Read Sony HCD-SHAKE100 / HCD-SHAKE99 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-SHAKE99/
HCDSHAKE100
HOME AUDIO SYSTEM
9-890-632-05
2015D80-1
©
2015.04
US Model
E Model
Argentina Model
Australian Model
Mexican Model
HCD-SHAKE99
Malaysia Model
Saudi Arabia Model
South African Model
HCDSHAKE100
Ver. 1.4 2015.04
• HCD-SHAKE99 is the tuner, USB, CD Player, Bluetooth, NFC and amplifi er section in SHAKE-99.
• HCDSHAKE100 is the tuner, USB, DVD Player, Bluetooth, NFC and amplifi er section in SHAKE-100D.
• HCDSHAKE100 is the tuner, USB, DVD Player, Bluetooth, NFC and amplifi er section in SHAKE-100D.
SPECIFICATIONS
CD/DVD Section
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM90-DVBU202//M
Optical Pick-up Name
CMS-S76RFS7G
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(US model only)
DISTORTION:
(US model only)
With 10 ohm loads, both channels driven, from
100 – 3,000 Hz; rated 500 watts per channel
minimum RMS power, with no more than 0.7%
total harmonic distortion from 250 milliwatts
to rated output.
100 – 3,000 Hz; rated 500 watts per channel
minimum RMS power, with no more than 0.7%
total harmonic distortion from 250 milliwatts
to rated output.
Amplifi er section
The following are measured at
US model:
The following are measured at
US model:
AC 120 V, 60 Hz
MX model:
AC 120 V – 240 V, 60 Hz
AR model (SHAKE-99):
AC 220 V – 240 V, 50/60 Hz
E51 model:
AC 220 V – 240 V, 50 Hz
AUS model (SHAKE-99):
AC 230 V – 240 V, 50/60Hz
Other models:
AC 120 V – 240 V, 50/60 Hz
WF (Woofers)
Power Output (rated):
700 W + 700 W (at 10 ohms, 1 kHz,
1%
THD)
RMS output power (reference):
900 W + 900 W (per channel at
10 ohms, 1 kHz)
MID (Mid speakers)/TW (Tweeters)
RMS output power (reference):
300 W + 300 W (per channel at
8 ohms, 2 kHz)
SW (Subwoofers)
RMS output power (reference):
1,200 W + 1,200 W (per channel at
8 ohms, 100 Hz)
Inputs
AUDIO IN 1/PARTY CHAIN IN L/R
AUDIO IN 1/PARTY CHAIN IN L/R
Voltage 2 V, impedance 47 kilohms
AUDIO IN 2 L/R
Voltage 2 V, impedance 47 kilohms
MIC
Sensitivity 1 mV, impedance 10 kilohms
(USB) A,
(USB) B port
Type
A
Outputs
AUDIO OUT/PARTY CHAIN OUT L/R
AUDIO OUT/PARTY CHAIN OUT L/R
Voltage 2 V, impedance 1 kilohm
VIDEO OUT (SHAKE-100D)
Max. output level 1 Vp-p, unbalanced,
Sync. negative load impedance
75
ohms
USB section
Supported bit rate
WMA:
Supported bit rate
WMA:
48 kbps – 192 kbps, VBR, CBR
AAC:
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
WMA: 44.1 kHz
AAC: 44.1 kHz
Supported USB device
Mass Storage Class
Maximum current
500
500
mA
Disc/USB section
Supported bit rate
MPEG1
Supported bit rate
MPEG1
Layer-3:
32 kbps – 320 kbps, VBR
MPEG2
Layer-3:
8 kbps – 160 kbps, VBR
MPEG1
Layer-2:
32 kbps – 384 kbps, VBR
Sampling frequencies
MPEG1
MPEG1
Layer-3:
32 kHz/44.1 kHz/48 kHz
MPEG2
Layer-3:
16 kHz/22.05 kHz/24 kHz
MPEG1
Layer-2:
32 kHz/44.1 kHz/48 kHz
Disc player section
System
System
Compact disc and digital audio and
video system (SHAKE-100D)
video system (SHAKE-100D)
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value
measurement at a distance of
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Video color system format (SHAKE-100D)
NTSC and PAL
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
FM tuner section
Tuning range
US
Tuning range
US
model:
