HCD-RG550, HCD-RG660, MHC-RG550, MHC-RG660 - Sony Audio Service Manual (repair manual)

1

Model Name Using Similar Mechanism

NEW

CD

CD Mechanism Type

CDM74F-K6BD71B

Section

Base Unit Name

BU-K6BD71B

Optical Pick-up Name

KSS-213DCP

Tape Deck

Model Name Using Similar Machanism

CX-JT8

Section

Tape Transport Mechanism Type

CWM43RR-23

AEP Model

UK Model

E Model

Front speaker
DIN power output (rated):

160 + 160 watts
(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

200 + 200 watts (6 ohms at
1 kHz, 10% THD)

Music power output (reference):

400 + 400 watts (6 ohms at
1 kHz, 10% THD)

The following measured at AC 120, 127, 220, 240 V,
50/60 Hz
DIN power output (rated):

160 + 160 watts
(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

200 + 200 watts (6 ohms at
1 kHz, 10% THD)

The following measured at AC 120, 127, 220, 240 V,
50/60 Hz
DIN power output (rated):

115 + 115 watts
(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

140 + 140 watts (6 ohms at
1 kHz, 10% THD)

Inputs
MD (VIDEO) IN L/R (phono jacks):

voltage 450/250 mV,
impedance 47 kilohms

GAME INPUT AUDIO L/R (phono jacks):

voltage 250 mV,
impedance 47 kilohms

GAME INPUT VIDEO (phono jack):

1 Vp-p, 75 ohms

MIC (phone jack) (except for European model):

sensitivity 1 mV,
impedance 10 kilohms

Outputs
PHONES (stereo mini jack):

accepts headphones of
8 ohms or more

VIDEO OUT (phono jack):

max. output level
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms

SPEAKER:

accepts impedance of 6 to
16 ohms

SURROUND SPEAKER (HCD-RG660 only):

accepts impedance of 24
ohms

2003F04-1

© 2003. 06

– Continued on next page –

• HCD-RG550/RG660 is the

tuner, deck, CD and amplifier
section in MHC-RG550/RG660.

(Photo: HCD-RG550)

2

0

0

System

Compact disc and digital
audio system

Laser

Semiconductor laser
(

λ=780 nm)

Emission duration:
continuous

Frequency response

2 Hz – 20 kHz (±0.5 dB)

Wavelength

780 – 790 nm

Signal-to-noise ratio

More than 90 dB

Dynamic range

More than 90 dB

CD OPTICAL DIGITAL OUT
(square optical connector jack, rear panel)
Wavelength

660 nm

Output

–18 dBm

Recording system

4-track 2-channel stereo

Frequency response

50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassettes

Wow and flutter

±0.15% W.Peak (IEC)
0.1% W.RMS (NAB)
±0.2% W.Peak (DIN)

FM stereo, FM/AM superheterodyne tuner

Tuning range

87.5 – 108.0 MHz

Antenna

FM lead antenna

Antenna terminals

75 ohms unbalanced

Intermediate frequency 10.7 MHz

Tuning range
Latin American model: 530 – 1,710 kHz (with the tuning

interval set at 10 kHz)
531 – 1,710 kHz (with the tuning
interval set at 10 kHz)

European, Middle Eastern and Philippine models:

531 – 1,602 kHz (with the tuning
interval set at 9 kHz)

Other models:

530 – 1,710 kHz (with the tuning
interval set at 10 kHz)
531 – 1,602 kHz (with the tuning
interval set at 9 kHz)

Antenna

AM loop antenna

Antenna terminals

External antenna terminal

Intermediate frequency 450 kHz

Speaker system

3-way, 3-unit, bass-reflex
type

Speaker units
Sub Woofer:

15 cm, cone type

Woofer:

15 cm, cone type

Tweeter:

5 cm, cone type

Nominal impedance

6 ohms

Dimensions (w/h/d)

Approx. 240 

× 363 × 290 mm

Mass

Approx. 4.7 kg net per
speaker

Speaker system

3-way, 3-unit, bass-reflex
type

Speaker units
Woofer:

13 cm, cone type

Tweeter:

5 cm, cone type

Super tweeter:

2 cm, dome type

Nominal impedance

24 ohms

Dimensions (w/h/d)

Approx. 195 

× 325 × 225 mm

Mass

Approx. 2.3 kg net per
speaker

Power requirements
European model:

230 V AC, 50/60 Hz

Argentine model:

220 V AC, 50/60 Hz

Mexican model:

127 V AC, 60 Hz

Saudi Arabian model:

120 – 127 V/220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector

Other models:

120 V, 220 V or 230 –
240 V AC, 50/60 Hz
Adjustable with voltage
selector

Power consumption
European model:
HCD-RG660:

190 watts
0.35 watts (at the Power
Saving Mode)

Other models:
HCD-RG660:

190 watts

HCD-RG550:

135 watts

Dimensions (w/h/d)

