HCD-RG66, MHC-RG66 - Sony Audio Service Manual (repair manual). Page 2

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2-1. Case (Top) ····································································· 5
2-2. CD Door ········································································ 6
2-3. Front Panel Section ······················································· 6
2-4. CD Mechanism Deck (CDM58F-K6A) ························ 7
2-5. Tape Mechanism Deck (CWL43RR-51) ······················ 7
2-6. MIC Board, PANEL Board, REM Board ····················· 8
2-7. KEYBOARD Board ····················································· 8
2-8. Back Panel Section ······················································· 9
2-9. SUB TRANS Board, VIDEO OUT Board,

SENSOR Board, SURROUND Board ·························· 9

2-10. MAIN Board ······························································· 10
2-11. POWER Board ···························································· 10
2-12. TRANS Board ···························································· 11
2-13. BD Board, DRIVER Board ········································ 11
2-14. SPDL  MORTR Board ················································ 12
2-15. Optical Pick-up (KSM-213D) ····································· 12
2-16. MOTOR Board, ADDRESS SENSOR Board ············ 13
2-17. Table (New), Cam (Control) and DC Motor ··············· 13

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5-1. Circuit Boards Location ·············································· 19

5-1. Circuit Boards Location ·············································· 19
5-2. Block Diagrams –TUNER Section– ··························· 20

MAIN Section ····························································· 21

5-3. Printed Wiring Boards – CD Section (1/2) – ·············· 22
5-4. Printed Wiring Boards – CD Section (2/2) – ·············· 23
5-5. Schematic Diagram – CD Section – ··························· 24
5-6. Printed Wiring Board – MAIN Section – ··················· 25
5-7. Schematic Diagram – MAIN Section (1/4) – ············· 26
5-8. Schematic Diagram – MAIN Section (2/4) – ············· 27
5-9. Schematic Diagram – MAIN Section (3/4) – ············· 28
5-10. Schematic Diagram – MAIN Section (4/4) – ············· 29
5-11. Printed Wiring Boards – PANEL Section – ················ 30
5-12. Schematic Diagram – PANEL Section – ···················· 31
5-13. Printed Wiring Boards – POWER/TRANS Section – 32
5-14. Schematic Diagram – POWER/TRANS Section – ····· 33
5-15. Printed Wiring Board

– SURROUND/KEYBOARD Section – ···················· 34

5-16. Schematic Diagram

– SURROUND/KEYBOARD Section – ···················· 34

5-17. IC PIN FUNCTION DESCRIPTION ························· 38

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6-1. Main Section ······························································· 40
6-2. Front Panel Section ····················································· 41
6-3. MAIN Board Section ·················································· 42
6-4. CD Mechanism Deck Section (CDM58F-K6A) ········· 43

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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.