HCD-RG40, MHC-DX30, MHC-RG40 - Sony Audio Service Manual (repair manual). Page 3

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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

— BACK PANEL —

US, CND models

AEP model

AR, E, E51, SP models

AUS, KR, MX, TH models

4-234-032-6

s

4-234-032-5

s

4-234-091-1

s

4-234-091-7

s

• Abbreviation

CND : Canadian model
AUS

: Australian model

SP

: Singapore model

TH

: Thai model

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6-1. Circuit Board Location ················································ 20
6-2. Block Diagrams  Tuner/CD Section ···························· 21

Main Section ······························································· 22

6-3. Schematic Diagram   Main Section (1/4) ···················· 23
6-4. Schematic Diagram   Main Section (2/4) ···················· 24
6-5. Schematic Diagram   Main Section (3/4) ···················· 25
6-6. Schematic Diagram   Main Section (4/4) ···················· 26
6-7. Printed Wiring Board   Main Section ·························· 27
6-8. Printed Wiring Board   BD Section ····························· 28
6-9. Schematic Diagram   BD Section ································ 29
6-10. Printed Wiring Board   Power AMP Section ··············· 30
6-11. Schematic Diagram   Power AMP Section ·················· 31
6-12. Printed Wiring Board   Panel Section ·························· 32
6-13. Schematic Diagram   Panel Section ···························· 33
6-14. Printed Wiring Board   Key Section ···························· 34
6-15. Schematic Diagram   Key Section ······························· 35
6-16. Printed Wiring Board   Driver Section ························ 36
6-17. Schematic Diagram   Driver Section ··························· 37
6-18. Printed Wiring Board   Trans Section ·························· 38
6-19. Schematic Diagram   Trans Section ···························· 39
6-20. IC Pin Function Description ········································ 40
6-21. IC Block Diagrams ······················································ 42

7-1. Main Section ······························································· 45
7-2. Front Panel Section ····················································· 46
7-3. Main Board Section ····················································· 47
7-4. CD Mechanism Deck Section ····································· 48

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KR

: Korea model

MX

: Mexican model

AR

: Argentina model

E51

: Chilean and Peruvian model