HCD-RV777D, HCD-RV888D, HCD-RV999D, MHC-RV777D, MHC-RV888D, MHC-RV999D - Sony Audio Service Manual (repair manual). Page 3

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Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270°C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

This set has a disc tray lock function to prevent discs for
demonstration at shops from theft. While this lock function is set,
the tray will not be delivered out even when the OPEN/CLOSE
button is pressed.

Press the OPEN/CLOSE button while pressing the STOP button.
After a few seconds, the message “LOCKED” will appear on the
fluorescent indicator tube with the tray locked.

Just as the lock is set, press the OPEN/CLOSE button while
pressing the STOP button.
After a few seconds, the message “UNLOCKED” will appear with
the lock released.

Carry out the “S curve check” in “DVD section adjustment” and
check that the S curve waveforms is output three times.

When replacing the DMB07 board, since the adjustment value is
not set up correctly, “Drive Auto Adjustment” can’t be performed.
In this case, initialize Memory in the following procedures.

Procedure:
1. Set the test mode. (See page 22)
2. Press the [2] key of the remote commander, and set the “DRIVE

MANUAL OPERATION”. (See page 27)

3. Press the [6]  key of the remote commander, and set the “2-6,

Memory Check”. (See page 29)

4. Press the [CLEAR] key of the remote commander, and initialize

Memory.

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 

°C.

Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.

This appliance is
claassified as a CLASS 1
LASER product. This
label is located on the
rear exterior.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.