ICD-BP220 - Sony Audio Service Manual (repair manual)

Model
ICD-BP220
Pages
29
Size
2.61 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
icd-bp220.pdf
Date

View Sony ICD-BP220 Service Manual online

ICD-BP220
Chinese Model
SERVICE MANUAL
IC RECORDER
SPECIFICATIONS
Ver 1.0  2001. 10
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-873-359-01
2001J1600-1
© 2001.10
Recording media
Built-in flash memory, Monaural recording
Recording time
SP:  262 minutes, LP: 698 minutes
Frequency response
SP: 250 Hz - 7,300 Hz
LP: 300 Hz - 3,500 Hz
Speaker
approx. 3.2 cm (1 
5
/
16 
 in.) dia.
Power output
300 mW
Input/Output
• Earphone jack (minijack) for 16 - 300 ohms
earphone/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
• USB connector
Playback speed control
FAST  +30%, SLOW  –15%
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5 
× 105.3 × 14.0 mm (1 
13
/
16
 
× 4 
1
/
4
 
×  
9
/
16  
in.)
Mass (incl. batteries)
79 g (2.79 oz)
Supplied accessories
Earphone 
× 1
Carrying case 
× 1
Connecting cable 
× 1
“Digital Voice Editor” (CD-ROM) 
× 1
Optional accessories
Electret Condenser Microphone ECM-Z60, ECM-
T15, ECM-T115
Earphone MDR-ED228LP, MDR-E818LP
Connecting cord RK-G64
Your dealer may not handle some of the above listed optional accessories. Please
ask the dealer for detailed information.
Design and specifications are subject to change without notice.
2
ICD-BP220
TABLE OF CONTENTS
1. GENERAL ·································································· 3
2. DISASSEMBLY
2-1. Sub Block Assy, Upper Lid ············································· 4
2-2. F-SW Board ···································································· 4
2-3. Main Board, P-SW Board ··············································· 5
2-4. PC Board ········································································· 5
3. DIAGRAMS
3-1. Block Diagram ································································ 7
3-2. Printed Wiring Board – Main Section (1/2) – ················· 8
3-3. Printed Wiring Board – Main Section (2/2) – ················· 9
3-4. Schematic Diagram – Main Section (1/3) – ·················· 10
3-5. Schematic Diagram – Main Section (2/3) – ·················· 11
3-6. Schematic Diagram – Main Section (3/3) – ·················· 12
3-7. Schematic Diagram – F-SW Section – ························· 13
3-8. Printed Wiring Board – F-SW Section (1/2) – ·············· 14
3-9. Printed Wiring Board – F-SW Section (2/2) – ·············· 15
3-10. Printed Wiring Board – PC Section – ························· 16
3-11. Schematic Diagram – PC Section – ···························· 17
3-12. Printed Wiring Board – P-SW Section – ···················· 18
3-13. Schematic Diagram – P-SW Section – ······················· 19
3-14. IC Block Diagrams ····················································· 20
3-15. IC Pin Function Description ······································· 21
4. EXPLODED VIEWS
4-1. Upper Lid Assy Section ················································ 23
4-2. Main Board Section ······················································ 24
5. ELECTRICAL PARTS LIST ·································· 25
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
*
Replacement of IC109 used in this set requires a special tool.
The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conven-
tional IC.
Lead layouts
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
surface
Lead layout of
conventional IC
CSP (chip size package)
3
ICD-BP220
SECTION 1
GENERAL
This section is extracted from
instruction manual.
1
MIC (built-in microphone)
(12)
2
Display window (64)
3
FOLDER button (12, 16)
4
INDEX/BOOKMARK
button (22, 26)
5
DISPLAY button (39)
6
A-B REPEAT/PRIORITY
button (23, 30)
7
MENU button (10, 32, 35, 40,
41)
8
ERASE button (20)
9
xSTOP button (13, 17)
q;
Speaker
qa
MIC (PLUG IN POWER)
jack (15)
qs
EAR (earphone) jack (14, 17)
qd
OPR (operation) indicator
(12, 17)
qf
zREC (record) /STOP
button (13, 24)
qg
X PAUSE button (13, 17)
qh
.REVIEW/>CUE (fast
backward, review/fast
forward, cue•selection of
menu mode) button  (10, 16,
18, 19, 22, 26, 30, 32, 35, 40,
41)
qj
NxPLAY/STOP
•EXECUTE (play/
stop•enter) button (10, 17,
18, 29, 30, 32, 35, 40, 41)
qk
HOLD switch (38)
ql
VOL (volume) control (17)
w;
USB connector for
connecting to a computer
(48)
qa
qs
qd
qf
qg
qh
qj
qk
ql
w;
q;
9
8
7
6
5
4
3
2
1
Main unit
Rear
wh
wg
wf
wa
ws
wd
wa
PLAY SPEED selector (18)
ws
MIC SENS (microphone
sensitivity) selector (14)
wd
VOR selector (15)
wf
Clip*
wg
Battery compartment (8)
wh
Hook for handstrap (not
supplied)
4
ICD-BP220
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1.
SUB BLOCK ASSY, UPPER LID
2-2.
F-SW BOARD
2
3
 F-SW board
1
 Connector (CN703)
Case assy
4
5
 Sub block assy, upper lid
1
 Screw (B1.7 
× 
10)
2
 Screw (B1.7 
×
 7)
3
 Remove two solderings
Case assy
Set
Sub block assy,upper lid
F-SW board
PC board
MAIN board, P-SW board
Note : Disassemble the unit in the order as shown below.
5
ICD-BP220
2-3.
MAIN BOARD, P-SW BOARD
2-4.
PC BOARD
3
4
 MAIN board
6
 P-SW board
5
 Remove seven solderings
1
 