87.5 MHz – 108.0 MHz
(100 kHz step)
Other
models:
87.5 MHz – 108.0 MHz
(50 kHz step)
AM tuner section
Tuning range
Tuning range
AUS, E2, E51, US, CND, MX, AR
models:
models:
531 kHz – 1,710 kHz (9 kHz step)
530 kHz – 1,710 kHz (10 kHz step)
Other
models:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)
Bluetooth section
Communication system
Communication system
Bluetooth Standard version 3.1
Output
Bluetooth Standard Power Class 2
Maximum communication range
Line of sight approx. 10m
1)
Frequency band (SHAKE-100D)
2.4 GHz band (2.4000 GHz –
2.4835
GHz)
Modulation method (SHAKE-100D)
FHSS (Freq Hopping Spread
Spectrum)
Compatible Bluetooth profiles
2)
(SHAKE-100D)
A2DP (Advanced Audio Distribu-
tion Profile)
tion Profile)
AVRCP 1.3 (Audio Video Remote
Control Profile)
Control Profile)
Supported codecs (SHAKE-100D)
SBC (Sub Band Codec)
AAC (Advanced Audio Coding)
1)
The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2)
Bluetooth standard profiles indicate the
purpose of Bluetooth communication
between devices.
between devices.
Speakers
SS-SHAKE100 for SHAKE-100D
SS-SHAKE99 for SHAKE-99
Speaker system
SS-SHAKE99 for SHAKE-99
Speaker system
4-way, Sound Pressure Horn and Bass
Refl ex
Speaker unit
Speaker unit
Woofers: 250 mm (9
7
⁄
8
in), cone type
Tweeters: 25 mm (1 in), horn type
Mid speakers: 100 mm (4 in), cone
type
Subwoofers: 460 mm (18 in), cone
type
Rated impedance
Rated impedance
Mid speakers/tweeters: 8 ohms
Woofers: 10 ohms
Subwoofers: 8 ohms
Dimensions (w/h/d) (Approx.)
610 mm × 945 mm × 500 mm
(24
1
⁄
8
in × 37
1
⁄
4
in × 19
3
⁄
4
in)
Mass (Approx.)
51.0 kg (112 lb 7 oz)
Quantity: 2 pieces
5.04
– Continued on next page –
Photo: HCD-SHAKE99
HCD-SHAKE99/HCDSHAKE100
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
• Abbreviation
AR :
AR :
Argentina
model
AUS :
Australian
model
E2
: 120V AC area in E model
E51
: Chilean and Peruvian models
EA
: Saudi Arabia model
MX
: Mexican model
MY
: Malaysia model
SAF
: South African model
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig.
A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
General
Power requirements
US
Power requirements
US
model:
AC 120 V, 60 Hz
MX
model:
AC 120 V – 240 V, 60 Hz
AR model (SHAKE-99):
AC 220 V – 240 V, 50/60 Hz
E51
model:
AC 220 V – 240 V, 50 Hz
AUS model (SHAKE-99):
AC 230 V – 240 V, 50/60Hz
Other
models:
AC 120 V – 240 V, 50/60 Hz
Power consumption
700
700
W
Power consumption (at the Power Saving mode)
0.5 W (When “BT STANDBY” is set to “STANDBY OFF”)
4 W (When “BT STANDBY” is set to “STANDBY ON”)
Dimensions (w/h/d) (excl. speakers)
(Approx.)
(Approx.)
500 mm × 220 mm × 380 mm
(19
3
⁄
4
in × 8
3
⁄
4
in × 15 in)
Mass (excl. speakers) (Approx.)
10.0 kg (22 lb 1 oz)
Supplied accessories
Remote control (1)
R6 (Size AA) batteries (2)
FM lead/AM loop antenna (1)
Video cord (1) (SHAKE-100D)
Design and specifi cations are subject to change without notice.
License and Trademark Notice
•
•
is a trademark of DVD Format/Logo Licensing Corporation.
•
“DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”,
and the “CD” logos are trademarks.
and the “CD” logos are trademarks.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is either a registered trademark or trademark of
Microsoft Corporation in the United States and/or other countries.
