HCD-TB10 - Sony Audio Service Manual (repair manual). Page 20

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20
HCD-TB10
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in 
µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
Ω and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
• 2 : nonflammable resistor.
• 1 : fusible resistor.
• C : panel designation.
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
a
: Through hole.
: Pattern from the side which enables seeing.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M
Ω).
Voltage variations may be noted due to normal produc-
tion tolerances.
: Impossible to measure
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
E
: PB
a
: REC
J
: CD (Analog)
c
: CD (Digital)
• Abbreviation
MX
: Mexican model
KR
: Korea model
TW
: Taiwan model.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• Indication of transistor
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
B
These are omitted.
C
E
• Waveforms
2
 
IC601 qd (XT2)
1
 
IC751 rf (XOUT)
2 V/DIV, 10   s/DIV
2 V/DIV, 20 ns/DIV
3
 
IC601 qh (CF2)
2 V/DIV, 40 ns/DIV
5
 
Q209 Collector
(TAPE REC mode)
4
 
IC102 ws (XOUT)
2 V/DIV, 100 ns/DIV
6
 
IC103 qf (XO)
1 V/DIV, 100 ns/DIV
5 V/DIV, 10   s/DIV
4.9 Vp-p
5.9 Vp-p
59 ns
30.5   s
4.5 Vp-p
100 ns
222 ns
5.0 Vp-p
231 ns
13.9 Vp-p
12.6   s
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