Read Sony HCD-S20 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-S20
SPECIFICATIONS
COMPACT DISC RECEIVER
9-893-739-03
2015E33-1
©
2015.05
E Model
Ver. 1.2 2015.05
• HCD-S20 is compact disc receiver in CMT-S20.
Model Name Using Similar Mechanism
NEW
Mechanism Type
TDL-5
Amplifier section
Power output (rated): 4 watts + 4 watts
(8 ohms at 1 kHz, 1% THD)
Continuous RMS power output (reference):
5 watts + 5 watts (8 ohms at 1 kHz, 10% THD)
(8 ohms at 1 kHz, 1% THD)
Continuous RMS power output (reference):
5 watts + 5 watts (8 ohms at 1 kHz, 10% THD)
Input
AUDIO IN (stereo mini jack): Sensitivity 1 V,
impedance 50 kilohms
impedance 50 kilohms
Outputs
SPEAKERS: Accepts impedance of 8 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of
200mm from the objective lens surface on the Optical
Pick-up Block with 7mm aperture.
Pick-up Block with 7mm aperture.
Frequency response: 20 Hz
20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
FM stereo, FM superheterodyne tuner
Antenna: FM lead antenna
Tuning range: 87.5 MHz 108.0 MHz (50 kHz
step)
Antenna: FM lead antenna
Tuning range: 87.5 MHz 108.0 MHz (50 kHz
step)
USB section
(USB) port: Type A, maximum current 500 mA
Supported audio formats
Supported bit rate:
MP3 (MPEG 1 Audio Layer-3): 32 kbps
320 kbps, VBR
WMA: 32 kbps 192 kbps, VBR
320 kbps, VBR
WMA: 32 kbps 192 kbps, VBR
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
WMA: 44.1 kHz
General
Except Korean model:
Power requirements: AC 120 V 240 V, 50/60 Hz
Korean model:
Power requirements: AC 220 V 240 V, 50/60 Hz
Power consumption: 18 watts
Dimensions (W/H/D, including largest
protrusions) (excl. speakers):
Power requirements: AC 120 V 240 V, 50/60 Hz
Korean model:
Power requirements: AC 220 V 240 V, 50/60 Hz
Power consumption: 18 watts
Dimensions (W/H/D, including largest
protrusions) (excl. speakers):
Approx. 170 mm × 133 mm × 240 mm
Mass (excl. speakers): Approx. 1.3 kg
Quantity of the main unit: 1 piece
Quantity of the main unit: 1 piece
Design and specifications are subject to change
without notice.
without notice.
Standby power consumption: 0.5 W
Halogena ted flame retardants are not used in
the certain printed wiring boards.
HCD-S20
2
1.
SERVICING NOTES
.............................................
3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 7
2-2. Top Cover Assy S20........................................................ 7
2-3. Power Cord (AC1), Rear Panel ....................................... 8
2-4. CD Door (S20) ................................................................ 8
2-5. Loader (TDL-5) & OPU Assy (CDM1) .......................... 9
2-6. Front Panel Block ........................................................... 9
2-7. VFD
2-3. Power Cord (AC1), Rear Panel ....................................... 8
2-4. CD Door (S20) ................................................................ 8
2-5. Loader (TDL-5) & OPU Assy (CDM1) .......................... 9
2-6. Front Panel Block ........................................................... 9
2-7. VFD
Board
...................................................................... 10
2-8. USB
Board
...................................................................... 10
2-9. MAIN
Board
................................................................... 11
2-10. POWER Board ................................................................ 11
3.
TEST MODE
............................................................ 12
4.
