Read Sony ICD-B310F (serv.man2) Service Manual online
SERVICE MANUAL
Sony Corporation
Connect Business Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
E Model
IC RECORDER
9-887-142-01
2006B04-1
© 2006.02
© 2006.02
Ver. 1.0 2006.02
SPECIFICATIONS
ICD-B310F
IC recorder section
Recording media
Recording media
Built-in flash memory 64 MB,
Monaural recording
Monaural recording
Recording time
HQ: 7 hours 30 minutes
SP: 20 hours 5 minutes
LP: 37 hours 5 minutes
SP: 20 hours 5 minutes
LP: 37 hours 5 minutes
Frequency range
HQ: 260 Hz – 6,800 Hz
SP: 220 Hz – 3,400 Hz
LP: 220 Hz – 3,100 Hz
SP: 220 Hz – 3,400 Hz
LP: 220 Hz – 3,100 Hz
FM radio section
Frequency range
Frequency range
87.5 – 108 MHz
IF
225 kHz
Antennas
Headphone cord antenna
General
Speaker
Speaker
approx. 2.8 cm (1
1/8
in.) dia.
Power output
250 mW
Input/Output
• Headphone jack (minijack) for
8 – 300 ohms ear receiver/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Power requirements
Two LR03 (size AAA) alkaline batteries:
3 V DC
3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
34.6
× 109.5 × 18.0 mm (1
3/8
× 4
3/8
×
23/32
in.)
Mass (incl. batteries) 68g (2.4 oz)
Supplied accessories
Supplied accessories
Operating instructions
Headphone (1)
Carrying pouch (1)
Headphone (1)
Carrying pouch (1)
Design and specifications are subject to change without
notice.
notice.
2
ICD-B310F
TABLE OF CONTENTS
1.
GENERAL
...................................................................
3
2.
DISASSEMBLY
2-1.
Case (Front) Assy ............................................................
4
2-2.
Main Board ......................................................................
5
2-3.
FM Board ........................................................................
5
3.
TEST MODE
...............................................................
6
4.
DIAGRAMS
4-1.
Block Diagram ................................................................
9
4-2.
Printed Wiring Board – Main Section – .......................... 11
4-3.
Schematic Diagram – Main Section (1/2) – .................... 12
4-4.
Schematic Diagram – Main Section (2/2) – .................... 13
4-5.
Printed Wiring Board – FM Section – ............................. 14
4-6.
Schematic Diagram – FM Section – ................................ 15
5.
EXPLODED VIEWS
5-1.
Case (Front) Section ........................................................ 19
5-2.
Case (Rear) Section ......................................................... 20
6.
ELECTRICAL PARTS LIST
.................................. 21
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C during
• Keep the temperature of the soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged
by heat.
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
3
ICD-B310F
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Index to Parts and Controls
Main unit
* There is a tactile dot beside the control to show the
direction to turn up the volume.
**The button has a tactile dot.
OPR (operation) indicator
DIVIDE
VOL (volume) control*
HOLD
NxPLAY/STOP (ENTER)**
i
(headphone) jack
Rear
Battery
compartment
compartment
Hook for handstrap
(not supplied)
(not supplied)
Display window
Remaining battery
indicator
indicator
Recording mode
indication
indication
REC (recording)
indicator
indicator
Repeat play indicator
Number of messages in
a folder/Menu
indication/Counter /
Remaining time
indication /Recording
date indication /Current
time indication /
Messages
a folder/Menu
indication/Counter /
Remaining time
indication /Recording
date indication /Current
time indication /
Messages
FM indicator
Folder indication
Microphone sensitivity
Alarm indicator
Selected message number
REC DATE (recorded date)
indication
REMAIN indicator
Remaining memory
indicator
FM radio sensitivity
MIC (built-in microphone)
(microphone) jack
Display window
DISPLAY/MENU
FM• i (headphone)/ 5 (speaker) selector
xSTOP
zXREC (record) /PAUSE
– .(review/fast backward) /
>+ (cue/fast forward) (SELECT)
Speaker
4
ICD-B310F
Note: Follow the disassembly procedure in the numerical order given.
2-1. CASE (FRONT) ASSY
SECTION 2
DISASSEMBLY
Note: Disassemble the unit in the order as shown below.
2-1.
CASE (FRONT) ASSY
(Page 4)
(Page 4)
2-2.
MAIN BOARD
(Page 5)
(Page 5)
SET
2-3.
FM BOARD
(Page 5)
(Page 5)
8
2
screw
9
two screws
0
two brackets (speaker)
qa
speaker
qs
case (front) assy
3
claw
4
claw
6
claw
7
claw
5
two claws
1
battery case lid
