HCD-XGR80 - Sony Audio Service Manual (repair manual)

E Model

— Continued on next page —

• HCD-XGR80 is the Amplifier,

CD player, tape deck and tuner
section in LBT-XGR80.

2003G02-1

© 2003.07

Model Name Using Similar Mechanism

HCD-XGR60

CD

CD Mechanism Type

CDM37B-30BD60C

Section

Base Unit Name

BU-30BD60C

Optical Pick-up Name

A-MAX.3

TAPE

Model Name Using Similar Mechanism

HCD-XGR60

Section

Amplifier section
The following measured at AC 120/220/240V, 50 Hz
DIN power output (rated)

125W x 2 + 125W x 2
watts
(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference)

170 W x 2 + 170 W x 2
(6 ohms at 1 kHz, 10% THD)

Inputs
DJ MIX RETURN*:
(phono jacks)

sensitivity 250 mV,
impedance 47 kilohms

GUITAR:
(phone jack)

sensitivity 75 mV,
impedance 470 kilohms

PHONO IN:
(phono jacks)

sensitivity 3 mV,
impedance 47 kilohms

MIX MIC:
(phone jack)

sensitivity 1 mV,
impedance 10 kilohms

GAME INPUT:
(phono jacks)

 sensitivity 250 mV,
impedance 47 kilohms

MD (VIDEO) IN:
(phono jack)

sensitivity 450 mV
(250 mV), impedance
47 kilohms

Outputs
DJ MIX SEND*:
(phono jacks)

sensitivity 250 mV,
impedance 1 kilohms

PHONES:
(stereo phone jack)

accepts headphones of
8 ohms or more

MD (VIDEO) OUT:
(phono jacks)

voltage 250 mV
impedance 1 kilohms

FRONT SPEAKER:

accepts impedance of 6 to
16 ohms (SUPER WOOFER)
accepts impedance of 6 to
16 ohms (TWEETER & WOOFER)

* Mexican model only

2

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

0

0

System

Compact disc and digital
audio system

Laser

Semiconductor laser
(

λ=795 nm), Emission

duration: continuous

Frequency response

2 Hz – 20 kHz (

±0.5 dB)

Signal-to-noise ratio

More than 90 dB

Dynamic range

More than 90 dB

CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength:

660 nm

Output level

–18 dBm

Recording system

4-track 2-channel stereo

Frequency response

40 – 13,000 Hz (

±3 dB),

using Sony TYPE I cassette

FM stereo, FM/AM superheterodyne tuner

Tuning range

 87.5 – 108.0 MHz
(50 kHz step)

Antenna

FM lead antenna

Antenna terminals

75 ohms unbalanced

Intermediate frequency

10.7 MHz

Tuning range
Pan- American models:

530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)

Other models:

531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)

Antenna

AM loop antenna

Antenna terminals

External antenna terminal

Intermediate frequency

450 kHz

Power requirements
Mexican model:

120 V AC, 60 Hz

Other models:

120 V, 220 V or 230 – 240 V
AC, 50/60 Hz
Adjustable with voltage selector

Power consumption

320 watts

Dimensions (w/h/d)

Approx. 355 x 425 x 451 mm

Mass :

Approx. 16.4 kg

Supplied accessories:

AM loop antenna (1)
FM lead antenna (1)
Speaker cords (4)
Speaker pads (8)
Remote commander (1)
Batteries (2)

Design and specifications are subject to change without notice.

3

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.

E model

E51 model

Mexican model

Argentina model

4-237-748-6

s

4-237-748-7

s

4-237-748-8

s

4-237-748-9

s

•

Abbreviation
E51

: Chilean and Peruvian model

PART No.

4

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6-1. Circuit Board Location ······················································ 21
6-2. Block Diagram – CD Servo Section – ······························· 22

Block Diagram – Tuner/Tape Deck Section – ··················· 23
Block Diagram – Main Section – ······································ 24
Block Diagram

       – Display/Key Control/Power Supply  Section – ·········· 25

6-3. Printed Wiring Board – BD Section – ······························· 26
6-4. Schematic Diagram – BD Section – ·································· 27
6-5. Printed Wiring Board – Motor, LED Section – ················· 28
6-6. Schematic Diagram –Motor, LED Section – ····················· 28
6-7. Schematic Diagram – MIC/Guitar Section – ····················· 29
6-8. Printed Wiring Board – MIC/Guitar Section – ·················· 29
6-9. Schematic Diagram – Main (1/3) Section – ······················ 30
6-10. Schematic Diagram – Main (2/3) Section – ······················ 31
6-11. Schematic Diagram – Main (3/3) Section – ······················ 32
6-12.Printed Wiring Board – Main Section – ····························· 33

6-13.Printed Wiring Board

   – CD-L,CD-R,Headphone,Front Input,D-SW Section – ·· 34

6-14.Schematic Diagram

   – CD-L,CD-R,Headphone,Front Input,D-SW Section – ·· 35

6-15.Printed Wiring Board – Panel VR Section – ······················ 36
6-16. Schematic Diagram – Panel VR Section – ························ 37
6-17. Printed Wiring Board  – Panel FL,TC-A,TC-B Section – · 38
6-18. Schematic Diagram – Panel FL,TC-A,TC-B Section – ····· 39
6-19. Printed Wiring Board – PA Section – ································ 40
6-20. Schematic Diagram – PA Section – ··································· 41
6-21. Printed Wiring Board – Sub Amp Section – ····················· 42
6-22. Schematic Diagram – Sub Amp Section – ························· 43
6-23. Printed Wiring Board – Trans,Sub Trans Section – ·········· 44
6-24. Schematic Diagram – Trans,Sub Trans Section – ·············· 44
6-25. IC Pin Function Description ············································· 46
6-26. IC Block Diagram ····························································· 51

7-1. Case,Back Panel Section ··················································· 54
7-2. Front Panel Section-1 ························································ 55
7-3. Front Panel Section-2 ························································ 56
7-4. Chassis Section ·································································· 57
7-5. CD Mechanism Deck Section
        (CDM-30BD60C) ······························································· 58
7-6. Base Unit Section (BU-30BD60C) ···································· 59

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