ICD-37, ICD-57, ICD-67 - Sony Audio Service Manual (repair manual). Page 2

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TABLE  OF  CONTENTS
1.
SERVICING  NOTES
...............................................
2
2.
GENERAL
...................................................................
3
3.
DISASSEMBLY
.........................................................
4
4.
TEST  MODE
..............................................................
6
5.
DIAGRAMS
5-1. Block Diagram ................................................................
7
5-2. Printed Wiring Board ......................................................
9
5-3. Schematic Diagram ......................................................... 11
5-4. IC Pin Function Description ........................................... 17
6.
EXPLODED  VIEW
................................................... 20
7.
ELECTRICAL  PARTS  LIST
............................... 21
CAUTION ON REPLACING FLASH MEMORY
The BAD-BLOCK check* must be executed, when the flash
memory (IC702) in this set was replaced.
The set will not operation normally, unless this check is finished.
* The BAD-BLOCK check detects an area (bad-block) in the flash
memory where data validity cannot be guaranteed, and saves this
information in the TOC-AREA so that a bad-block is not used.
BAD-BLOCK check Procedure:
1. Apply 1.5 V from regulated power supply to the battery termi-
nals.
2. Once the power is supplied, the check starts and then proceeds
for approx. 25 (ICD-37)/45 (ICD-57)/87 (ICD-67) seconds.
(Be sure to keep applying the power and pin yj or TP13 (green)/
Pin yh or TP14 (red) signal “H” during the check)
* Green/red LED of 
[OPR]
 indicator don't light up, therefore
it cannot be seen visually. Check the signal of pin yh , yj or
TP13, 14.
3. When the check completes, the result is shown as follows.
OK: Pin yh or TP14 signal “L” (Pin yj or TP13 Signal “H”)
NG: Pin yj or TP13 signal “H” (Pin yh or TP14 signal “L”)
4. In case of OK, press the 
[STOP]
 button.
Note:
• In case of NG, check system controller IC (IC701), flash memory IC
(IC702) and the peripheral circuit. (Particularly, check carefully the sol-
dering of the flash memory)
• After finishing the BAD-BLOCK check, assemble the set, load the dry
battery, and confirm if the set operates normally.
SECTION  1
SERVICING  NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board. (within 3 times)
• Be careful not to apply force on the conductor when soldering
or unsoldering.
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