HCD-RG221, MHC-RG221 - Sony Audio Service Manual (repair manual)

hcd-rg221, mhc-rg221 service manual
Model
HCD-RG221 MHC-RG221
Pages
63
Size
7.08 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-rg221-mhc-rg221.pdf
Date

Read Sony HCD-RG221 / MHC-RG221 Service Manual online

HCD-RG221
E Model
SERVICE MANUAL
MINI HI-FI COMPONENT SYSTEM
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-877-659-01
2004D1678-1
 2004.04
• HCD-RG221 is the tuner, deck, CD and
amplifier section in MHC-RG221.
SPECIFICATIONS
Ver 1.0  2004.04
Model Name Using Similar Mechanism
New
CD
CD Mechanism Type
CDM74-F1BD81
Section
Optical Pick-up Name
KSM-215DCP/C2NP
Tape deck
Model Name Using Similar Mechanism
New
Section
Tape Transport Mechanism Type
CWM43FF-05
Amplifier section
The following measured at AC 120, 127, 220, 240 V 
50/60 Hz
DIN power output (rated): 100 + 100 watts (6 ohms at 
1 kHz, DIN)
Continuous RMS power output (reference):
120 + 120 watts (6 ohms at 
1 kHz, 10% THD)
CD player section
System
Compact disc and digital 
audio system
Laser
Semiconductor laser 
(
λ
=780 nm)
Emission duration: 
continuous
Frequency response
2 Hz – 20 kHz (
±
0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±
3 dB), 
using Sony TYPE I 
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
530 – 1,710 kHz 
(with the tuning interval 
set at 10 kHz)
531 – 1,602 kHz 
(with the tuning interval 
set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz 
General
Power requirements
Argentine models:
220 V AC, 50/60 Hz
Mexican models:
Other models:
127 V AC, 60 Hz
120 V, 220 V or 
230 – 240 V AC, 50/60 Hz
Adjustable with voltage selector
Power consumption
180 watts
Dimensions (w/h/d) incl. projecting parts and controls 
Amplifier/Tuner/Tape/CD section:
Approx. 280 
×
 327 
×
 
425 mm
Mass 
Approx. 10.0 kg
Design and specifications are subject to change 
without notice.
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
HCD-RG221
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The release method of a CD disc tray LOCK function
There is a disc lock function for the disc theft prevention for a
demonstration at a shop front in this machine.
Procedue:
1. Press the  ?/1  button to turn the set on.
2. Press two buttons of  x  and  Z (EJECT)  simultaneously for
five seconds.
3. The message “LOCKED” is displayed and the tray is locked.
(Even if exiting from this mode, the tray is still locked.)
4. Press two buttons of  x  and  Z (EJECT)  simultaneously for
five seconds again.
5. The message “UNLOCKED” is displayed and the tray is
unlocked.
6. To exit from this mode, press the  ?/1  button to turn the set
off.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
3
HCD-RG221
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
3-1. Cover (Top) ····································································· 8
3-2. CD Door ·········································································· 8
3-3. Front Panel Section ························································· 9
3-4. CD Mechanism Deck (CDM74-F1BD81) ······················ 9
3-5. Tape Mechanism Deck, GAME JACK Board ··············· 10
3-6. PANEL Board ······························································· 10
3-7. BACK PANEL Section, SUB-TRANS Board ·············· 11
3-8. Power  Transformer ······················································· 11
3-9. MAIN Board ································································· 12
3-10. AMP Board ································································· 12
3-11. BD81A Board ····························································· 13
3-12. CONNECT Board ······················································· 13
3-13. DRIVER Board, SW Board ········································ 14
3-14. Optical Pick-up (KSM-215DCP/C2NP) ····················· 14
3-15. SENSOR Board ·························································· 15
3-16. MOTOR (TB) Board ··················································· 15
3-17. MOTOR (LD) Board ·················································· 16
4. TEST MODE
···································································· 17
5. DIAGRAMS
5-1. Block Diagrams – PANEL Section – ···························· 22
– MAIN Section – ······················································· 23
– BD/DRIVER Section – ············································ 24
5-2. Printed Wiring Board – BD81A Section – ···················· 25
5-3. Schematic Diagram – BD81A Section – ······················ 26
5-4. Printed Wiring Board – CD MECHANISM Section – · 27
5-5. Schematic Diagram – CD MECHANISM Section – ···· 28
5-6. Printed Wiring Board – MAIN Section – ····················· 29
5-7. Schematic Diagram – MAIN Section (1/2) – ··············· 30
5-8. Schematic Diagram – MAIN Section (2/2) – ··············· 31
5-9. Printed Wiring Board – PANEL COMB Section – ······· 32
5-10. Schematic Diagram – PANEL COMB Section – ······· 33
5-11. Printed Wiring Board – PANEL Section – ·················· 34
5-12. Schematic Diagram – PANEL Section (1/2) – ··········· 35
5-13. Schematic Diagram – PANEL Section (2/2) – ··········· 36
5-14. Printed Wiring Board – TRANS Section – ················· 37
5-15. Printed Wiring Board – AMP Section – ······················ 38
5-16. Schematic Diagram – AMP POWER Section – ········· 39
5-17. IC Pin Function Description ······································· 42
6. EXPLODED VIEWS
6-1. MAIN Section ······························································· 47
6-2. Front Panel Section ······················································· 48
6-3. MAIN Board Section ···················································· 49
6-4. CD Mechanism Deck Section -1 (CDM74-F1BD81) ··· 50
6-4. CD Mechanism Deck Section -2 (CDM74-F1BD81) ··· 51
7. ELECTRICAL PARTS LIST
······································· 52
MODEL  IDENTIFICATION
– Back Panel –
Model Name
Part No.
Argentina model
4-254-506-0
[]
Chilean and Peruvian models
4-254-507-0
[]
Mexican model
4-254-509-0
[]
120V AC Area in E model
4-254-799-0
[]
Part No.
4
HCD-RG221
SECTION 1
SERVICING NOTE
 SERVICE POSITION -1 (AMP BOARD)
 SERVICE POSITION -2 (BD81A BOARD)
front panel
CD mechanism deck
AMP board
To inspect the AMP board, turn both of the front panel 
and the CD mechanism deck so that the left side of the product faces down.
BD81A board
CD mechanism deck
Remove the CD mechanism deck and place it on top of the pedestal as shown.
Inspect the BD81A board in this set up.
Page of 63
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