HCD-MX700NI, HCD-MX750NI - Sony Audio Service Manual (repair manual)

2013B33-1

© 

2013.02

•  HCD-MX700Ni is the amplifi er, wireless LAN, CD player, tuner, iPod/iPhone and USB section in CMT-MX700Ni.
•  HCD-MX750Ni is the amplifi er, wireless LAN, CD player, DAB/DAB+ tuner, iPod/iPhone and USB section in CMT-MX750Ni.

Model Name Using Similar Mechanism

NEW

CD Mechanism Type

CDM85CD-DVBU102

Optical Pick-up Block Name

KHM-313CAA

Photo: HCD-MX750Ni

AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION:
(The United States model only)
With 6 ohm loads, both channels driven, from 
120 Hz – 10,000 Hz; rated 50 watts per channel 
minimum RMS power, with no more than 10% 
total harmonic distortion from 250 milliwatts to 
rated output.

40 watts + 40 watts (6 ohms at 1 kHz, DIN)

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

40 watts + 40 watts (6 ohms at 1 kHz, DIN)

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

IEEE 802.11 b/g (WEP 64 bit, WEP 128 bit, 
WPA/WPA2-PSK (AES), WPA/WPA2-PSK 
(TKIP))

2.4 GHz

Compact disc and digital audio system

Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 

200mm from the objective lens surface on the Optical 
Pick-up Block with 7mm aperture.

20 Hz – 20 kHz

More than 90 dB

More than 90 dB

FM stereo, FM superheterodyne tuner

North American model: 

87.5 MHz – 108.0 MHz (100 kHz step)

Other models: 

87.5 MHz – 108.0 MHz (50 kHz step)

FM lead antenna

10.7 MHz

FM stereo, DAB/FM superheterodyne tuner

Band-III: 
174.928 (5A) MHz – 239.200 (13F) MHz

DAB/FM lead antenna

174.928 MHz

5A

176.640 MHz

5B

178.352 MHz

5C

180.064 MHz

5D

181.936 MHz

6A

183.648 MHz

6B

185.360 MHz

6C

187.072 MHz

6D

188.928 MHz

7A

190.640 MHz

7B

192.352 MHz

7C

194.064 MHz

7D

195.936 MHz

8A

197.648 MHz

8B

199.360 MHz

8C

201.072 MHz

8D

202.928 MHz

9A

204.640 MHz

9B

206.352 MHz

9C

208.064 MHz

9D

216.928 MHz

11A

218.640 MHz

11B

220.352 MHz

11C

222.064 MHz

11D

223.936 MHz

12A

225.648 MHz

12B

227.360 MHz

12C

229.072 MHz

12D

230.784 MHz

13A

232.496 MHz

13B

234.208 MHz

13C

235.776 MHz

13D

237.488 MHz

13E

239.200 MHz

13F

iPod classic 

120 GB 160 GB 

(2009)

iPod nano 

4th generation

(video)

iPod classic 

160 GB

(2007)

iPod touch 

1st generation

iPod nano 

3rd generation

(video)

iPod classic 

80 GB

iPod nano 

2nd generation

(aluminum)

iPod 

5th generation

(video)

iPod nano 

1st generation

iPod 

4th generation

(color display)

iPod 

4th generation

iPod mini

209.936 MHz

10A

211.648 MHz

10B

213.360 MHz

10C

215.072 MHz

10D

iPhone 3GS

iPhone 3G

iPhone

iPod nano

5th generation

(video camera)

iPod touch

2nd generation

MP3 (MPEG 1 Audio Layer-3): 32 kbps – 
320 kbps, VBR
WMA: 48 kbps – 192 kbps, VBR
AAC: 48 kbps – 320 kbps

MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz

75 ohms unbalanced

75 ohms, F female

Sensitivity 700 mV, impedance 47 kilohms

Accepts impedance of 6 ohms

Output voltage: DC 5.0 V
The maximum output current: 500 mA

Type A, maximum current 500 mA

10BASE-T/100BASE-TX

North American model:

AC 120V, 60Hz

Latin American models (except for Brazilian 
models):

AC 110 V – 120 V or 220 V – 240 V, 50/60 Hz, 
adjustable with voltage selector

Brazilian model:

AC 127 V or 220 V, 60 Hz, adjustable with voltage 
selector

Taiwan model:

AC 120 V, 50/60 Hz

Other models:

AC 220 V – 240 V, 50/60 Hz

43 watts

Approx. 309 mm × 122 mm × 247 mm
(approx. 12

1

/

4

inch × 4

7

/

8

 inch × 9

3

/

4

 inch)

Approx. 3.0 kg
(approx. 6 lb 10 oz)

Design and specifications are subject to change 
without notice.

s

Standby power consumption: 0.5 W

s

Halogenated flame retardants are not used in the 
certain printed wiring boards.