ELECTRICAL CHECK
......................................... 13
5. TROUBLESHOOTING
.......................................... 14
6. DIAGRAMS
6-1. Block
Diagram
................................................................ 16
6-2. Board Component Diagram (1/3) ................................... 17
6-3. Board Component Diagram (2/3) ................................... 18
6-4. Board Component Diagram (3/3) ................................... 19
6-5. Printed Wiring Board - MAIN Board - ........................... 21
6-6. Schematic Diagram - MAIN Board (1/6) - ..................... 22
6-7. Schematic Diagram - MAIN Board (2/6) - ..................... 23
6-8. Schematic Diagram - MAIN Board (3/6) - ..................... 24
6-9. Schematic Diagram - MAIN Board (4/6) - ..................... 25
6-10. Schematic Diagram - MAIN Board (5/6) - ..................... 26
6-11. Schematic Diagram - MAIN Board (6/6) - ..................... 27
6-12. Printed Wiring Board - USB Board - .............................. 28
6-13. Schematic Diagram - USB Board - ................................. 29
6-14. Printed Wiring Board - VFD Board - .............................. 30
6-15. Schematic Diagram - VFD Board - ................................ 31
6-16. Printed Wiring Board - KEY Board -.............................. 32
6-17. Schematic Diagram - KEY Board - ................................ 33
6-18. Schematic Diagram - POWER Board - .......................... 34
6-19. Printed Wiring Board - POWER Board - ........................ 35
6-3. Board Component Diagram (2/3) ................................... 18
6-4. Board Component Diagram (3/3) ................................... 19
6-5. Printed Wiring Board - MAIN Board - ........................... 21
6-6. Schematic Diagram - MAIN Board (1/6) - ..................... 22
6-7. Schematic Diagram - MAIN Board (2/6) - ..................... 23
6-8. Schematic Diagram - MAIN Board (3/6) - ..................... 24
6-9. Schematic Diagram - MAIN Board (4/6) - ..................... 25
6-10. Schematic Diagram - MAIN Board (5/6) - ..................... 26
6-11. Schematic Diagram - MAIN Board (6/6) - ..................... 27
6-12. Printed Wiring Board - USB Board - .............................. 28
6-13. Schematic Diagram - USB Board - ................................. 29
6-14. Printed Wiring Board - VFD Board - .............................. 30
6-15. Schematic Diagram - VFD Board - ................................ 31
6-16. Printed Wiring Board - KEY Board -.............................. 32
6-17. Schematic Diagram - KEY Board - ................................ 33
6-18. Schematic Diagram - POWER Board - .......................... 34
6-19. Printed Wiring Board - POWER Board - ........................ 35
7.
EXPLODED VIEWS
7-1. Top Cover Section........................................................... 36
7-2. Chassis
7-2. Chassis
Section
............................................................... 37
7-3. Front Panel Section ......................................................... 38
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HCD-S20
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ABOUT PART REPAIR OF EACH BOARD
The part that mounted on each board cannot exchange. When the
mounted part is damaged, exchange with the complete mounted
board or part including complete mounted board.
Printed wiring board and schematic diagram that have been de-
scribed on this service manual are for reference.
The part that mounted on each board cannot exchange. When the
mounted part is damaged, exchange with the complete mounted
board or part including complete mounted board.
Printed wiring board and schematic diagram that have been de-
scribed on this service manual are for reference.
TEST DISCS
Use following TEST DISC (for CD) when this unit confi rms the
operation and checks it.
Use following TEST DISC (for CD) when this unit confi rms the
operation and checks it.
Part No.
Description
3-702-101-01 DISC
(YEDS-18),
TEST
4-225-203-01 DISC
(PATD-012),
TEST
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of sample disc in the
shop is equipped.
The disc tray lock function for the antitheft of sample disc in the
shop is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. Press two buttons of the [x] on the remote commander and
[Z] on the main unit simultaneously for fi ve seconds.
3. The message “UNLOCKED” is displayed on the fluorescent
indicator tube and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the disc tray lock is not released by
turning power on/off with the [?/1] button.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• POWER
Board
CE501, CE502, CE534
– POWER Board (Conductor Side) –
800
:/2 W
(for CE501)
800
:/2 W
(for CE502)
800
:/2 W
(for CE534)
HCD-S20
4
MODEL IDENTIFICATION
Distinguish by model number label stuck on the rear side of a main unit.
Distinguish by model number label stuck on the rear side of a main unit.
MODEL NUMBER LABEL
05/2013
110 – 240V AC area in E model (E32)
Singapore model (SP1)
Saudi Arabia model (EA3)
Argentina model (AR2)
Mexican model (MX2)
Korean model (KR2)