

180 Hz - 3,500 Hz

Speaker

approx. 3.2 cm (1 

5/16

 in.) dia.

Power output

250 mW

Input/Output

• Earphone jack (minijack) for 8 - 300 ohms

ear receiver/headphones

• Microphone jack (minijack, monaural)

Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone

Power requirements

Two LR03 (size AAA) alkaline batteries: 3 V DC

Dimensions (w/h/d) (not incl. projecting parts and controls)

44.5 

×

 105.3 

×

 14.0 mm (1 

13/16

 

×

 4 

1/4

 

×

 

9/16

 in.)

Mass (incl. batteries)

71 g (2.5 oz)

Supplied accessories

LR03 (size AAA) alkaline batteries (2) (For the
US only)
USB connecting cable (1)
Application software (CD-ROM) (1)

Design and specifications are subject to change without notice.

2004D04-1

© 2004. 04

2

................................................................ 3

Index to Parts and Controls ..................................................... 4

3-1.   Case (Upper) Assy .............................................................. 5
3-2.   F-SW Board, P-SW Board .................................................. 6
3-3.   Main Board ......................................................................... 6
3-4.   PC Board ............................................................................. 7

....................................................................... 8

5-1.   IC Pin Description ............................................................. 11
5-2.   Block Diagram .................................................................. 13
5-3.   Printed Wiring Board – Main Section – ............................ 15
5-4.   Printed Wiring Board – F-SW Section – ........................... 16
5-5.   Printed Wiring Board – P-SW, PC Section – .................... 17
5-6.   Schematic Diagram – Main Section (1/2) – ...................... 18
5-7.   Schematic Diagram – Main Section (2/2) – ...................... 19
5-8.   IC Block Diagrams ............................................................ 20

6-1.   Case Section ...................................................................... 21
6-2.   Main Board Section .......................................................... 22

........................................ 23

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°

C higher than

ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350

°

C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

3

[Precaution when the flash memory (IC701) is replaced]
When the flash memory (IC701) is replaced, be sure to perform the
BAD BLOCK check* and writing of the model code. If they are not
completed, the unit will not operate normally.

   * BAD BLOCK check is to check the flash ROM memory

area (the BAD BLOCK area) where data cannot be
guaranteed. The resultant information of this check is stored
in the TOC-AREA so that the BAD BLOCK area should
not be used.

[BAD BLOCK Check Procedure]
1. When the power is turned on after the flash memory (IC701) is

replaced, the BAD BLOCK check starts automatically and the
 OPR  (D701) lights in orange.

2. In about 30 seconds after start of the check, the  OPR  (D701)

changes the color to green indicating that the check is
completed.

R101

R110

51

50

30

31

TP719

TP101

TP102

TP718

TP714 TP715

R717

D701

RED

(REC)

D701

OPR

GRN

(PLAY)

Q701

R716

FB103

FB102

R133

X101

C106
C105

C114
R104

C116

C111

R135

C107

R105

C101

FB101

FB104

R102

R103

R128

C112

C110

C102

C104

C125

B  E  B 

C     C 

MAIN BOARD   (SIDE B)

4

This section is extracted
from instruction manual.

MIC jack
(PLUG IN  POWER)

EAR (earphone) jack

OPR (operation) indicator

zREC (record)  /STOP

X PAUSE

– ./ >+ SELECT
(ENTER)

NxPLAY/STOP
(ENTER)

HOLD

VOL (volume)

USB connector

Battery
compartment

Hook for handstrap
(not supplied)

Remaining battery
indicator

Recording mode
indication

REC (recording)
indicator

Selected message
number/number of
messages in a folder

Counter /Remaining  time indication  /Recording  date and
time indication  /Current  time indication  (15:30, etc.) /Menu
indication (ALARM, BEEP, etc.) /Mode  indication of the
menu (ON, OFF, etc.) /Messages (ERASE, HOLD, etc.)

MIC

(built-in microphone)

Display window

FOLDER

DIVIDE

DISPLAY

MIC SENS

(microphone sensitivity)

MENU

ERASE

Speaker

STOP

Remaining memory indicator

Folder indication

Alarm indicator

Microphone sensitivity indication

Repeat play indicator