Read Sony HCD-XGV80 / LBT-XGV80 Service Manual online
HCD-XGV80
E Model
COMPONENT Hi-Fi STEREO SYSTEM
— Continued on next page —
SPECIFICATIONS
• HCD-XGV80 is the Amplifier,
CD player, tape deck and tuner
section in LBT-XGV80.
section in LBT-XGV80.
Ver. 1.2 2006.06
Model Name Using Similar Mechanism
HCD-XGV6/XGV8/XGV10AV
CD
CD Mechanism Type
CDM37B-30BD62
Section
Base Unit Name
BU-30BD62
Optical Pick-up Name
A-MAX.3
TAPE
Model Name Using Similar Mechanism
NEW
Section
Tape Mechanism Type
CWM43RR23
SERVICE MANUAL
Amplifier section
Mexican models:
The following measured at AC 127 V, 60 Hz
DIN power output (rated):
Mexican models:
The following measured at AC 127 V, 60 Hz
DIN power output (rated):
145x 2 + 145x 2 watts
(6 ohms at 1 kHz, DIN)
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
180x 2 + 180x 2 watts
(6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, 10% THD)
Other models:
The following measured at AC 120, 220, 230 – 240 V, 50/60 Hz
DIN power output (rated):
The following measured at AC 120, 220, 230 – 240 V, 50/60 Hz
DIN power output (rated):
145x 2 + 145x 2 watts
(6 ohms at 1 kHz, DIN)
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
180x 2 + 180x 2 watts
(6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, 10% THD)
Inputs
PHONO IN (phono jacks):
PHONO IN (phono jacks):
sensitivity 3 mV, impedance 47 kilohms
MIC-1/MIC-2 (phone jacks):
sensitivity 1 mV, impedance 10 kilohms
GAME INPUT AUDIO L/R (phono jacks):
sensitivity 250 mV,impedance 47 kilohms
GAME INPUT VIDEO (phono jack): 1Vp-p, 75 ohms
MD (VIDEO) IN L/R (phono jacks):
MD (VIDEO) IN L/R (phono jacks):
sensitivity 450 mV (250 mV),
impedance 47 kilohms
impedance 47 kilohms
Outputs
PHONES (stereo phone jack):
PHONES (stereo phone jack):
accepts headphones of 8 ohms or more
MD (VIDEO) OUT L/R (phono jacks):
voltage 250 mV, impedance 1 kilohms
VIDEO OUT (phono jack):
max. output level 1Vp-p,
load impedance 75 ohms
load impedance 75 ohms
FRONT SPEAKER:
accepts impedance of 6 to 16 ohms
(SUPER WOOFER)
accepts impedance of 6 to 16 ohms
(TWEETER & WOOFER)
(SUPER WOOFER)
accepts impedance of 6 to 16 ohms
(TWEETER & WOOFER)
VIDEO CD/CD player section
System
System
Compact disc digital audio system
Laser
Semiconductor laser (
λ=795 nm)
Emission duration: continuous
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format NTSC, PAL
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
9-877-433-03
2006F02-1
© 2006.06
© 2006.06
2
HCD-XGV80
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Tape deck section
Recording system
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz (50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Tuning range
530 – 1,710 kHz
(with the tuning interval set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval set at 9 kHz)
(with the tuning interval set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
Mexican models:
Power requirements
Mexican models:
120 V or 127 V AC, 60 Hz
Other models:
120 V, 220 V or 230 – 240 V AC, 50/60 Hz
Adjustable with voltage selector
Adjustable with voltage selector
Power consumption
330 watts
Dimensions (w/h/d) (Main Unit)
Approx. 355 x 425 x 451 mm
Mass (Main Unit)
Approx. 17.0 kg
Design and specifications are subject to change without notice.
