ICD-B25 - Sony Audio Service Manual (repair manual)

Model
ICD-B25
Pages
26
Size
1.31 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
icd-b25.pdf
Date

View Sony ICD-B25 Service Manual online

1
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
Tourist Model
ICD-B25
IC RECORDER
Recording media
Built-in flash memory, Monaural recording
Recording time
127 minutes (SP)/339 minutes (LP)
Frequency response
SP: 250 Hz - 7,300 Hz
LP: 300 Hz - 3,500 Hz
Speaker
approx. 3.2 cm (1 
5/16
 in.) dia.
Power output
300 mW
Input/Output
• Earphone jack (minijack) for 16 - 300 ohms
earphone/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Playback speed control
FAST +30%, SLOW –15%
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5 
×
 105.3 
×
 14.0 mm (1 
13/16
 
×
 4 
1/4
 
×
 
9/16
 in.)
Mass (incl. batteries)
68 g (2.4 oz)
Optional accessories
Electret Condenser Microphone ECM-Z60,
ECM-T115, ECM-DM5P
Connecting cord RK-G64
Your dealer may not handle some of the above listed optional accessories.
Please ask the dealer for detailed information.
Design and specifications are subject to change without notice.
SPECIFICATIONS
Ver 1.0  2002. 03
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-873-644-01
2002C0400-1
© 2002. 03
2
TABLE OF CONTENTS
1. GENERAL
Index to Parts and Controls ..................................................... 3
2. DISASSEMBLY
2-1.   Upper Lid Sub Block Assy .................................................. 4
2-2.   F-sw Board .......................................................................... 4
2-3.   Main Board ......................................................................... 5
3. DIAGRAMS
3-1.   IC Pin Description ............................................................... 6
3-2.   Block Diagram .................................................................... 8
3-3.   Printed Wiring Board – Main Section – ............................ 10
3-4.   Schematic Diagram – Main Section (1/3) – ...................... 12
3-5.   Schematic Diagram – Main Section (2/3) – ...................... 13
3-6.   Schematic Diagram – Main Section (3/3) – ...................... 14
3-7.   Schematic Diagram – F-sw Section – ............................... 15
3-8.   Printed Wiring Board – F-sw Section – ............................ 16
3-9.   Printed Wiring Board – P-sw Section – ............................ 18
3-10. Schematic Diagram – P-sw Section – ............................... 19
4. EXPLODED VIEWS
4-1.   Case Section ...................................................................... 21
4-2.   Main Board Section .......................................................... 22
5. ELECTRICAL PARTS LIST
........................................ 23
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
Notes on Chip Component Replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ICD-B25
ATTENTION AU COMPOSANT AYANT RAPPORT
 À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 
0
 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE  DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
 UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
3
ICD-B25
SECTION 1
GENERAL
This section is extracted
from instruction manual.
4
ICD-B25
2-2. F-SW BOARD
Note : This set can be disassemble according to the following sequence.
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. UPPER LID SUB BLOCK ASSY
1
screw (B1.7x10)
6
upper lid sub block assy
case assy
4
claw
3
claws
5
2
screw (B1.7x7)
7
screws (B1.7x2.5)
8
speaker
1
CN703
case assy
3
F-SW board
2
Set
Upper Lid Sub Block Assy
F-SW Board
Main Board
5
ICD-B25
2-3. MAIN BOARD
3
screw (B1.7x10)
2
speaker
1
Removal the solders.
6
MAIN board
4
claw
5
claw
case assy
6
ICD-B25
3-1. IC PIN DESCRIPTION
• IC712  MB90523APFF-G-122-BND (SYSTEM CONTROL)
Pin No.
Pin Name
I/O
Pin Description
1
RTCCE
O
Real-time clock chip enable signal output
2
BEEP
O
Beep signal output
3
XFLMRE
O
Flash memory read enable signal output
4
XFLMWE
O
Flash memory write enable signal output
5
FLMRB
I
Flash memory R/B signal input
6
DSPPWR
O
DSP power supply signal output
7
ADASYSCK
O
ADA codec system clock signal output
8
VCC
Power supply pin
9
DSPSYSCK
O
DSP system clock signal output
10
XZRST
O
Zephy reset signal output (Not used in this set.)
11
DSPACK
O
DSP I/F acknowledge signal output
12
XDIFEN
O
DSP I/F enable signal output
13
DCOMDT
O
DSP I/F command/data signal output
14
SIN1
I
DSP I/F serial data signal input
15
SOT1
O
DSP I/F serial data signal output
16
SCK1
O
DSP I/F serial clock signal output
17 to 32
SEG00 to 15
O
LCD segment signal output
33
VSS
Ground pin
34
C
C (Connect to power supply pin.)
35
SIN2
I
Zephyr/RTC I/F serial data signal input
36
SOT2
O
Zephyr/RTC I/F serial data signal output
37
SCK2
O
Zephyr/RTC I/F serial clock signal output
38
DVCC
Digital power supply pin
39
DVSS
Digital ground pin
40
ZIFACK
O
Zephyr I/F acknowledge signal output (Not used in this set.)
41
SIPCS
O
Serial parallel converter IC I/F chip enable signal output
42
AVCC
Analog power supply pin
43
AVRH
A/D reference voltage H (Connect to VCC.)
44
AVRL
A/D reference voltage L (Connect to ground.)
45
AVSS
Analog ground pin
46
BATT
I
Battery level detection A/D signal input
47
KEYIN0
I
Key A/D signal input 0
48
KEYIN1
I
Key A/D signal input 1
49
SPEED
I
Speed switch A/D signal input
50
XVORSW
I
VOR switch signal input (Low: VOR switch ON)
51
HPJACK
I
Headphone jack ON/OFF signal input (Fixed at “L” in this set.)
52
FLMSEL
I
Flash memory select A/D signal input
53
KEYPUP
O
Key pull-up signal output
54
VCC
Power supply pin
55
FLMALE
O
Flash memory address latch enable signal output (AND: OE)
56
FLMCLE
O
Flash memory command enable signal output (AND: CDE)
57
XVORIN
I
VOR signal input
58
XDSPRST
O
DSP reset signal output
59 to 62
COM0 to 3
O
LCD common signal output
63
VSS
Ground pin
64 to 72
SEG16 to 24
O
LCD segment signal output
73
SUBXTAL
O
Sub clock oscillation pin (Not used in this set.)
74
SUBCLK
I
Sub clock oscillation signal input (32.768 kHz)
SECTION 3
DIAGRAMS
ICD-B25
7
7
Pin No.
Pin Name
I/O
Pin Description
75 to 81
SEG25 to 31
O
LCD segment signal output
