HCD-MD555 - Sony Audio Service Manual (repair manual)

hcd-md555 service manual
Model
HCD-MD555
Pages
123
Size
12.15 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-md555.pdf
Date

Read Sony HCD-MD555 Service Manual online

SERVICE MANUAL
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
US Model
AEP Model
UK Model
E Model
Tourist Model
MINI HiFi COMPONENT SYSTEM
9-922-976-14
2007H16-1
© 2007.08
Ver. 1.3  2007.08
HCD-MD555
• This set is the Amplifier, CD player,
  MD Deck and Tuner section in
  DHC-MD555.
SPECIFICATIONS
Manufactured under license from Dolby Laboratories
Licensing Corporation.
“DOLBY” the double-D symbol 
a “AC-3” and “PRO
LOGIC” are trademarks of Dolby Laboratories
Licensing Corporation.
— Continued on next page —
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM53-K1BD33
Section
Optical Pick-up Type
KSM-213BFN/C2NP
MD
Model Name Using Similar Mechanism
NEW
Section
MD Mechanism Type
MDM-C1E
Base Unit Type
MBU-C1E
Optical Pick-up Type
KSM-260A/J1N
— 2 —
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block.  Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
!
 OR DOTTED LINE WITH
MARK 
!
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
— 3 —
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
MODEL IDENTIFICATION
– BACK PANEL –
SAFETY  CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2 V AC range are suitable.  (See Fig. A)
Earth Ground
AC
voltmeter
(0.75V)
1.5k
0.15
µ
F
Fig. A.  Using an AC voltmeter to check AC leakage.
To Exposed Metal 
Parts on Set
COMPACT DISC DECK RECEIVER
SERIAL 
MODEL NO.
HCD-MD555
MADE IN
NO.
JAPAN
AC: 230V ~ 50/60Hz 90W: AEP, UK model
AC: 110 – 120/220 – 240V ~ 50/60Hz 90W
: Singapore, Malaysia, Hong Kong, Tourist model
AC: 120V 60Hz 90W: US model
— 4 —
TABLE OF CONTENTS
1. SELF-DIAGNOSIS FUNCTION
·································· 5
2. SERVICE NOTE
······························································· 8
3. GENERAL
········································································ 12
4. DISASSEMBLY
4-1.
Back Panel ········································································ 25
4-2.
Mechanism (MDM-C1E) ················································· 25
4-3.
SP Board, Amp Board, Reg Board ··································· 26
4-4.
Front Panel ······································································· 26
4-5.
Power Key Board, LED Board, Panel Board ··················· 27
4-6.
Power Transformer (T960), Trans-A/B/C/D Board ········· 27
4-7.
CD Mechanism (CDM53-K1BD33) ································ 28
4-8.
Escutcheon, Chassis (Top) ··············································· 29
4-9.
Chassis (Elevator) New ···················································· 30
4-10. Motor (Head) Assy (M905), Head Relay Board ·············· 30
4-11. MD Base Unit (MBU-C1E) ············································· 31
4-12. BD Board ·········································································· 31
4-13. Over Light Head (HR901) ················································ 32
4-14. MD Optical Pick-up Block (KMS-260A/J1N) ················· 32
4-15. CD Optical Pick-up Block (KSS-213BA/F-NP) ·············· 33
4-16. Fitting Base (Guide/Magnet) Assy ··································· 33
4-17. Tray (Sub) ········································································· 34
4-18. Chassis (Mold B), Stocker, Slider (Selection) ·················· 34
4-19. How to Assembly The Gears ············································ 35
4-20. How to Attach The Slider (Selection) ······························ 35
4-21. How to Attach The Stocker ·············································· 36
4-22. How to Attach The Chassis (Mold B) ······························ 36
5. TEST MODE
···································································· 37
6. ELECTRICAL ADJUSTMENT
·································· 43
7. DIAGRAMS
7-1.
Block Diagrams ································································ 53
 MD Section ···································································· 53
 CD Section ····································································· 55
 Audio Section ································································ 57
 Power Section ································································ 59
7-2.
Circuit Boards Location ··················································· 61
7-3.
Schematic Diagram — CD Section — ····························· 63
7-4.
Printed Wiring Board — CD Section — ·························· 65
7-5.
Schematic Diagram —Motor Section — ························· 67
7-6.
Printed Wiring Board — Motor Section — ······················ 69
7-7.
Printed Wiring Board — MD Section — ························· 71
7-8.
Schematic Diagram — MD Section (1/2) — ··················· 73
7-9.
Schematic Diagram — MD Section (2/2) — ··················· 75
7-10. Schematic Diagram — Rds Section — ···························· 77
7-11. Printed Wiring Board — Rds Section — ························· 78
7-12. Schematic Diagram — Relay Section — ························· 79
7-13. Printed Wiring Board — Relay Section — ······················ 81
7-14. Printed Wiring Board — Main Section — ······················· 83
7-15. Schematic Diagram — Main Section (1/3) — ················· 85
7-16. Schematic Diagram — Main Section (2/3) — ················· 87
7-17. Schematic Diagram — Main Section (3/3) — ················· 89
7-18. Schematic Diagram — Amp Section — ··························· 91
7-19. Printed Wiring Board — Amp Section — ························ 93
7-20. Schematic Diagram — Panel Section — ························· 95
7-21. Printed Wiring Board — Panel Section ···························· 97
7-22. Schematic Diagram — Power Section — ························ 99
7-23. Printed Wiring Board — Power Section — ··················· 101
7-24. IC Block Diagrams ························································· 105
7-25. IC Pin Function Description ··········································· 111
8. EXPLODED VIEWS
8-1.
Main Block ····································································· 123
8-2.
Back Panel Block ··························································· 124
8-3.
MD Mechanism Deck-1 (MDM-C1E) ··························· 125
8-4.
MD Mechanism Deck-2 (MDM-C1E) ··························· 126
8-5.
MD Base Unit (MBU-C1E) ··········································· 127
8-6.
CD Mechanism Deck-1 (CDM53-K1BD33) ················· 128
8-7.
CD Mechanism Deck-2 (CDM53-K1BD33) ················· 129
8-8.
Optical Block (BU-K1BD33) ········································· 130
9. ELECTRICAL PARTS LIST
····································· 131
Page of 123
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Download Sony HCD-MD555 Service Manual (Repair Manual)

Here you can read online and download Sony HCD-MD555 Service Manual in PDF. HCD-MD555 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony HCD-MD555 Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.