HCD-S20 - Sony Audio Service Manual (repair manual)

hcd-s20 service manual
Model
HCD-S20
Pages
40
Size
4.51 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-s20.pdf
Date

Read Sony HCD-S20 Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-S20
SPECIFICATIONS
COMPACT DISC RECEIVER
9-893-739-03
2015E33-1
© 
2015.05
E Model
Ver. 1.2  2015.05
•  HCD-S20 is compact disc receiver in CMT-S20.
Model Name Using Similar Mechanism
NEW
Mechanism Type
TDL-5
Amplifier section
Power output (rated): 4 watts + 4 watts 
(8 ohms at 1 kHz, 1% THD)
Continuous RMS power output (reference): 
5 watts + 5 watts (8 ohms at 1 kHz, 10% THD)
Input
AUDIO IN (stereo mini jack): Sensitivity 1 V, 
impedance 50 kilohms
Outputs
SPEAKERS: Accepts impedance of 8 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
*  This output is the value measurement at a distance of 
200mm from the objective lens surface on the Optical 
Pick-up Block with 7mm aperture.
Frequency response: 20 Hz 
 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
FM stereo, FM superheterodyne tuner
Antenna: FM lead antenna
Tuning range: 87.5 MHz   108.0 MHz (50 kHz 
step)
USB section
 (USB) port: Type A, maximum current 500 mA
Supported audio formats
Supported bit rate:
MP3 (MPEG 1 Audio Layer-3): 32 kbps 
320 kbps, VBR
WMA: 32 kbps   192 kbps, VBR
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
General
Except Korean model:
Power requirements: AC 120 V   240 V, 50/60 Hz
Korean model:
Power requirements: AC 220 V   240 V, 50/60 Hz
Power consumption: 18 watts
Dimensions (W/H/D, including largest 
protrusions) (excl. speakers):
Approx. 170 mm × 133 mm × 240 mm
Mass (excl. speakers): Approx. 1.3 kg
Quantity of the main unit: 1 piece
Design and specifications are subject to change 
without notice.
Standby power consumption: 0.5 W
  Halogena ted flame retardants are not used in 
the certain printed wiring boards.
HCD-S20
2
1. 
SERVICING  NOTES 
 .............................................  
3
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   7
2-2.  Top Cover Assy S20........................................................   7
2-3.  Power Cord (AC1), Rear Panel .......................................   8
2-4.  CD Door (S20) ................................................................   8
2-5.  Loader (TDL-5) & OPU Assy (CDM1) ..........................   9
2-6.  Front Panel Block ...........................................................   9
2-7. VFD 
Board 
......................................................................  10
2-8. USB 
Board 
......................................................................  10
2-9. MAIN 
Board 
...................................................................  11
2-10. POWER Board ................................................................   11
3. 
TEST  MODE 
 ............................................................   12
4. 
ELECTRICAL  CHECK 
 .........................................   13
5. TROUBLESHOOTING 
 ..........................................   14
6. DIAGRAMS
6-1. Block 
Diagram 
................................................................  16
6-2.  Board Component Diagram (1/3) ...................................   17
6-3.  Board Component Diagram (2/3) ...................................   18
6-4.  Board Component Diagram (3/3) ...................................   19
6-5.  Printed Wiring Board - MAIN Board - ...........................   21
6-6.  Schematic Diagram - MAIN Board (1/6) - .....................   22
6-7.  Schematic Diagram - MAIN Board (2/6) - .....................   23
6-8.  Schematic Diagram - MAIN Board (3/6) - .....................   24
6-9.  Schematic Diagram - MAIN Board (4/6) - .....................   25
6-10.  Schematic Diagram - MAIN Board (5/6) - .....................   26
6-11.  Schematic Diagram - MAIN Board (6/6) - .....................   27
6-12.  Printed Wiring Board - USB Board - ..............................   28
6-13.  Schematic Diagram - USB Board - .................................   29
6-14.  Printed Wiring Board - VFD Board - ..............................   30
6-15.  Schematic Diagram - VFD Board - ................................   31
6-16.  Printed Wiring Board - KEY Board -..............................   32
6-17.  Schematic Diagram - KEY Board - ................................   33
6-18.  Schematic Diagram - POWER Board - ..........................   34
6-19.  Printed Wiring Board - POWER Board - ........................   35
7. 
EXPLODED  VIEWS
7-1.  Top Cover Section...........................................................   36
7-2. Chassis 
Section 
...............................................................  37
7-3.  Front Panel Section .........................................................   38
TABLE  OF  CONTENTS
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HCD-S20
3
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
ABOUT  PART  REPAIR  OF  EACH  BOARD
The part that mounted on each board cannot exchange. When the 
mounted part is damaged, exchange with the complete mounted 
board or part including complete mounted board.
Printed wiring board and schematic diagram that have been de-
scribed on this service manual are for reference.
TEST  DISCS
Use following TEST DISC (for CD) when this unit confi rms the 
operation and checks it.
Part No.
   
Description
3-702-101-01 DISC 
(YEDS-18), 
TEST
4-225-203-01 DISC 
(PATD-012), 
TEST
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of sample disc in the 
shop is equipped.
Releasing Procedure:
1.  Press the [
?/1
] button to turn the power on.
2.  Press two buttons of the [x] on the remote commander and 
[Z] on the main unit simultaneously for fi ve seconds.
3.  The message “UNLOCKED” is displayed on the fluorescent 
indicator tube and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the disc tray lock is not released by 
turning power on/off with the [?/1] button.
CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• POWER 
Board
 
CE501, CE502, CE534
– POWER Board (Conductor Side) –
800 
:/2 W
(for CE501)
800 
:/2 W
(for CE502)
800 
:/2 W
(for CE534)
HCD-S20
4
MODEL  IDENTIFICATION
Distinguish by model number label stuck on the rear side of a main unit.
MODEL NUMBER LABEL
05/2013
110 – 240V AC area in E model (E32)
Singapore model (SP1)
Saudi Arabia model (EA3)
 Argentina model (AR2)
Mexican model (MX2)
Korean model (KR2)
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Here you can read online and download Sony HCD-S20 Service Manual in PDF. HCD-S20 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony HCD-S20 Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.