Screw (1.7
 
×
 4)
Claw
Case assy
2
 Connector
     (CN802)
Claw
2
1
 Screw (1.7 
×
 4)
3
 PC board
Case assy
6
ICD-BP220
SECTION 3
DIAGRAMS
Note on Schematic Diagrams:
• All capacitors are in 
µ
F unless otherwise noted.  pF: 
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
C
: panel designation.
A
: B+ Line.
• Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : REC
(
) : PB
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: PB
a
: REC
*
Replacement of IC109 used in this set requires a special
tool.
The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
Note on Printed Wiring Boards:
• Y
: parts extracted from the conductor side.
• b
: Pattern from the side which enables seeing.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(SIDE B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
*
Replacement of IC109 used in this set requires a special
tool.
Lead layouts
• WAVEFORMS
1.3 Vp-p
4.096 MHz
1
 IC712 
od
 XTAL 
VOLT/DIV : 0.5 V AC
TIME/DIV : 50 nsec
0.8 Vp-p
3.2 Vp-p
32.768 kHz
2
 IC716 
8
 oscout
3
 IC508 
5
 EXT
VOLT/DIV : 0.2 V AC
TIME/DIV : 10 
µ
sec
VOLT/DIV : 1.0 V DC
TIME/DIV : 2 
µ
sec
3.3 
µ
s
surface
Lead layout of
conventional IC
CSP (chip size package)
7
7
ICD-BP220
3-1. BLOCK DIAGRAM
3
4
1
3
5
1
6
4
22
4
1
13
6
11
8
1
2
13
7
11
2
3
12
8
5
6
10
38
35
37
34
36
59
72
7
8
9
16
17
19
18
5
3
101
56
55
120
4
97
40
96
13
12
14
15
16
57
99
10
52
 50
49
95
53
47
48
100
29
31
33
27
28
42
43
55
58
64
62
61
59
18
28
56
20
21
8
27
29
69
68
67
9
4
14
15
9
6
3
3
1
6
7
6
1
58
11
36
4
3
2
35
37
41
1
98
74
7
6
1
46
2
51
86
90
1
1
92
93
13
15
20
17
8
9
10
11
54
ı
39
103
ı
118
59
62
ı
12
37
64
72
ı
75
81
ı
17
32
ı
29
32
ı
41
44
ı
9
8
VIN+
VIN-
VOUT
5
2
3
VIN
CE
VOUT
IC505
+2.9V REG
5
2
3
VIN
CE
VOUT
IC506
+2.9V REG
5
2
3
VIN
CE
VOUT
IC501
+3.1V REG
5
2
3
VIN
CE
VOUT
IC502
+3.3V REG
DC-DC
CONVERTER
(3.7V)
DC-DC
CONVERTER
(3.2V)
DC-DC
CONVERTER
SI
SO
SCLK
CE
INTR
32KOUT
S705 - 701
3
1
+
-
17
 • Signal Path
: PB
: REC
MIC101
J101
IC101
MIC AMP
Q101
MIC
SENSE
IC102
ALC AMP
IN
OUT
INPUT OUT1
IC103
VOR CONTROL
IC107
A/D, D/A CONVERTER
VIN
