ICD-BX800 - Sony Audio Service Manual (repair manual). Page 12

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ICD-BX800
ICD-BX800
12
12
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
•  X : Parts extracted from the component side.
•      f  : Internal component.
• 
 : Pattern from the side which enables seeing.
  (The other layers’ patterns are not indicated.)
Caution:
Pattern face side: 
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen 
from the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.
•  Indication of transistor.
 
C
B
These are omitted. 
E
Q
• Lead layouts
surface 
CSP (Chip Size Package) 
Lead layout of conventional IC 
For Schematic Diagrams.
Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 
WV or less are not indicated except for electrolytics and 
tantalums.
•  All resistors are in Ω and 1/4 W or less unless otherwise 
specifi ed.
•      f  : Internal component.
•  C : Panel designation.
•  A : B+ Line.
•  Power voltage is dc 3V and fed with regulated dc power 
supply from battery terminal.
•  Voltages and waveforms are dc with respect to ground 
under no-signal (detuned) conditions.
  no mark : REC
  (         ) : PB
•  Voltages are taken with VOM (Input impedance 10 M
).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
• Signal path.
  E : 
PB
  a : 
REC
• Waveforms
– MAIN Board –
1
  IC4541 id (XOUT1)
0.2 V/DIV, 0.1 
Psec/DIV
2
  IC4541 ij (XIN32K)
0.1 V/DIV, 20 
Psec/DIV
32.768 kHz
0.4 Vp-p
12 MHz
0.6 Vp-p
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