Read Sony HT-DDW3000 / STR-KM3000 Service Manual online
STR-KM3000
2
1.
SERVICING NOTES
............................................. 2
2. GENERAL
.................................................................. 3
3. DISASSEMBLY
3-1. Disassembly Flow .......................................................... 8
3-2. Case ................................................................................. 8
3-3. Back Panel Block ............................................................ 9
3-4. Front Panel Block .......................................................... 9
3-5. Main Block ..................................................................... 10
3-6. MAIN Board ................................................................... 10
3-2. Case ................................................................................. 8
3-3. Back Panel Block ............................................................ 9
3-4. Front Panel Block .......................................................... 9
3-5. Main Block ..................................................................... 10
3-6. MAIN Board ................................................................... 10
4.
TEST MODE
............................................................ 11
5.
ELECTRICAL CHECK
......................................... 11
6. DIAGRAMS
6-1. Block Diagram - MAIN Section - ................................... 12
6-2. Block Diagram - AMP Section - ..................................... 13
6-3. Block Diagram - POWER SUPPLY Section - ................ 14
6-4. Printed Wiring Board - MAIN Board - ........................... 16
6-5. Schematic Diagram - MAIN Board (1/3) - ..................... 17
6-6. Schematic Diagram - MAIN Board (2/3) - ..................... 18
6-7. Schematic Diagram - MAIN Board (3/3) - ..................... 19
6-8. Printed
6-2. Block Diagram - AMP Section - ..................................... 13
6-3. Block Diagram - POWER SUPPLY Section - ................ 14
6-4. Printed Wiring Board - MAIN Board - ........................... 16
6-5. Schematic Diagram - MAIN Board (1/3) - ..................... 17
6-6. Schematic Diagram - MAIN Board (2/3) - ..................... 18
6-7. Schematic Diagram - MAIN Board (3/3) - ..................... 19
6-8. Printed
Wiring
Board
- DIGITAL AB Board (Side A) - .................................... 20
6-9. Printed
Wiring
Board
- DIGITAL AB Board (Side B) - .................................... 21
6-10. Schematic Diagram - DIGITAL AB Board (1/3) -.......... 22
6-11. Schematic Diagram - DIGITAL AB Board (2/3) -.......... 23
6-12. Schematic Diagram - DIGITAL AB Board (3/3) -.......... 24
6-13. Printed Wiring Boards
6-11. Schematic Diagram - DIGITAL AB Board (2/3) -.......... 23
6-12. Schematic Diagram - DIGITAL AB Board (3/3) -.......... 24
6-13. Printed Wiring Boards
- HP/DCAC/POWER Section - ...................................... 25
6-14. Schematic Diagram - HP/DCAC/POWER Section - ...... 25
6-15. Printed Wiring Board - DISPLAY Board ....................... 26
6-16. Schematic Diagram - DISPLAY Board - ........................ 27
6-17. Printed Wiring Board - STANDBY Board - ................... 28
6-18. Schematic Diagram - STANDBY Board - ...................... 29
6-19. Printed Wiring Board
6-15. Printed Wiring Board - DISPLAY Board ....................... 26
6-16. Schematic Diagram - DISPLAY Board - ........................ 27
6-17. Printed Wiring Board - STANDBY Board - ................... 28
6-18. Schematic Diagram - STANDBY Board - ...................... 29
6-19. Printed Wiring Board
- DCDC CONVERTER Board - ..................................... 30
6-20. Schematic Diagram
- DCDC CONVERTER Board - ..................................... 30
7.
EXPLODED VIEWS
7-1. Front Panel Section ......................................................... 40
7-2. Back Panel Section ......................................................... 41
7-3. Main
7-2. Back Panel Section ......................................................... 41
7-3. Main
Section
................................................................... 42
8.
ELECTRICAL PARTS LIST
.............................. 43
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE IC1131 ON THE DIGITAL
AB BOARD
IC1131 on the DIGITAL AB board cannot exchange with single.
When IC1131 on the DIGITAL AB board is damaged, exchange
the entire mounted board.
AB BOARD
IC1131 on the DIGITAL AB board cannot exchange with single.
When IC1131 on the DIGITAL AB board is damaged, exchange
the entire mounted board.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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