Note:
Be sure to keep your PC used for 
service and checking of this unit 
always updated with the latest ver-
sion of your anti-virus software.
In case a virus affected unit was 
found during service, contact your 
Service Headquarters. 

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

0  SUR  

Laser component in this product is capable of emitting radiation 
exceeding the limit for Class 1.

This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

•  PARTY STREAMING and PARTY STREAMING logo are trademarks of Sony Corporation.
•  VAIO and VAIO Media are registered trademarks of Sony Corporation.
•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom-

son.

•  Microsoft, Windows, Windows Vista, Windows 7™, Windows Media are trademarks or regis-

tered trademarks of Microsoft Corporation in the United States and/or other countries.

•  iPod is a trademark of Apple Inc., registered in the U.S. and other countries.
•  iPhone is a trademark of Apple Inc.
•  “Made for iPod” and “Works with iPhone” means that an electronic accessory has been designed 

to connect specifi cally to iPod or iPhone, respectively, and has been certifi ed by the developer to 
meet Apple performance standards.

•  Apple is not responsible for the operation of this device or its compliance with safety and regula-

tory standards.

• “

” is a mark of the Wi-Fi Alliance.

•  DLNA®, the DLNA Logo and DLNA CERTIFIED™ are trademarks, service marks, or certifi ca-

tion marks of the Digital Living Network Alliance.

•  Wake-on-LAN is a trademark of International Business Machines Corporation in the United 

States.

•  This product is protected by certain intellectual property rights of Microsoft Corporation. Use 

or distribution of such technology outside of this product is prohibited without a license from 
Microsoft or an authorized Microsoft subsidiary.

•  The system names and product names indicated in this manual are generally the trademarks or 

registered trademarks of the manufacturer.

•  In this manual, Microsoft Windows XP Home Edition, Microsoft Windows XP Professional and 

Microsoft Windows XP Media Center Edition are referred to as Windows XP.

•  In this manual, Microsoft Windows Vista Home Basic, Microsoft Windows Vista Home Pre-

mium, Microsoft Windows Vista Business and Microsoft Windows Vista Ultimate are referred 
to as Windows Vista.

•  In this manual, Microsoft Windows 7 Starter, Microsoft Windows 7 Home Premium, Microsoft 

Windows 7 Professional, Microsoft Windows 7 Ultimate are referred to as Windows 7.

•  ™ and ® marks are omitted in this manual.

  .............................................   4

2-1.   Disassembly Flow ...........................................................   9
2-2. Case 

.................................................................................   9

2-3.   NET Board Block ...........................................................   10
2-4.   Front Panel Block ...........................................................   11
2-5.   Knob (VOL) ....................................................................   12
2-6.   SP Board .........................................................................   12
2-7.   MAIN Board ...................................................................   13
2-8.   POWER Board ................................................................   13
2-9.   CD Block ........................................................................   14
2-10.  BD96U Board .................................................................   15
2-11.  Belt ..................................................................................   15
2-12.  FFC Holder .....................................................................   16
2-13.  Optical Pick-up Block (KHM-313CAA) ........................   16

TEST  MODE 

 ............................................................   17

ELECTRICAL  CHECK 

 .........................................   20

5-1.  Block Diagram - CD, USB Section - ..............................   21
5-2. Block 

Diagram 

- TUNER, iPod/iPhone, AUDIO IN Section - ................   22

5-3. Block 

Diagram 

- NETWORK, OUTPUT, PANEL Section - ...................   23

5-4.  Block Diagram - POWER SUPPLY Section - ................   24
5-5.  Printed Wiring Board - BD96U Board (Side A) - ...........   26
5-6.  Printed Wiring Board - BD96U Board (Side B) - ...........   27
5-7.  Schematic Diagram - BD96U Board (1/2) - ...................   28
5-8.  Schematic Diagram - BD96U Board (2/2) - ...................   29
5-9.  Printed Wiring Board - DAB Board (MX750Ni) - .........   30
5-10.  Schematic Diagram - DAB Board (MX750Ni) - ............   31
5-11.  Printed Wiring Board - MAIN Section (1/2) - ................   32
5-12.  Printed Wiring Boards - MAIN Section (2/2) - ..............   33
5-13.  Schematic Diagram - MAIN Section (1/4) - ...................   34
5-14.  Schematic Diagram - MAIN Section (2/4) - ...................   35
5-15.  Schematic Diagram - MAIN Section (3/4) - ...................   36
5-16.  Schematic Diagram - MAIN Section (4/4) - ...................   37
5-17.  Printed Wiring Board - NET Board - ..............................   38
5-18.  Schematic Diagram - NET Board - .................................   39
5-19.  Printed Wiring Boards - IP/JACK/SP/USB Boards - .....   40
5-20.  Schematic Diagram - IP/JACK/SP/USB Boards - ..........   41
5-21.  Printed Wiring Boards - PANEL Section - .....................   42
5-22.  Schematic Diagram - PANEL Section - ..........................   43
5-23.  Printed Wiring Board - POWER Board - ........................   44
5-24.  Schematic Diagram - POWER Board - ..........................   45