3
HCD-XGV80
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
································································ 7
4. TEST MODE
···································································· 16
5. MECHANICAL ADJUSTMENTS
····························· 18
6. ELECTRICAL ADJUSTMENTS
······························· 18
7. DIAGRAMS
7-1. Circuit Board Location ······················································ 22
7-2. Block Diagram – CD Servo Section – ······························· 24
7-2. Block Diagram – CD Servo Section – ······························· 24
Block Diagram – Tuner/Tape Deck Section – ··················· 25
Block Diagram – Main Section – ······································ 26
Block Diagram
Block Diagram – Main Section – ······································ 26
Block Diagram
– Display/Key Control/Power Supply Section – ·········· 27
7-3. Printed Wiring Board – BD Section – ······························· 28
7-4. Schematic Diagram – BD Section – ·································· 29
7-5. Printed Wiring Board – Video Section – ··························· 30
7-6. Schematic Diagram – Video Section – ······························ 31
7-7. Printed Wiring Board – Motor LED Section – ·················· 32
7-8. Schematic Diagram –Motor LED Section – ······················ 32
7-9. Schematic Diagram – Main (1/4) Section – ······················ 33
7-10. Schematic Diagram – Main (2/4) Section – ······················ 34
7-11. Schematic Diagram – Main (3/4) Section – ······················ 35
7-12. Schematic Diagram – Main (4/4) Section – ······················ 36
7-13.Printed Wiring Board – Main Section – ····························· 37
7-14. Printed Wiring Board – CD-L, CD-R Section – ················ 38
7-15. Schematic Diagram – CD-L, CD-R Section – ··················· 39
7-16. Printed Wiring Board – TC-A, TC-B Section – ················ 40
7-17. Schematic Diagram – TC-A, TC-B Section – ··················· 41
7-18.Printed Wiring Board – Panel VR, Key Section – ············· 42
7-19. Schematic Diagram – Panel VR, Key Section – ················ 43
7-20.Printed Wiring Board – Panel FL Section – ······················· 44
7-21. Schematic Diagram – Panel FL Section – ························· 45
7-22. Printed Wiring Board – Power Amp Section – ·················· 46
7-23. Schematic Diagram – Power Amp Section – ····················· 47
7-24. Printed Wiring Board – Sub Amp Section – ····················· 48
7-25. Schematic Diagram – Sub Amp Section – ························· 49
7-26. Printed Wiring Board – Mic Section – ······························ 50
7-27. Schematic Diagram – Mic Section – ································· 50
7-28. Printed Wiring Board – Power Supply Section – ·············· 51
7-29. Schematic Diagram – Power Supply Section – ················· 51
7-30. IC Pin Function Description ············································· 52
7-31. IC Block Diagram ····························································· 58
7-4. Schematic Diagram – BD Section – ·································· 29
7-5. Printed Wiring Board – Video Section – ··························· 30
7-6. Schematic Diagram – Video Section – ······························ 31
7-7. Printed Wiring Board – Motor LED Section – ·················· 32
7-8. Schematic Diagram –Motor LED Section – ······················ 32
7-9. Schematic Diagram – Main (1/4) Section – ······················ 33
7-10. Schematic Diagram – Main (2/4) Section – ······················ 34
7-11. Schematic Diagram – Main (3/4) Section – ······················ 35
7-12. Schematic Diagram – Main (4/4) Section – ······················ 36
7-13.Printed Wiring Board – Main Section – ····························· 37
7-14. Printed Wiring Board – CD-L, CD-R Section – ················ 38
7-15. Schematic Diagram – CD-L, CD-R Section – ··················· 39
7-16. Printed Wiring Board – TC-A, TC-B Section – ················ 40
7-17. Schematic Diagram – TC-A, TC-B Section – ··················· 41
7-18.Printed Wiring Board – Panel VR, Key Section – ············· 42
7-19. Schematic Diagram – Panel VR, Key Section – ················ 43
7-20.Printed Wiring Board – Panel FL Section – ······················· 44
7-21. Schematic Diagram – Panel FL Section – ························· 45
7-22. Printed Wiring Board – Power Amp Section – ·················· 46
7-23. Schematic Diagram – Power Amp Section – ····················· 47
7-24. Printed Wiring Board – Sub Amp Section – ····················· 48
7-25. Schematic Diagram – Sub Amp Section – ························· 49
7-26. Printed Wiring Board – Mic Section – ······························ 50
7-27. Schematic Diagram – Mic Section – ································· 50
7-28. Printed Wiring Board – Power Supply Section – ·············· 51
7-29. Schematic Diagram – Power Supply Section – ················· 51
7-30. IC Pin Function Description ············································· 52
7-31. IC Block Diagram ····························································· 58
8. EXPLODED VIEWS
8-1. Case,Back Panel Section ··················································· 61
8-2. Front Panel Section-1 ························································ 62
8-3. Front Panel Section-2 ························································ 63
8-4. Chassis Section ·································································· 64
8-5. CD Mechanism Deck Section (CDM-30BD62) ················ 65
8-6. Base Unit Section (BU-30BD62) ······································ 66
8-2. Front Panel Section-1 ························································ 62
8-3. Front Panel Section-2 ························································ 63
8-4. Chassis Section ·································································· 64
8-5. CD Mechanism Deck Section (CDM-30BD62) ················ 65
8-6. Base Unit Section (BU-30BD62) ······································ 66
9. ELECTRICAL PARTS LIST
······································· 67
• MODEL IDENTIFICATION
– Rear Panel –
– Rear Panel –
MODEL
SP model
MX model
E51 model
PARTS No.
4-244-968-0s
4-244-968-4s
4-244-968-5s
•
Abbreviation
MX
MX
: Mexican
E51
: Chilean and Peruvian
SP
: Singapole
PART No.
4
HCD-XGV80
SECTION 1
SERVICING NOTE
SERVICE POSITION FOR BD BOARD AND OPTICAL PICK-UP BLOCK
Optical pick-up block
BD board
4
BU fitting screw
3
Bottom plate
1
Two screws (+BVTP 3 x 8)
5
2