VOUT
PDWN
XTI
BCK
FS
DIN
DOUT
S101
VBUS1
D-
D+
ID
GND
1
2
3
4
5
USB
CN801
IC803, Q801
VOLTAGE
DETECTOR
Q802
SW
RESET
IC802
12
13
IC801
USB INTERFACE
USBDET
USB_D-
USB_D+
XEXTCAPON
XIN
XOUT
ZSI
ZSO
ZSCK
RST
FLMIO00
ı
FLMIO15
XFLMRB
XFLMRE
XFLMCE0
FLMCLE
FLMALE
XFLMWE
XFLMWP
ZIFREQ
ZIFACK
S702
VOR
S701
IC109
DSP
SCK1
SI1
SO1
SIEN1
SOEN1
P3
P2
SI2
SO2
SIEN2
SOEN2
SCK2
CLKIN
/RESET
IC105
IC106
IC712
SYSTEM CONTROL
IC104,  IC108
CLOCK GEN
CLKIN
CLKIN
CE
CE
Q0
Q0
IC706
FLASH MEMORY
Q702
+B
SW
ZVCC
Q705 - 706
WAKE UP
SW
IO1
ı
IO8
VCC
R/B
RE
CE
CLE
ALE
WE
WP
DSPIFREQ
DCOMDT
XDIFEN
SIN1
SOT1
SCK1
XVORIN
VBUSOFF
XZRST
FLMIO00
ı
FLMIO15
ZIFREQ
ZIFACK
FLMRB
XFLMRE
XFLMCE0
FLMCLE
FLMALE
XFLMWE
XFLMWP
FLMSEL
XVORSW
SPEED
WAKEUP
KEYPUP
KEYIN0
KEYIN1
HOLDSW
DSPSYSCK
DSPPWR
ADASYSCK
XDSPRST
DSPACK
SOT2
SIN2
SCK2
SIPCS
RTCCE
RTCINTR
SUBCLK
BATT
HPJACK
XHSTBY
XRESET
XTALIN
XTAL
COM0
COM3
SEG00
ı
SEG31
ı
X701
4.096MHz
LIQUID
CRYSTAL
DISPLAY
RESET
IC710
Q707
SW
IC716
REAL-TIME CLOCK
X702
32.768KHz
Q710
SW
IC715
SI/PO DRIVER
DATA
CLOCK
XFLMPWR
MICSENSE LMUTE
XSPPWR
XHPPWR
HPMUTE
XREDLED
XGRNLED
APOWER
ADAPWR
XLIGHT
XBATTEN
IC112
AMP
VIN- VOUT
Q106
LPF
SW
Q107, 108
LPF
SW
Q102
MUTE
Q105
BUFFER
IC110
POWER AMP
STNBY
IN2
IN1
INV
OUT
Q103
SW
IC111
EARPHONE AMP
STBY
INA
OUTA
Q104
SW
Q110
MUTE
D703
OPR
EAR
SP101
(SPEAKER)
J102
IC504, Q502
IC508, Q503
IC503, Q501
VOLTAGE
DETECTOR
IC507, Q504
AVCC
DSPVCC
MICVCC
ADAVCC
VBUS2
SVCC
ZVCC
VBUS1
VBUS1
D702
D701,
D702
(BACK
LIGHT)
AVCC
RF
AVCC
SOT2
OSCIN
OSCOUT
SOT2
SIN2
SCK2
X801
24MHz
BEEP
S707 - 706
S722
S726
S721, S723 - 725
MAIN BOARD
P-SW BOARD
F-SW BOARD(2/2)
F-SW BOARD(1/2)
PC BOARD
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS, 3V
RED(REC)
GRN(PB)
RV101
MIC
MIC SENS
L
H
MIC
(PLUG IN POWER)
ON
PLAY
SPEED
OFF
SLOW      NORMAL      FAST
w
VOL
8
8
ICD-BP220
3-2. PRINTED WIRING BOARD – MAIN SECTION (1/2) –
• 
 : Uses unleaded solder.
C169
C168
C161
C160
R766
R765
E  C  B
Q102
IC 102
IC 103
IC 107
IC 101
*
IC 109
CSP (Chip Size Package)
IC 110
IC 104
IC 111
IC 108
IC 112
IC 105
IC 106
C173
1-680-349-
12
(12)
MAIN BOARD
    