Approx. 280 

× 325 × 407 mm

Mass
European model:
HCD-RG660:

Approx. 10.0 kg

Other models:
HCD-RG660:

Approx. 11.0 kg

HCD-RG550:

Approx. 9.0 kg

Supplied accessories:

AM loop antenna (1)
Remote Commander (1)
Batteries (2)
FM lead antenna (1)
Speaker pads
  HCD-RG660 (16)
  HCD-RG550 (8)

3

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270°C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

– BACK PANEL –

RG550: E2, E3, E51

4-247-996-01

RG550: MX

4-247-996-11

RG660: E3

4-247-996-21

RG660: AEP, UK

4-247-996-31

• Abbreviation

E2

: 120 V AC area in E model

E3

: 240 V AC area in E model

E51

: 220 V AC area in E model

MX

: Mexican model

This set has a disc tray lock function to prevent discs for
demonstration at shops from theft. While this lock function is set,
the tray will not be delivered out even when the OPEN/CLOSE
button is pressed.

Press the OPEN/CLOSE button while pressing the STOP button.
After a few seconds, the message “LOCKED” will appear on the
fluorescent indicator tube with the tray locked.

Just as the lock is set, press the OPEN/CLOSE button while
pressing the STOP button.
After a few seconds, the message “UNLOCKED” will appear with
the lock released.

PARTS No.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.

4

Main Unit ................................................................................ 5
Remote Control ....................................................................... 5

2-1.   Case (Top) ........................................................................... 7
2-2.   CD Door .............................................................................. 7
2-3.   CD Mechanism Block ......................................................... 8
2-4.   Front Panel Section ............................................................. 9
2-5.   Tape Mechanism Deck ...................................................... 10
2-6.   Panel Board, 6 Stream Led Board, Remote Board ............ 10
2-7.   Jack Board ......................................................................... 11
2-8.   Back Panel Section ............................................................ 11
2-9.   Main Board ....................................................................... 12
2-10. Power Amp Board ............................................................. 12
2-11. SW Board, Driver Board ................................................... 13
2-12. CD Block Assy .................................................................. 13
2-13. Sensor Board ..................................................................... 14
2-14. Motor (TB) Board ............................................................. 14
2-15. Motor (LD) Board ............................................................. 15
2-16. BD Board .......................................................................... 15
2-17. Optical Pick-up ................................................................. 16

..................................................................... 17

................................. 20

5-1.   IC Pin Descriptions ........................................................... 21
5-2.   Block Diagram –CD Section– ........................................... 25
5-3.   Block Diagram –Tuner/Tape/Panel Section– .................... 26
5-4.   Block Diagram –Amp/Power Supply Section– ................. 27
5-5.   Circuit Boards Location .................................................... 28
5-6.   Note for Printed Wiring Boards

     and Schematic Diagrams .................................................. 29

5-7.   Waveforms ......................................................................... 29
5-8.   Printed Wiring Board –CD Mechanism Section (1/2)– .... 30
5-9.   Schematic Diagram –CD Mechanism Section (1/2)– ....... 31
5-10. Printed Wiring Boards –CD Mechanism Section (2/2)– ... 32
5-11. Schematic Diagram –CD Mechanism Section (2/2)– ....... 33
5-12. Schematic Diagram –Main Section (1/4)– ........................ 34
5-13. Schematic Diagram –Main Section (2/4)– ........................ 35
5-14. Schematic Diagram –Main Section (3/4)– ........................ 36
5-15. Schematic Diagram –Main Section (4/4)– ........................ 37
5-16. Printed Wiring Board –Main Section– .............................. 38
5-17. Printed Wiring Boards –Panel Section– ............................ 39
5-18. Schematic Diagram –Panel Section– ................................ 40
5-19. Printed Wiring Boards –Jack Section– .............................. 41
5-20. Schematic Diagram –Jack Section– .................................. 42
5-21. Printed Wiring Board –Power Amp Section– ................... 43
5-22. Schematic Diagram –Power Amp Section (1/2)– ............. 44
5-23. Schematic Diagram –Power Amp Section (2/2)– ............. 45
5-24. Printed Wiring Board

    –Transformer Section (HCD-RG550)– ............................. 46

5-25. Printed Wiring Board

    –Transformer Section (HCD-RG660)– ............................. 47

5-26. Schematic Diagram –Transformer Section– ..................... 48
5-27. IC Block Diagrams ............................................................ 49

6-1.   Main Section ..................................................................... 52
6-2.   Front Panel Section (1) ...................................................... 53
6-3.   Front Panel Section (2) ...................................................... 54
6-4.   Front Panel Section (3) ...................................................... 55
6-5.   Main Board Section .......................................................... 56
6-6.   CD Mechanism Deck Section (1) ..................................... 57
6-7.   CD Mechanism Deck Section (2) ..................................... 58
6-8.   Base Unit Section .............................................................. 59

........................................ 60