HCD-ZTX7, LBT-ZTX7 - Sony Audio Service Manual (repair manual). Page 3

Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous 
radiation exposure.

The laser diode in the optical pick-up block may suffer electrostatic 
breakdown because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

Notes on Chip Component Replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be
  damaged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during 

repairing.

• Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering or 

unsoldering.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead 
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than 

ordinary solder.

  Ordinary soldering irons can be used but the iron tip has to be 

applied to the solder joint for a slightly longer time.

  Soldering irons using a temperature regulator should be set to 

about 350 °C.

  Caution: The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong viscosity
  Unleaded solder is more viscou-s (sticky, less prone to fl ow) than 

ordinary solder so use caution not to let solder bridges occur such 
as on IC pins, etc.

• Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may also 

be added to ordinary solder.

This appliance is
classifi ed as a CLASS 1
LASER product. This
label is located on the
rear exterior.

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on 
the disc refl ective surface by the objective lens in the optical pick-up 
block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.