HCD-V3900, HCD-V5900, LBT-V3900, LBT-V5900 - Sony Audio Service Manual (repair manual). Page 3

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DECK Section ··································································· 18
CD Section ········································································· 21
VIDEO Section ·································································· 22

6-1. Block Diagram — BD Section — ····································· 23
6-2. Block Diagram — VIDEO Section — ······························ 25
6-3. Block Diagram — MAIN Section — ································ 27
6-4. Circuit Board Location ······················································ 29
6-5. Schematic Diagram — BD Section — ······························ 31
6-6. Printed Wiring Board — BD Section — ··························· 33
6-7. Schematic Diagram — CD MOTOR Section — ··············· 35
6-8. Printed Wiring Board — CD MOTOR Section — ············ 37
6-9. Schematic Diagram — AUDIO Section — ······················· 39
6-10. Printed Wiring Board — AUDIO Section — ···················· 41
6-11. Printed Wiring Board — MAIN Section — ······················ 43
6-12. Schematic Diagram — MAIN Section (1/3) — ················ 45
6-13. Schematic Diagram — MAIN Section (2/3) — ················ 47
6-14. Schematic Diagram — MAIN Section (3/3) — ················ 49
6-15. Printed Wiring Board — VIDEO Section — ···················· 51
6-16. Schematic Diagram — VIDEO Section (1/3) — ·············· 53
6-17. Schematic Diagram — VIDEO Section (2/3) — ·············· 55
6-18. Schematic Diagram — VIDEO Section (3/3) — ·············· 57
6-19. Schematic Diagram — PANEL Section — ······················· 59
6-20. Printed Wiring Board — PANEL Section — ···················· 61
6-21. Schematic Diagram — VIDEO OUT Section — ·············· 63
6-22. Printed Wiring Board — VIDEO OUT Section — ··········· 65
6-23. Schematic Diagram — AMP KEY CONTROL Section —67
6-24. Printed Wiring Board

— AMP/KEY CONTROL Section — ······························· 69

6-25. Schematic Diagram — POWER Section — ······················ 71
6-26. Printed Wiring Board — POWER Section — ··················· 73
6-27. IC Pin Function Description ·············································· 74
6-28. IC Block Diagrams ···························································· 83

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The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.