Read Sony HCD-MX500I / HCD-MX550I (serv.man2) Service Manual online
9
HCD-MX500i/MX550i
3. ELECTRICAL PARTS LIST
A-1760-782-A IP BOARD, COMPLETE
******************
< CAPACITOR >
C331 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
C332 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C333 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
C334 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C335 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
C336 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C339 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
C340 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C342 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C343 1-116-344-11 ELECT
330uF 20% 6.3V
< CONNECTOR >
CN331
1-784-865-51 CONNECTOR, FFC (LIF (NON-ZIF)) 13P
CN332
1-820-980-11 PIN, CONNECTOR 30P (iPod/iPhone Dock)
< DIODE >
D397
8-719-071-34 DIODE RB521S-30-TE61
< RESISTOR/FERRITE BEAD >
R331 1-218-892-11 METAL
CHIP 75K
0.5% 1/10W
R332 1-208-935-11 METAL
CHIP 100K
0.5% 1/16W
R333 1-208-935-11 METAL
CHIP 100K
0.5% 1/16W
R334 1-218-892-11 METAL
CHIP 75K
0.5% 1/10W
R335 1-208-935-11 METAL
CHIP 100K
0.5% 1/16W
R336 1-208-935-11 METAL
CHIP 100K
0.5% 1/16W
R337 1-216-864-11 SHORT
CHIP 0
R338 1-216-864-11 SHORT
CHIP 0
R339 1-216-864-11 SHORT
CHIP 0
R390 1-216-864-11 SHORT
CHIP 0
R391
1-400-050-11 INDUCTOR, FERRITE BEAD
R392
1-400-050-11 INDUCTOR, FERRITE BEAD
R393 1-216-864-11 SHORT
CHIP 0
R394 1-216-864-11 SHORT
CHIP 0
R395 1-216-864-11 SHORT
CHIP 0
R396 1-216-864-11 SHORT
CHIP 0
R398 1-216-864-11 SHORT
CHIP 0
R399 1-216-864-11 SHORT
CHIP 0
************************************************************
A-1760-771-A MAIN BOARD, COMPLETE (MX500i: AEP)
A-1760-784-A MAIN BOARD, COMPLETE (MX500i: US, CND)
A-1760-905-A MAIN BOARD, COMPLETE (MX550i)
A-1783-490-A MAIN BOARD, COMPLETE (MX500i: CH, SP)
********************
< CAPACITOR >
C101 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C104 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C105 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
(MX550i)
C106 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
(MX550i)
C107 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C108 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C109 1-126-193-11 ELECT
CHIP 1uF
20% 50V
(MX550i)
C117 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C118 1-164-173-11 CERAMIC
CHIP 0.0039uF 10% 50V
C120 1-136-498-81 FILM
0.12uF 5% 50V
C121 1-136-498-81 FILM
0.12uF 5% 50V
C124 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C125 1-126-960-11 ELECT
1uF
20% 50V
C126 1-126-193-11 ELECT
CHIP 1uF
20% 50V
C129 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
C130 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
C140 1-162-970-11 CERAMIC
CHIP 0.01uF 10% 25V
C141 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
(MX550i)
C143 1-126-193-11 ELECT
CHIP 1uF
20% 50V
(MX550i)
C144 1-126-193-11 ELECT
CHIP 1uF
20% 50V
(MX550i)
C146 1-126-193-11 ELECT
CHIP 1uF
20% 50V
(MX550i)
C161 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C162 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
C163 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C164 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
C165 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C166 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
C167 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
(MX550i)
C168 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
(MX550i)
C169 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C170 1-164-870-11 CERAMIC
CHIP 68PF
5% 50V
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
IP
MAIN
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
Note:
• Due to standardization, replacements in
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
All resistors are in ohms.
METAL:
Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F:
F:
nonfl ammable
• CAPACITORS
uF:
uF:
μF
• COILS
uH:
uH:
μH
• SEMICONDUCTORS
In each case, u: μ, for example:
uA.
In each case, u: μ, for example:
uA.
. :
μA. . , uPA. . , μPA. . ,
uPB.
.
:
μPB. . , uPC. . , μPC. . ,
uPD.
.
:
μPD. .
• Abbreviation
CH
CH
: Chinese model
CND : Canadian model
SP
SP
: Singapore model
Ver. 1.3
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