Read Sony ICD-B5 Service Manual online
2
TABLE OF CONTENTS
1. GENERAL
Index to Parts and Controls ..................................................... 3
2. DISASSEMBLY
2-1. Upper Lid Assy ................................................................... 4
2-2. F-SW Board, P-SW Board .................................................. 5
2-3. Main Board ......................................................................... 5
2-2. F-SW Board, P-SW Board .................................................. 5
2-3. Main Board ......................................................................... 5
3. DIAGRAMS
3-1. IC Pin Description ............................................................... 6
3-2. Block Diagram .................................................................... 9
3-3. Schematic Diagram – Main Section – ............................... 10
3-4. Printed Wiring Board – Main Section – ............................ 11
3-5. Printed Wiring Board – F-SW Section – ........................... 12
3-6. Printed Wiring Board – P-SW Section – ........................... 13
3-7. IC Block Diagrams ............................................................ 14
3-2. Block Diagram .................................................................... 9
3-3. Schematic Diagram – Main Section – ............................... 10
3-4. Printed Wiring Board – Main Section – ............................ 11
3-5. Printed Wiring Board – F-SW Section – ........................... 12
3-6. Printed Wiring Board – P-SW Section – ........................... 13
3-7. IC Block Diagrams ............................................................ 14
4. EXPLODED VIEWS
4-1. Case Section ...................................................................... 15
4-2. Main Board Section .......................................................... 16
4-2. Main Board Section .......................................................... 16
5. ELECTRICAL PARTS LIST
......................................... 17
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
ICD-B5
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Click on the first or last page to see other ICD-B5 service manuals if exist.