82 to 85
V0 to 3
LCD driver reference power supply pin
86
XHSTBY
I
Hardware standby signal input
87
MD2
I
Operation mode signal input 2
88
MD1
I
Operation mode signal input 1 (Connect to VCC.)
89
MD0
I
Operation mode signal input 0
90
XRESET
I
Reset signal input
91
VSS
Ground pin
92
XTALIN
I
Main oscillation signal input (4.096 MHz)
93
XTAL
O
Main oscillation signal output (4.096 MHz)
94
VCC
Power supply pin
95
WAKEUP
I
Wake up signal input
96
DSPIFREQ
I
DSP voice I/F request signal input
97
ZIFREQ
I
USB microcomputer (zephyr) I/F request signal input
98
RTCINTR
I
Real-time clock interruption request signal input
99
VBUSOFF
I
USB Vbus ON/OFF detection signal input (H=OFF)
100
HOLDSW
I
Hold switch signal input (High: HOLD)
101
XFLMCEO
O
Flash memory chip enable 0 signal output
102
XFLMRST/CE1
O
Flash memory reset signal/chip enable 1 signal output (Not used in this set.)
103 to 110
FLMIO00 to 07
I/O
Flash memory data bus
111 to 118
FLMIO08 to 15
I/O
Flash memory data bus (Not used in this set.)
119
VSS
Ground pin
120
XFLMWP
O
Flash memory write protect signal output
ICD-B25
8
8
3-2. BLOCK DIAGRAM
3
4
1
3
5
1
6
4
22
4
1
13
6
11
8
13
7
11
2
3
12
8
5
6
10
38
35
37
34
36
59
72
7
8
9
16
17
19
18
5
3
101
56
55
120
4
96
13
12
14
15
16
57
52
49
95
53
47
48
100
29
31
33
27
28
42
43
9
4
14
15
9
6
3
3
1
6
7
6
1
58
11
36
4
3
2
35
37
41
1
98
74
7
6
1
46
2
51
86
90
1
92
93
15
20
17
8
9
10
11
103
ı
110
59
62
ı
12
37
64
72
ı
75
81
ı
17
32
ı
29
32
ı
41
44
ı
9
8
VIN+
VIN-
VOUT
2
3
VIN
CE
VOUT
IC505
+2.9V REG
2
3
VIN
CE
VOUT
IC506
+2.9V REG
5
2
3
VIN
CE
VOUT
IC502
+3.1V REG
DC-DC
CONVERTER
(3.2V)
DC-DC
CONVERTER
SI
SO
SCLK
CE
INTR
32KOUT
S701 - 705
3
1
+
-
17
 • Signal Path
: PB
: REC
MIC101
MIC
MIC
J101
IC101
MIC AMP
Q101
MIC
SENS
IC102
ALC AMP
IN
OUT
INPUT OUT1
IC103
VOR CONTROL
IC107
A/D, D/A CONVERTER
VIN
VOUT
PDWN
XTI
BCK
FS
DIN
DOUT
IC109
DSP
SCK1
SI1
SO1
SIEN1
SOEN1
P3
P2
SI2
SO2
SIEN2
SOEN2
SCK2
CLKIN
/RESET
IC105
IC106
IC712
SYSTEM CONTROL
IC104, 108
CLOCK GEN
CLKIN
CLKIN
CE
CE
Q0
Q0
IC706
FLASH MEMORY
Q702
+B
SW
ZVCC
Q705, 706
WAKE-UP
SW
IO1
ı
IO8
VCC
R/B
RE
CE
CLE
ALE
WE
WP
DSPIFREQ
DCOMDT
XDIFEN
SIN1
SOT1
SCK1
XVORIN
FLMIO00
ı
FLMIO07
FLMRB
XFLMRE
XFLMCE0
FLMCLE
FLMALE
XFLMWE
XFLMWP
FLMSEL
SPEED
WAKEUP
KEYPUP
KEYIN0
KEYIN1
HOLDSW
DSPSYSCK
DSPPWR
ADASYSCK
XDSPRST
DSPACK
SOT2
SIN2
SCK2
SIPCS
RTCCE
RTCINTR
SUBCLK
BATT
HPJACK
XHSTBY
XRESET
XTALIN
XTAL
COM0
COM3
SEG00
ı
SEG31
ı
X701
4.096MHz
LCD101
LIQUID
CRYSTAL
DISPLAY
PANEL
RESET
IC710
Q707
SW
IC716
REAL-TIME CLOCK
X702
32.768kHz
Q710
SW
IC715
SI/PO DRIVER
DATA
CLOCK
XFLMPWR
MICSENSE LMUTE
XSPPWR
XHPPWR
HPMUTE
XREDLED
XGRNLED
APOWER
ADAPWR
XLIGHT
XBATTEN
IC112
AMP
VIN- VOUT
Q106
LPF
SW
Q107, 108
LPF
SW
Q102
MUTE
Q105
BUFFER
IC110
POWER AMP
STNBY
IN2
IN1
INV
OUT
Q103
SW
D703
OPR
SP101
SPEAKER
J102
EAR
IC504
IC508, Q503
VOLTAGE
DETECTOR
IC507
DECODER
Q504
AVCC
DSPVCC
MICVCC
ADAVCC
ZVCC
SVCC
D701, 702
(BACK LIGHT)
AVCC
RF
AVCC
SOT2
OSCIN
OSCOUT
BEEP
S706, 707
S722
S726
S721, 723 - 725
MAIN BOARD
P-SW BOARD
F-SW BOARD    (2/2)
F-SW BOARD    (1/2)
DRY BATTERY
