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ICD-BM1/BM1A/BM1AVTP/BM1B/BM1DR9
ICD-BM1/BM1A/BM1AVTP/BM1B/BM1DR9
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
• Power voltage is dc 3 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : PB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PB
L
: REC
*
IC601, IC702 on main board are not replaceable.
• The voltages and Waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
from that of conventional IC.
Common Note on Printed Wiring Boards:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
f
: internal component.
•
z
: Through hole.
•
: Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Waveforms
1
IC801
qd
(XOUT)
2
IC701
ys
(CF1)
15MHz
2.8Vp-p
12MHz
2.1Vp-p
*
IC601, IC702 on main board are not replaceable.
•
Lead Layouts
Lead layout of
conventional IC
conventional IC
CSP (chip size package)
surface
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