ICD-MS1 (serv.man3) - Sony Audio Service Manual (repair manual). Page 2

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2
ICD-MS1
1.
DIAGRAMS
1-1.
NOTE  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS
Note on Printed Wiring Boards:
X
: parts extracted from the component side.
Y
: parts extracted from the conductor side.
z
: Through hole.
f
: internal component.
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• MAIN and AUDIO boards is six-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in this diagrams.
• Lead Layouts
surface
Lead layout of conventional IC
CSP (chip size package)
*
Replacement of IC722 used in this set requires a
special tool.
Note on Schematic Diagram:
• All capacitors are in 
µ
F unless otherwise noted.  pF: 
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
C
: panel designation.
A
: B+ Line.
• Power voltage is dc 3 V and fed with regulated dc power
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY
(
) : REC
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PLAY
L
: REC
• The voltage and waveform of CSP (chip size package) can-
not be measured, because its lead layout is different form
that of conventional IC.
*
Replacement of IC722 used in this set requires a
special tool.
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