6-1. Case 

Section 

....................................................................  58

6-2.  Front Panel Section .........................................................   59
6-3.  iPod Dock Section ..........................................................   60
6-4.  MAIN Board Section ......................................................   61
6-5. Chassis 

Section 

...............................................................  62

6-6.  CD Mechanism Deck Section
 (CDM85CD-DVBU102) 

................................................  

63

  ..............................   64

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

NOTE  OF  REPLACING  THE  WIRELESS  LAN  MODULE 
(MOD1)
When replacing the wireless LAN module (MOD1), MAC address 
is changed. Print the following explanation, cut it, and hand over it 
to the customer with the set, when returning the set that the repair 
is completed to the customer.

MAC address of the main unit has been changed by this repair.
When using the MAC address fi ltering function of connection destina-
tion access point equipment, set it again..

CHECKING  METHOD  OF  NETWORK  OPERATION
It is necessary to check the network operation, when replacing the 
wireless LAN module (MOD1). Check the operation of wireless 
and wired LAN, according to the following method.

1.  Checking Method of Wireless LAN Operation
Check that access point is recognized surely.

Necessary Equipment:
Wireless access point with router function (AP)

Procedure:
1.  Press the [FUNCTION] button to select the Home Network 

function.

2. Press the [  + 

v

]/[

V

   –] buttons to select “Network,” then 

press the [ENTER] button.

3.  Press the [  + 

v

]/[

V

 

 –] buttons to select “Settings,” then 

press the [ENTER] button.

4. Press the [  + 

v

]/[

V

 

 –] buttons to select “Wireless LAN 

Settings,” then press the [ENTER] button.

5.  Press the [  + 

v

]/[

V

 

 –] buttons to select “Access Point 

Scan,,” then press the [ENTER] button.

6.  The system starts searching for access points, and displays a 

list of up to 20 available network name (SSID).

7.  Check that access point (SSID) is displayed on the searching 

result.

Note: Refer to the instruction manual about details of the setting method.

2.  Checking method of wired LAN operation
Check that access point is recognized surely.

Procedure:
1.  Connect the main unit to the router or the hub, etc. with the 

LAN cable.

2.  Press the [FUNCTION] button to select the Home Network 

function.

3. Press the [  + 

v

]/[

V

   –] buttons to select “Network,” then 

press the [ENTER] button.

4.  Press the [  + 

v

]/[

V

 

 –] buttons to select “Settings,” then 

press the [ENTER] button.

5. Press 

the 

[  + 

v

]/[

V

   –] buttons to select “Wired LAN Set-

tings,” then press the [ENTER] button.

Note: If “Change Setting?” appears, select “OK,” then press the [ENTER] 

button.

6.  On the IP setting, press the [  + 

v

]/[

V

   –] buttons to select 

“Auto,” then press the [ENTER] button.

7.  On the proxy setting, press the [  + 

v

]/[

V

 

 –] buttons to 

select “Do Not Use,” then press the [ENTER] button.

8. Press 

the 

[  + 

v

]/[

V

   –] buttons to select “OK,” then press 

the [ENTER] button.

9.  Perform the server settings.
10. Press the [OPTIONS] buttons to select “Network,” then press 

the [ENTER] button.

11. Press the [OPTIONS] buttons to select “Information,” then 

press the [ENTER] button.

12. Check that IP address can be acquired.

Note: Refer to the instruction manual about details of the setting method.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press two buttons of [

x

] and [

Z

] for 5 seconds.

3.  The message “UNLOCKED” is displayed on the liquid crystal 

element and the disc tray is unlocked.

Note: When “LOCKED”is displayed, the disc tray lock is not released by 

turning power on/off with the [

?/1] button.

NOTE  OF  REPLACING  THE  MS-203  BOARD
When the MS-203 board is damaged, exchange the entire 
CDM85 (CD) ASSY.

NOTE  OF  REPLACING  THE  CN1003  ON  THE  NET  
BOARD
CN1003 on the NET board cannot exchange with single. When 
these parts are damaged, exchange the entire mounted board.