HCD-MC3AV - Sony Audio Service Manual (repair manual). Page 4

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 FRONT PANEL ···································································· 5
 REAR PANEL ······································································· 6

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Deck Section ········································································ 21
CD Section ··········································································· 25

6-1.

Block Diagram   CD Section ············································ 27
Block Diagram   Main Section ········································· 29
Block Diagram   Audio Section ········································ 31

6-2.

Circuit Boards Location ··················································· 33

6-3.

Printed Wiring Board   BD Section ·································· 35

6-4.

Schematic Diagram    BD Section ···································· 37

6-5.

Printed Wiring Board   CD Motor Section ······················· 39

6-6.

Schematic Diagram   CD Motor Section ·························· 41

6-7.

Printed Wiring Board   Audio Section ······························ 43

6-8.

Schematic Diagram   Audio Section ································· 45

6-9.

Printed Wiring Board   Leaf SW Section ························· 47

6-10. Schematic Diagram   Leaf SW Section ···························· 49
6-11. Printed Wiring Board   Main Section ······························· 51
6-12. Schematic Diagram   Main (1/5) Section ························· 53
6-13. Schematic Diagram   Main (2/5) Section ························· 55
6-14. Schematic Diagram   Main (3/5) Section ························· 57
6-15. Schematic Diagram   Main (4/5) Section ························· 59
6-16. Schematic Diagram   Main (5/5) Section ························· 61
6-17. Printed Wiring Board   Panel Section ······························· 63
6-18. Schematic Diagram   Panel Section ································· 65
6-19. Printed Wiring Board   Surround Amp Section ················ 67
6-20. Schematic Diagram   Surround Amp Section ··················· 69
6-21. Schematic Diagram   Power Section ································ 71
6-22. Printed Wiring Board   Power Section ····························· 73
6-23. Waveforms ········································································ 75
6-24. IC Pin Function Description ············································· 76
6-25. IC Block Diagrams ··························································· 84

····················································· 86

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The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output repeatedly.

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be damaged
by heat.

•

Keep the temperature of the soldering iron around 270 ˚C during
repairing.

•

Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering or
unsoldering.