Read Sony ICD-B17 Service Manual online
1
SERVICE MANUAL
US Model
AEP Model
Tourist Model
ICD-B17
IC RECORDER
Recording media
Built-in flash memory, Monaural recording
Recording time
300 minutes
Speaker
approx. 3.2 cm (1
5/16
in.) dia.
Power output
150 mW
Input/Output
• Earphone jack (minijack) for 8 - 300 ohms
earphone/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5
×
105.3
×
14.0 mm (1
13/16
×
4
1/4
×
9/16
in.)
Mass (incl. batteries)
68 g (2.4 oz)
Design and specifications are subject to change without notice.
SPECIFICATIONS
Ver 1.0 2003. 05
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-877-327-01
2003E0400-1
© 2003. 05
2
TABLE OF CONTENTS
1. SERVICE NOTE
................................................................ 3
2. GENERAL
Index to Parts and Controls ..................................................... 4
3. DISASSEMBLY
3-1. Upper Lid Assy ................................................................... 5
3-2. F-SW Board, P-SW Board .................................................. 6
3-3. Main Board ......................................................................... 6
3-2. F-SW Board, P-SW Board .................................................. 6
3-3. Main Board ......................................................................... 6
4. DIAGRAMS
4-1. IC Pin Description ............................................................... 7
4-2. Block Diagram .................................................................... 9
4-3. Printed Wiring Board – Main Section – ............................ 11
4-4. Printed Wiring Board – F-SW Section – ........................... 12
4-5. Printed Wiring Board – P-SW Section – ........................... 13
4-6. Schematic Diagram – Main Section – ............................... 14
4-7. IC Block Diagrams ............................................................ 15
4-2. Block Diagram .................................................................... 9
4-3. Printed Wiring Board – Main Section – ............................ 11
4-4. Printed Wiring Board – F-SW Section – ........................... 12
4-5. Printed Wiring Board – P-SW Section – ........................... 13
4-6. Schematic Diagram – Main Section – ............................... 14
4-7. IC Block Diagrams ............................................................ 15
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 16
5-2. Main Board Section .......................................................... 17
5-2. Main Board Section .......................................................... 17
6. ELECTRICAL PARTS LIST
........................................ 18
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
ICD-B17
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
3
ICD-B17
SECTION 1
SERVICE NOTE
1-1. CAUTIONS OF FLASH MEMORY (IC701)
EXCHANGE
[Precaution when the flash memory (IC701) is replaced]
When the flash memory (IC701) is replaced, be sure to perform the
BAD BLOCK check* and writing of the model code. If they are not
completed, the unit will not operate normally.
BAD BLOCK check* and writing of the model code. If they are not
completed, the unit will not operate normally.
* BAD BLOCK check is to check the flash ROM memory
area (the BAD BLOCK area) where data cannot be
guaranteed. The resultant information of this check is stored
in the TOC-AREA so that the BAD BLOCK area should
not be used.
guaranteed. The resultant information of this check is stored
in the TOC-AREA so that the BAD BLOCK area should
not be used.
[BAD BLOCK Check Procedure]
1. When the power is turned on after the flash memory (IC701) is
replaced, the BAD BLOCK check starts automatically and the
OPR (D701) lights in orange.
OPR (D701) lights in orange.
2. In about 30 seconds after start of the check, the OPR (D701)
changes the color to green indicating that the check is
completed.
completed.
TP701
TP702
TP708
TP110
TP102
TP501
TP106
TP101
TP107
R727
R726
FB104
FB103
C120
C101
R102
R103
C129
C128
FB102
FB101
R135
R104
C106
C105
RED(REC)
D701
GRN
(PLAY)
Q701
C
C
B
B
E
C104
C103
X101
J102
EAR
J101
MIC
(PLUG IN POWER)
MAIN BOARD (SIDE A)
–1
–2
4
ICD-B17
SECTION 2
GENERAL
This section is extracted
from instruction manual.
from instruction manual.