• This product is protected by certain intellectual property rights
of Microsoft Corporation. Use or distribution of such technology
outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
• “WALKMAN” and “WALKMAN” logo are registered trademarks
of Sony Corporation.
• This system incorporates Dolby* Digital.
*
Manufactured under license from Dolby Laboratories.
Dolby and the double-D symbol are trademarks of Dolby
Laboratories.
Laboratories.
•
The Bluetooth
®
word mark and logos are registered trademarks
owned by Bluetooth SIG, Inc. and any use of such marks by Sony
Corporation is under license. Other trademarks and trade names
are those of their respective owners.
Corporation is under license. Other trademarks and trade names
are those of their respective owners.
• The N Mark is a trademark or registered trademark of NFC Forum,
Inc. in the United States and in other countries.
• Android™ is a trademark of Google Inc.
• Google Play™ is a trademark of Google Inc.
• iPhone and iPod touch are trademarks of Apple Inc., registered in
the U.S. and other countries. App Store is a service mark of Apple
Inc.
Inc.
•
“Made for iPod” and “Made for iPhone” mean that an
electronic accessory has been designed to connect specifically
to iPod or iPhone, respectively, and has been certified by the
developer to meet Apple performance standards. Apple is not
responsible for the operation of this device or its compliance
with safety and regulatory standards. Please note that the use
of this accessory with iPod or iPhone may affect wireless
performance.
electronic accessory has been designed to connect specifically
to iPod or iPhone, respectively, and has been certified by the
developer to meet Apple performance standards. Apple is not
responsible for the operation of this device or its compliance
with safety and regulatory standards. Please note that the use
of this accessory with iPod or iPhone may affect wireless
performance.
• THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL
PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND
NON-COMMERCIAL USE OF A CONSUMER FOR
NON-COMMERCIAL USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE WITH THE MPEG-
4 VISUAL STANDARD (“MPEG-4 VIDEO”)
AND/OR
(ii) DECODING MPEG-4 VIDEO THAT WAS ENCODED BY
A CONSUMER ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS OBTAINED
FROM A VIDEO PROVIDER LICENSED TO PROVIDE
MPEG-4 VIDEO.
COMMERCIAL ACTIVITY AND/OR WAS OBTAINED
FROM A VIDEO PROVIDER LICENSED TO PROVIDE
MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL BE IMPLIED FOR
ANY OTHER USE. ADDITIONAL INFORMATION INCLUDING
THAT RELATING TO PROMOTIONAL, INTERNAL AND COM-
MERCIAL USES AND LICENSING MAY BE OBTAINED FROM
MPEG LA, L.L.C.
HTTP://WWW.MPEGLA.COM
ANY OTHER USE. ADDITIONAL INFORMATION INCLUDING
THAT RELATING TO PROMOTIONAL, INTERNAL AND COM-
MERCIAL USES AND LICENSING MAY BE OBTAINED FROM
MPEG LA, L.L.C.
HTTP://WWW.MPEGLA.COM
•
All other trademarks and registered trademarks are of their
respective holders. In this manual, ™ and ® marks are not
specifi ed.
respective holders. In this manual, ™ and ® marks are not
specifi ed.
Ver. 1.2
HCD-SHAKE99/HCDSHAKE100
3
1.
SERVICING NOTES
............................................. 4
2. DISASSEMBLY
2-1. Panel, Top, Case, Top, Panel, Side-L Assy,
Panel, Side-R Assy .......................................................... 9
2-2. Back Panel Section ......................................................... 10
2-3. Panel, Loading Assy ....................................................... 10
2-4. CDM90-DVBU202//M ................................................... 11
2-5. Front Panel Section ......................................................... 11
2-6. MOTHERBOARD Board ............................................... 12
2-7. 10CH DAMP Board ........................................................ 12
2-8. SWITCHING REGULATOR ......................................... 13
2-9. Service, Optical Device(7G), Cable, Flexible Flat ......... 14
2-3. Panel, Loading Assy ....................................................... 10
2-4. CDM90-DVBU202//M ................................................... 11
2-5. Front Panel Section ......................................................... 11
2-6. MOTHERBOARD Board ............................................... 12
2-7. 10CH DAMP Board ........................................................ 12
2-8. SWITCHING REGULATOR ......................................... 13
2-9. Service, Optical Device(7G), Cable, Flexible Flat ......... 14
3.
