HCD-U1 - Sony Audio Service Manual (repair manual). Page 2

2

Note on Schematic Diagram:
• All capacitors are in 

µ

F unless otherwise noted.  (p: pF)

50 WV or less are not indicated except for electrolytics and
tantalums.

• All resistors are in 

Ω

  and 

1

/

4

 

W or less unless otherwise

specified.

•         

f

: internal component.

•

2

: nonflammable resistor.

•

C

: panel designation.

•

A

: B+ Line.

• Voltages are taken with a VOM (Input impedance 10 M

Ω

).

Voltage variations may be noted due to normal production
tolerances.

• Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal production
tolerances.
No mark: CD PLAY

• Circled numbers refer to waveforms.

• Signal path.

F

: AUDIO

J

: CD

d

: TUNER

f

: USB

Note on Printed Wiring Boards:
•

X

: parts extracted from the component side.

•

Y

: parts extracted from the conductor side.

•        

f

: internal component.

•

: Pattern from the side which enables seeing.

Note: The components identified by mark 

0

 or dotted

line with mark 

0

 are critical for safety.

Replace only with part number specified.

• Indication of transistor.

Caution:
Parts face side:     Parts on the parts face side seen from
(Side A)                 the parts face are indicated.
Pattern face side:  Parts on the pattern face side seen from
(Side B)                 the pattern face are indicated.

•  Lead Layouts

*

Replacement of IC8 on USB board requires a special tool.

• The voltage and waveform of CSP (chip size package) can-

not be measured, because its lead layout is different from
that of conventional IC.

• Abbreviation

E51 : Chilean and Peruvian models

*

Replacement of IC8 on USB board requires a special tool.

B

These are omitted.

C

E

Q

C

B

These are omitted.

E

Q

surface

CSP (Chip Size Package)

Lead layout of conventional IC