HTC-WX5, MHC-WX5, MHC-WX7AV - Sony Audio Service Manual (repair manual)

E Model

Australian Model

Tourist Model

HTC-WX5 is the deck and CD
section in MHC-WX5/WX7.

CD

SECTION

TAPE DECK

SECTION

Model Name Using Similar Mechanism

HTC-W555

CD Mechanism Type

CDM38-5BD29A

Base Unit Type

BU-5BD29AL

Optical Pick-up Type

KSS-213B/S-N

Model Name Using Similar Mechanism

HCD-VR90AV

Tape Transport Mechanism Type

TCM-230AWR2

System

Compact disc and digital audio system

Laser

Semiconductor laser ( =780nm)
Emission duration : continuous

Laser output

Max. 44.6 µW*
*This output is the value measured at a
distance of 200mm from the objective
lens surface on the Optical Pick-up Block
with 7mm aperture.

Frequency response

20Hz – 20kHz (±1dB)

Wavelength

780 – 790 nm

Signal-to-noise ratio

More than 90dB

Dynamic range

More than 90dB

CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength

600nm

Output Level

-18dBm

Recording system

4-track 2-channel stereo

Frequency response

40 – 13,000Hz (±3dB), using Sony TYPE I

(DOLBY NR OFF)

cassette 40 – 14,000Hz (±3dB), using Sony
TYPE II cassette

Dimensions (w/h/d)

Approx. 288 

×

 205 

×

 360mm

Mass

Approx. 4.4kg

Design and specifications are subject to change without notice.

2

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

 damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

 circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

 or unsoldering.

Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.

This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.

!

!

3

.......................................................... 4

.......................................................................... 7

3-1. Loading Panel ................................................................. 8
3-2. Back Panel and CD Mechanism Deck ............................ 8
3-3. Front Panel ...................................................................... 9
3-4. TC Mechanism Deck and Cassette Holder ..................... 9
3-5. Disc Tray ....................................................................... 10

..........................

11

............................... 11

6-1. Circuit Boards Location ................................................ 14
6-2. Block Diagrams

• CD Section ....................................................................... 15
• Deck Section .................................................................... 16
• Main Section .................................................................... 14

6-3. Printed Wiring Board   CD Section .............................. 18
6-4. Schematic Diagram    CD Section ................................ 19
6-5. Schematic Diagram   Deck Section .............................. 20
6-6. Printed Wiring Board   Deck Section ............................ 21
6-7. Printed Wiring Board   Main Section ............................ 22
6-8. Schematic Diagram   Main (1/2) Section ...................... 23
6-9. Schematic Diagram   Main (2/2) Section ...................... 24
6-10. Printed Wiring Board   Leaf SW Section .................... 25
6-11. Schematic Diagram   Leaf SW Section ...................... 25
6-12. Printed Wiring Board   Panel Section ......................... 26
6-13. Schematic Diagram   Panel Section ............................ 27
6-14. Schematic Diagram   CD Motor Section .................... 28
6-15. Printed Wiring Board   CD Motor Section ................. 29
6-16. IC Block Diagrams ..................................................... 30
6-17. IC Pin Functions ......................................................... 32

7-1. Case and Back Panel Section ........................................ 39
7-2. Front Panel Section ....................................................... 40
7-3. CD Mechanism Section 1 (CDM38-5BD29A) ............. 41
7-4. CD Mechanism Section 2 (CDM38-5BD29A) ............. 42
7-5. Base Unit Section (BU-5BD29A) ................................. 43
7-6. TC Mechanism Section 1 (TCM230AWR2) ................ 44
7-8. TC Mechanism Section 2  (TCM230AWR2) ............... 45

........................................ 46

4

1

Remove the Case.

3

 

Pull-out the disc tray.

2

 

Turn the cam to the

     direction of arrow.

BU cam

Groove

Section A

Note:When attaching the Base unit, Insert the
         section A into the groove of BU cam.

Note:When attaching the BU cam,
         engage the Rotary encoder
         switch as shown in the figure.