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2
ICD-BM1/BM1A/BM1AVTP/BM1B/BM1DR9
TABLE OF CONTENTS
1.
GENERAL
Index to Parts and Controls .............................................
3
Using the Display Window ..............................................
3
Setting the Clock .............................................................
3
2.
DISASSEMBLY
2-1.
Knob (Rear) .....................................................................
4
2-2.
Chassis Block Assy .........................................................
5
2-3.
SW Board ........................................................................
5
2-4.
Plate (MS) Section ...........................................................
6
2-5.
LCD Board ......................................................................
6
2-6.
Chassis Section ................................................................
7
2-7.
Memory Stick Connector ................................................
7
2-8.
Main Board ......................................................................
8
3.
DIAGRAMS
3-1.
Block Diagram – Main Section – ....................................
9
3-2.
Block Diagram – LCD/SW Section – ............................. 10
3-3.
Printed Wiring Board – Main Section – .......................... 12
3-4.
Schematic Diagram – Main Section (1/3) – .................... 13
3-5.
Schematic Diagram – Main Section (2/3) – .................... 14
3-6.
Schematic Diagram – Main Section (3/3) – .................... 15
3-7.
Schematic Diagram – LCD/SW Section – ...................... 16
3-8.
Printed Wiring Board – LCD Section– ............................ 17
3-9.
Printed Wiring Board – SW Section– .............................. 18
4.
EXPLODED VIEWS
4-1.
Main Section .................................................................... 27
4-2.
Case Section .................................................................... 28
4-3.
Ornament Section ............................................................ 29
4-4.
Chassis (1) Section .......................................................... 30
4-5.
Chassis (2) Section .......................................................... 31
5.
ELECTRICAL PARTS LIST
.................................. 32
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
* Replacement of IC601, IC702 used in this set requires a special
tool.
•
•
The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.
be measured, because its lead layout is different from that of
conventional IC.
•
Lead layouts
Lead layout of
conventional IC
conventional IC
CSP (chip size package)
surface
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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