Read Sony HCD-VP100 Service Manual online
SERVICE MANUAL
Amplifier section
The following measured at 230 V AC, 60 Hz
DIN power output (rated): 27 + 27 W
DIN power output (rated): 27 + 27 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
32 + 32 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
The following measured at 220 V AC, 60 Hz
DIN power output (rated): 23 + 23 W
DIN power output (rated): 23 + 23 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
26 + 26 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Inputs
AUDIO IN MD (VIDEO) (phono jacks):
AUDIO IN MD (VIDEO) (phono jacks):
Sensitivity 500/250 mV,
impedance 47 kilohms
impedance 47 kilohms
MIC IN (minijack):
Sensitivity 1 mV,
impedance 10 kilohms
impedance 10 kilohms
Outputs
OPTICAL DIGITAL OUT (CD):
OPTICAL DIGITAL OUT (CD):
Optical
VIDEO OUT (phono jack):
max. output level 1 Vp-p,
unbalanced, Sync
negative, load impedance
75 ohms
unbalanced, Sync
negative, load impedance
75 ohms
PHONES (stereo minijack):
Accepts headphones with
an impedance of 8 ohms
or more
an impedance of 8 ohms
or more
VIDEO CD/CD player section
System
Compact disc and digital
audio and video system
audio and video system
Laser
Semiconductor laser
(
(
λ = 780 nm)
Emission
duration: continuous
duration: continuous
Wavelength
780 - 790 nm
Video color system format
NTSC, PAL
OPTICAL DIGITAL OUT (CD)
(Square optical connector jack, rear panel)
Wavelength
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
–18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
50 - 13,000 Hz (
±3 dB),
using a Sony TYPE I
cassette
cassette
MICRO Hi-Fi COMPONENT SYSTEM
E Model
SPECIFICATIONS
HCD-VP100
Ver 1.2 2003.07
HCD-VP100 is the Amplifier, Video CD
player, Tape Deck and Tuner section in
CMT-VP100.
player, Tape Deck and Tuner section in
CMT-VP100.
– Continued on next page –
9-873-828-13
Sony Corporation
2003G05-1
Home Audio Company
C
2003.07
Published by Sony Engineering Corporation
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM55F-K6BD42A
Section
Base Unit Name
BU-K6BD42A
Optical Pick-up Block Name
KSM-213DCP
Optical Pick-up Name
KSS-213D
Tape deck
Model Name Using Similar Mechanism
HCD-CP100
Section
2
HCD-VP100
General
Power requirements
110 - 120 V or 220 -
240 V AC , 50/60 Hz
Adjustable with voltage
selector
240 V AC , 50/60 Hz
Adjustable with voltage
selector
Power consumption
75 W
Dimensions (w/h/d)
Approx. 190
×
252
×
345 mm incl. projecting
parts and controls
parts and controls
Mass
Approx. 5.6 kg
Supplied accessories
Remote commander (1)
AM loop antenna (1)
FM wire antenna (1)
Batteries (2)
Video connecting cord (1)
AM loop antenna (1)
FM wire antenna (1)
Batteries (2)
Video connecting cord (1)
Design and specifications are subject to change
without notice.
without notice.
AM tuner section
Tuning range
Middle Eastern and Philippine models:
Middle Eastern and Philippine models:
531 - 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Other models:
530 - 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 - 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 - 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 - 108.0 MHz
(50-kHz step)
(50-kHz step)
Antenna
FM wire antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
TABLE OF CONTENTS
1.
GENERAL
Location of Controls .......................................................
4
Setting the Time ..............................................................
5
2.
DISASSEMBLY
2-1. Disassembly Flow ...........................................................
7
2-2. Cover (Upper) .................................................................
8
2-3. CD Lid .............................................................................
8
2-4. Front Panel Section .........................................................
9
2-5. Tape Mechanism Deck ....................................................
9
2-6. CD Mechanism Deck (CDM55F-K6BD42A),
MPEG Board ................................................................... 10
2-7. Base Unit (BU-K6BD42A) ............................................. 10
2-8. Loading Board ................................................................. 11
2-9. Cam (CDM55) ................................................................ 11
2-8. Loading Board ................................................................. 11
2-9. Cam (CDM55) ................................................................ 11
3.
TEST MODE
.............................................................. 12
4.
ELECTRICAL ADJUSTMENTS
Deck Section ................................................................... 13
CD Section ...................................................................... 13
CD Section ...................................................................... 13
5.