(SIDE A)
A
TO
PC BOARD
CN802
(Page 16)
30
1
31
60
J101
J102
1
12
13
24
RV101
1
2
A
B
C
D
E
F
G
H
I
J
K
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
MIC
(PLUG IN POWER)
EAR
OPR
BP100
w
VOL
Ref. No.
Location
• Semiconductor Location
Ref. No.
Location
IC110
G-16
IC111
D-21
IC112
I-11
Q101
E-8
Q102
B-20
Q103
B-18
Q104
B-19
Q105
B-16
Q106
H-11
Q107
E-21
Q108
F-21
Q110
F-21
D703
I-2
IC101
F-6
IC102
F-8
IC103
D-8
IC104
G-10
IC105
J-5
IC106
I-11
IC107
H-7
IC108
I-9
IC109
G-12
* Replacement of IC109 used in this set requires a special tool.
9
9
ICD-BP220
3-3. PRINTED WIRING BOARD – MAIN SECTION (2/2) –
• 
 : Uses unleaded solder.
R772
C757
C763
C726
C172
E
E
E
9
16
1
8
W707
W702
W703
W705
W701
W704
W706
IC 716
IC 712
IC 706
IC 710
IC 715
1-680-349-
12
(12)
MAIN BOARD
    
(SIDE B)
B
TO
F-SW BOARD
CN501
(Page 15)
TO LCD
1
15
30
16
25
48
1
1
36
24
31
MIC101
MIC
60
61
90
91
120
1
30
SP101
(SPEAKER)
1
2
A
B
C
D
E
F
G
H
I
J
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
D
TO
P-SW BOARD
(Page 18)
C
TO
P-SW BOARD
(Page 18)
CN702
Ref. No.
Location
D701
G-5
D702
I-7
IC706
F-13
IC710
H-15
IC712
E-18
IC715
C-21
IC716
F-3
Q702
G-10
Q705
I-5
Q706
I-4
Q707
C-19
Q710
D-10
• Semiconductor
Location
10
10
ICD-BP220
3-4. SCHEMATIC DIAGRAM – MAIN SECTION (1/3) –
• Refer to page 20 for IC Block Diagrams.
IC B/D
IC B/D
IC B/D
IC B/D
IC B/D
IC B/D

Download Sony ICD-BP220 Service Manual (Repair Manual)

Here you can view online and download Sony ICD-BP220 Service Manual in PDF. ICD-BP220 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony ICD-BP220 Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.