TEST MODE
............................................................ 15
4.
ELECTRICAL CHECK
......................................... 20
5. TROUBLESHOOTING
.......................................... 21
6. DIAGRAMS
6-1. Block Diagram - RS SERVO, USB Section - ................. 27
6-2. Block Diagram - MAIN Section - ................................... 28
6-3. Block Diagram - AMP Section (1/2) - ............................ 29
6-4. Block Diagram - AMP Section (2/2) - ............................ 30
6-5. Block
6-2. Block Diagram - MAIN Section - ................................... 28
6-3. Block Diagram - AMP Section (1/2) - ............................ 29
6-4. Block Diagram - AMP Section (2/2) - ............................ 30
6-5. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 31
6-6. Printed
Wiring
Board
- MOTHERBOARD Board (Component Side) - ............ 33
6-7. Printed
Wiring
Board
- MOTHERBOARD Board (Conductor Side) - ............. 34
6-8. Schematic
Diagram
- MOTHERBOARD Board (1/9) - ................................. 35
6-9. Schematic
Diagram
- MOTHERBOARD Board (2/9) - ................................. 36
6-10. Schematic Diagram
- MOTHERBOARD Board (3/9) - ................................. 37
6-11. Schematic Diagram
- MOTHERBOARD Board (4/9) - ................................. 38
6-12. Schematic Diagram
- MOTHERBOARD Board (5/9) - ................................. 39
6-13. Schematic Diagram
- MOTHERBOARD Board (6/9) - ................................. 40
6-14. Schematic Diagram
- MOTHERBOARD Board (7/9) - ................................. 41
6-15. Schematic Diagram
- MOTHERBOARD Board (8/9) - ................................. 42
6-16. Schematic Diagram
- MOTHERBOARD Board (9/9) - ................................. 43
TABLE OF CONTENTS
6-17. Printed Wiring Board
- 10CH DAMP Board (Component Side) - ..................... 44
6-18. Printed Wiring Board
- 10CH DAMP Board (Conductor Side) - ...................... 45
6-19. Schematic Diagram - 10CH DAMP Board (1/4) - .......... 46
6-20. Schematic Diagram - 10CH DAMP Board (2/4) - .......... 47
6-21. Schematic Diagram - 10CH DAMP Board (3/4) - .......... 48
6-22. Schematic Diagram - 10CH DAMP Board (4/4) - .......... 49
6-23. Printed Wiring Board - DISPLAY Board - ..................... 50
6-24. Schematic Diagram - DISPLAY Board - ........................ 51
6-25. Printed Wiring Board - VOLUME Board - ..................... 52
6-26. Schematic Diagram - VOLUME Board - ....................... 53
6-27. Printed Wiring Board -
6-20. Schematic Diagram - 10CH DAMP Board (2/4) - .......... 47
6-21. Schematic Diagram - 10CH DAMP Board (3/4) - .......... 48
6-22. Schematic Diagram - 10CH DAMP Board (4/4) - .......... 49
6-23. Printed Wiring Board - DISPLAY Board - ..................... 50
6-24. Schematic Diagram - DISPLAY Board - ........................ 51
6-25. Printed Wiring Board - VOLUME Board - ..................... 52
6-26. Schematic Diagram - VOLUME Board - ....................... 53
6-27. Printed Wiring Board -
BUTTON LEFT Board - ........... 54
6-28. Schematic Diagram -
BUTTON LEFT Board -.............. 55
6-29. Printed Wiring Board -
BUTTON RIGHT Board - ........ 56
6-30. Schematic Diagram -
BUTTON RIGHT Board - ........... 57
6-31. Printed Wiring Board -
MIC Board - .............................. 57
6-32. Schematic Diagram -
MIC Board - ................................. 58
6-33. Printed Wiring Board -
USB Board - .............................. 58
6-34. Schematic Diagram -
USB Board - ................................ 59
6-35. Printed Wiring Boards -
TUNER Board - ...................... 60
6-36. Schematic Diagram -
TUNER Board - ........................... 61
6-37. Printed Wiring Boards -
LED BAR Boards - ................. 62
6-38. Schematic Diagram -
LED BAR Boards - ...................... 63
6-39. Printed Wiring Board
-
VIDEO Board (HCDSHAKE100) - ............................. 64
6-40. Schematic Diagram
-
VIDEO Board (HCDSHAKE100) - ............................. 64
7.
