Read Sony ICD-P110VTP Service Manual online
2
ICD-P110VTP
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
TABLE OF CONTENTS
1.
SERVICE NOTE
........................................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
3-1.
Case (Front) Assy ............................................................
5
3-2.
SW Board, MAIN Board .................................................
6
3-3.
AUDIO Board ..................................................................
6
4.
SERVICE MODE
.......................................................
7
5.
DIAGRAMS
5-1.
Block Diagram ................................................................ 15
5-2.
Printed Wiring Board – AUDIO Section – ..................... 17
5-3.
Schematic Diagram – AUDIO Section – ........................ 18
5-4.
Printed Wiring Board – MAIN Section – ....................... 19
5-5.
Printed Wiring Board – SW Section – ............................ 20
5-6.
Schematic Diagram – MAIN/SW Section – ................... 21
6.
EXPLODED VIEWS
6-1.
Case (Front) Section ........................................................ 25
6-2.
Case (Rear) Section ......................................................... 26
7.
ELECTRICAL PARTS LIST
.................................. 27
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