SIZE"AAA"
(IEC DESIGNATION LR03)
2PCS,3V
RED (REC)
GRN (PB)
RV101
VOL
SLOW       NORMAL      FAST
S702
PLAY SPEED
3.1V
2.9V
2.9V
2.3V
3V
5
5
ICD-B25
9
• Waveforms
1.3Vp-p
1
IC712 
od
 (XTAL)
0.5V/div   50nsec/div
4.096MHz
2
IC716 
8
 (OSCOUT)
0.2V/div   10µsec/div
32.768kHz
0.8Vp-p
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
1
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
C
: panel designation.
A
: B+ Line.
• Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
• Voltages are taken with a VOM (Input impedance 10 M
1
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: PB
a
: REC
*
 IC109 on main board are not replaceable.
• The voltages and Waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
Common Note on Printed Wiring Boards:
X
: parts extracted from the component side.
Y
: parts extracted from the conductor side.
f
: internal component.
: Pattern from the side which enables seeing.
Lead layout of conventional IC        CSP (chip size package)
surface
Caution:
Pattern face side:
Parts on the pattern face side seen from
(SIDE B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
*
 IC109 on main board are not replaceable.
Lead Layouts
ICD-B25
10
10
3-3. PRINTED WIRING BOARD — MAIN SECTION —
 : Uses unleaded solder.
D703
G-2
IC101
E-4
IC102
D-6
IC103
C-5
IC104
E-7
IC105
G-4
IC106
F-8
IC107
F-5
IC108
F-6
IC109
E-8
IC110
F-10
IC112
F-7
Q101
D-5
Q102
B-13
Q103
B-12
Q105
B-10
Q106
F-7
Q107
D-13
Q108
E-13
• Semiconductor
Location
Ref. No.
Location
1
A
B
C
D
E
F
G
H
I
J
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1-680-349-
(12)
12
MAIN BOARD   (SIDE A)
C114
C117
IC103
C104
C105
C139
C102
C142
C144
C110
R105
C175
R766
C153
Q103
Q102
C160
C168
C161
C169
R155
C150
R121
R139
R159
C145
C149
R153
R157
Q107
Q105
Q108
R765
R767
R170
R171
R169
R106 R107
C103 R109
C101
C115
C127
IC108
C163 C173
C162
C171
R187
C121
R762 R178
C118
C119
R787
R786
FB105
D703
D703
OPR
R161
IC105
C120
R165
FB104
C112
IC102
IC107
Q101
R114
FB102
FB101
C108 C107
R102
R104
R103
R110
R108
C116
R116
C109
R112
R183
R185
R184
C128
C164
R142
C124
C155
C126
C123
C122
R118
R186
C165
R140
R129
R764
R122
R141
R111
C111
C156
C152
RB103
RB102
RB101
C157
C154
C170
C167
C151
C141
C140
C125
C131
*
IC109
CSP
(CHIP SIZE PACKAGE)
IC110
C129
Q106
IC104
C106
R117
R113
R730
R166
R150
R152
R133
R181
R158
R189
R143
C132
R182
R146
R147
C137
C135
R179
R167
R144
R115
C113
R101
J101
J102 
EAR
TP115
TP704
TP114
TP712
TP711
TP710
TP120
TP110
TP709
TP123
TP117
TP708
TP101
TP108
TP122
TP713
TP116
TP705
TP119
TP112 TP113
TP702
TP701
TP706
TP118
TP121
TP111
G
D
S
B
C
E
G
D
S
G
D
S
IC112
IC106
G
D
S
S
D
G
3
1
4
5
2
54 13
2
3
4
5
2
1
6
5
4
1
1
12
24
13
3 2
3
2
1
4
1
C
9
18
E
B
10
6 5
1
9
5
4
1
3 2
IC101
3
2
1
4
5
TP703
1
4
8
5
RV101
VOL
-1
L
-2
R
FAST
NORMAL
SLOW
S702  PLAY SPEED
-1
-2
MIC

Download Sony ICD-B25 Service Manual (Repair Manual)

Here you can view online and download Sony ICD-B25 Service Manual in PDF. ICD-B25 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony ICD-B25 Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.