EXPLODED VIEWS
7-1. Side Panel Section .......................................................... 80
7-2. Back Panel Section ......................................................... 81
7-3. Front Panel Section ......................................................... 82
7-4. MOTHERBOARD Board Section .................................. 83
7-5. Chassis
7-2. Back Panel Section ......................................................... 81
7-3. Front Panel Section ......................................................... 82
7-4. MOTHERBOARD Board Section .................................. 83
7-5. Chassis
Section
............................................................... 84
7-6. CD Mechanism Section (CDM90-DVBU202//M) ......... 85
8.
ELECTRICAL PARTS LIST
.............................. 86
Ver. 1.4
HCD-SHAKE99/HCDSHAKE100
4
SECTION 1
SERVICING NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during
• Keep the temperature of the soldering iron around 270 °C
during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or
or
unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
This appliance is classifi ed as a CLASS 1 LASER product by
IEC60825-1:2007. This marking is located on the rear exterior.
IEC60825-1:2007. This marking is located on the rear exterior.
MODEL IDENTIFICATION
- BACK PANEL -
Model
Part No.
AR, AUS, E2, E51
4-479-318-0[]
US
4-479-318-1[]
MX
4-479-318-2[]
EA, MY, SAF
4-479-318-3[]
• Abbreviation
AR :
AR :
Argentina
model
AUS :
Australian
model
E2
: 120V AC area in E model
E51
: Chilean and Peruvian models
EA
: Saudi Arabia model
MX
: Mexican model
MY
: Malaysia model
SAF : South African model
PLAYABLE DISCS
• AUDIO
• AUDIO
CD
• CD-R/CD-RW/DVD-R/DVD-RW
–
–
audio
data
–
MP3
fi les that conforms to ISO9660 Level 1/Level 2, or
Joliet (expansion format).
Notes
• MP3 (MPEG 1 Audio Layer-3) is a standard format defi ned
• MP3 (MPEG 1 Audio Layer-3) is a standard format defi ned
by ISO (International Organization for Standardization) which
compresses audio data. MP3 fi les must be in MPEG 1 Audio
Layer-3 format.
compresses audio data. MP3 fi les must be in MPEG 1 Audio
Layer-3 format.
• The system can only play back MP3 fi les that have a fi le
extension of “.mp3”.
NOTE OF REPLACING THE IC001, IC002, IC105, IC106,
IC301 (HCDSHAKE100) AND IC302 (HCDSHAKE100)
ON THE MOTHERBOARD BOARD
IC001, IC002, IC105, IC106, IC301 (HCDSHAKE100) and
IC302 (HCDSHAKE100) on the MOTHERBOARD board cannot
exchange with single. When these parts on the MOTHERBOARD
board are damaged, exchange the entire mounted board.
IC301 (HCDSHAKE100) AND IC302 (HCDSHAKE100)
ON THE MOTHERBOARD BOARD
IC001, IC002, IC105, IC106, IC301 (HCDSHAKE100) and
IC302 (HCDSHAKE100) on the MOTHERBOARD board cannot
exchange with single. When these parts on the MOTHERBOARD
board are damaged, exchange the entire mounted board.
NOTE OF REPLACEMENT OF THE MS-476 BOARD
When the MS-476 board is defective, exchange the entire
LOADING COMPLETE ASSY (T).
When the MS-476 board is defective, exchange the entire
LOADING COMPLETE ASSY (T).
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of a demonstration disc
in the store is equipped.
The disc tray lock function for the antitheft of a demonstration disc
in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[
\
/1
] button to turn the power on.
2. Press the [CD](SHAKE99)/[DVD/CD](HCDSHAKE100) button
to select CD/DVD function.
3. Press the [
x
] button and [
/+] button simultaneously and
hold down for around 5 seconds.
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[
\
/1
]
button.
PART No.
Ver. 1.4