HCD-V8900, HCD-V8900AV, LBT-V8900AV - Sony Audio Service Manual (repair manual). Page 2

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CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
 damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperatur e of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
 circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
 or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK 
!
 OR DOTTED LINE
WITH MARK 
!
 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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