DIAGRAMS
5-1. Block Diagram – CD SERVO Section – ........................ 14
5-2. Block Diagram – MAIN Section – ................................. 15
5-3. Block Diagram
5-2. Block Diagram – MAIN Section – ................................. 15
5-3. Block Diagram
– DISPLAY/POWER SUPPLY Section – ...................... 16
5-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 17
5-5. Printed Wiring Board – CD Board – .............................. 18
5-6. Schematic Diagram – CD Board – ................................. 19
5-7. Printed Wiring Board – TC Board – ............................... 20
5-8. Schematic Diagram – TC Board – .................................. 21
5-9. Schematic Diagram
5-6. Schematic Diagram – CD Board – ................................. 19
5-7. Printed Wiring Board – TC Board – ............................... 20
5-8. Schematic Diagram – TC Board – .................................. 21
5-9. Schematic Diagram
– MAIN (1/2)/LOADING Boards – ............................... 22
5-10. Schematic Diagram – MAIN Board (2/2) – ................... 23
5-11. Printed Wiring Boards
5-11. Printed Wiring Boards
– MAIN/LOADING Boards – ....................................... 24
5-12. Printed Wiring Boards
– SWITCH/TC SWITCH/PRISM Boards – ................... 26
5-13. Schematic Diagram
– SWITCH/TC SWITCH/PRISM Boards – ................... 27
5-14. IC Pin Function Description ........................................... 28
5-15. Printed Wiring Boards
5-15. Printed Wiring Boards
– LCD/HEADPHONE/DIGITAL Boards – ................... 29
5-16. Schematic Diagram
– LCD/HEADPHONE/DIGITAL Boards – ................... 29
5-17. Printed Wiring Board – POWER Board – ...................... 30
5-18. Schematic Diagram – POWER Board – ......................... 31
5-18. Schematic Diagram – POWER Board – ......................... 31
6.
EXPLODED VIEWS
6-1. Cover Section .................................................................. 34
6-2. Front Panel Section ......................................................... 35
6-3. Chassis Section ............................................................... 36
6-4. CD Mechanism Deck (CDM55F-K6BD42A) ................ 37
6-5. Base Unit (BU-K6BD42A) ............................................. 38
6-2. Front Panel Section ......................................................... 35
6-3. Chassis Section ............................................................... 36
6-4. CD Mechanism Deck (CDM55F-K6BD42A) ................ 37
6-5. Base Unit (BU-K6BD42A) ............................................. 38
7.
ELECTRICAL PARTS LIST
............................... 39
3
HCD-VP100
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside the unit.
CAUTION
:
INVISIBLE LASER RADIATION WHEN OPEN AND
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
ADVARSEL :
USYNLIG LASERSTRÅLING VED ÅBNING NÅR
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE
FOR STRÅLING.
FOR STRÅLING.
VORSICHT :
UNSICHTBARE LASERSTRAHLUNG, WENN
ABDECKUNG GEÖFFNET UND SICHEREITSVERRIEGELUNG
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
VARO
!
:
AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-
TIINA NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
VARNING
:
OSYNLING LASERSTRÅLING NÄR DENNA DEL ÄR ÖPPNAD
OCH SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN.
ADVERSEL :
USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG
SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN.
VIGYAZAT
!
:
A BURKOLAT NYITÁSAKOR LÁTHATATLAN LÉZERSU-
GÁRVESZÉLY
!
KERÜLJE A BESUGÁRZÁST
!
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
SERVICE POSITION
In checking the CD block, prepare jig (extension cable J-2501-
011-B).
011-B).
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Connect jig (extension cable J-2501-011-B)
to the MAIN board (CN101) and VCD block (CN502).
to the MAIN board (CN101) and VCD block (CN502).
MAIN board
VCD block
4
HCD-VP100
SECTION 1
GENERAL
• LOCATION OF CONTROLS
– Front View –
)
A
Z
Y
?/1
x
m
M
z
X
Z
u
x
.
>
m
M
1 2
5
8
9
q;
wj
qd
qf
qg
qj
qk
qa
6
3
4
7
ql
w;
wa
wd
wf
wg
wh
ws
qs
qh
BASS 3 (20)
CD EJECT Z qj (9~11)
CD SYNC qs (17, 18)
CD u ws (9~13, 28)
CD x qk (9~13, 26)
CD ./> ql (10~12)
CD m/M ql (10, 11)
DSG 5 (20, 23)
FUNCTION wj (9, 11, 12, 14, 16,
CD EJECT Z qj (9~11)
CD SYNC qs (17, 18)
CD u ws (9~13, 28)
CD x qk (9~13, 26)
CD ./> ql (10~12)
CD m/M ql (10, 11)
DSG 5 (20, 23)
FUNCTION wj (9, 11, 12, 14, 16,
17, 23)
MIC IN jack wg (20)
MIC VOL wf (20)
MIC VOL wf (20)
PBC indicator wd (10, 28)
PHONES jack wh
PLAY MODE wa (9, 11, 12, 18)
Remote sensor 2
REPEAT w; (10, 11)
TAPE EJECT Z 8 (16)
TAPE REC z 6 (17)
TAPE Y 7 (16~18)
TAPE X qa (16~18)
TAPE x 9 (16~18, 26)
TAPE m/M 0 (16)
PHONES jack wh
PLAY MODE wa (9, 11, 12, 18)
Remote sensor 2
REPEAT w; (10, 11)
TAPE EJECT Z 8 (16)
TAPE REC z 6 (17)
TAPE Y 7 (16~18)
TAPE X qa (16~18)
TAPE x 9 (16~18, 26)
TAPE m/M 0 (16)
TREBLE 4 (20)
TUNER BAND qd (14, 26)
TUNING MODE qg (14, 15)
TUNING +/– qf (14, 15)
VOLUME qh (21)
TUNER BAND qd (14, 26)
TUNING MODE qg (14, 15)
TUNING +/– qf (14, 15)
VOLUME qh (21)
BUTTON DESCRIPTIONS
@/1 (power) 1 (7, 14, 18, 21, 23
4
This section is extracted from
instruction manual.
instruction manual.