HCD-WZ7AV - Sony Audio Service Manual (repair manual). Page 2

2

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

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2-1. Case ··············································································· 7
2-2. Front Panel Assy ··························································· 8
2-3. PANEL Board, CD-TC Board, ENTER-SW

Board, BACK LIGHT Board, LCD Board ··················· 8

2-4. DPL Board ···································································· 9
2-5. MAIN Board, REGULATOR Board, HP AMP Board ··· 9
2-6. CD mechanism deck (CDM77C-30BD62) ················· 10
2-7. VMP Board ································································· 10
2-8. MIC Board ·································································· 11
2-9. Tray (AU) ···································································· 11
2-10. MS-128 Board ···························································· 12
2-11. Base Unit ···································································· 12
2-12. BD Board, BU-30 (61) Assy ······································· 13

···································································· 14

·································· 15

5-1. Circuit Boards Location ·············································· 16
5-2. Block Diagrams - CD SERVO Section - ···················· 18

- AUDIO/VIDEO Section - ·············· 19
- MAIN Section - ····························· 20

5-3. Printed Wiring Board - BD Section - ·························· 21
5-4. Schematic Diagram - BD Section - ···························· 22
5-5. Printed Wiring Board - VMP Section (SIDE A) - ······· 23
5-6. Printed Wiring Board - VMP Section (SIDE B) - ······· 24
5-7. Schematic Diagram - VMP Section (1/2) - ················· 25
5-8. Schematic Diagram - VMP Section (2/2) - ················· 26
5-9. Printed Wiring Board - MAIN, LOADING Section - ··· 27
5-10. Schematic Diagram

- MAIN, LOADING Section (1/2) - ····························· 28

5-11. Schematic Diagram

- MAIN, LOADING Section (2/2) - ··························· 29

5-12. Printed Wiring Board - PANEL Section - ··················· 30
5-13. Schematic Diagram - PANEL Section - ····················· 31
5-14. Printed Wiring Board - FRONT Section - ·················· 32
5-15. Schematic Diagram - FRONT Section - ····················· 33
5-16. Printed Wiring Board - DPL Section - ························ 34
5-17. Schematic Diagram - DPL Section - ·························· 35
5-18. Printed Wiring Board - REGULATOR Section - ········ 36
5-19. Schematic Diagram - REGULATOR Section - ·········· 37
5-20. IC Block Diagram ······················································· 38
5-21. IC Pin Function Description ······································· 39

6-1. Front Panel Section ····················································· 46
6-2. Chassis Section ···························································· 47
6-3. CD Mechanism Section (CDM77C-30BD62) ············ 48
6-4. Base Unit Section (BU-30BD62) ································ 49

······································· 50

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.

The following caution label is located inside the apparatus.