HCD-LX20I - Sony Audio Service Manual (repair manual). Page 3

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HCD-LX20i
3
1. 
SERVICING  NOTES 
 .............................................   3
2. GENERAL 
 ..................................................................   5
3. DISASSEMBLY
3-1. Disassembly 
Flow 
...........................................................   7
3-2.  Panel (Back), Panel (Front) Block ..................................   7
3-3. MAIN 
Board 
...................................................................   8
3-4. PANEL 
Board 
.................................................................   8
3-5.  CD Mechanism Block (CDM80BT-F4BD94-WOD) .....   9
3-6. Belt 
(MOT) 
.....................................................................   9
3-7.  Base Unit (BU-F4BD94-WOD) .....................................   10
4. 
TEST  MODE 
 ............................................................   11
5. ELECTRICAL 
 
ADJUSTMENTS 
 ........................   13
6. DIAGRAMS
6-1.  Block Diagram - CD, TUNER Section - ........................   15
6-2.  Block Diagram - MAIN Section - ...................................   16
6-3.  Printed Wiring Board - CD Board - ................................   18
6-4.  Schematic Diagram - CD Board - ...................................   19
6-5.  Printed Wiring Board - MAIN Board - ...........................   20
6-6.  Schematic Diagram - MAIN Board (1/3) - .....................   21
6-7.  Schematic Diagram - MAIN Board (2/3) - .....................   22
6-8.  Schematic Diagram - MAIN Board (3/3) - .....................   23
6-9.  Printed Wiring Boards - PANEL Section - .....................   24
6-10.  Schematic Diagram - PANEL Section - ..........................   25
6-11.  Printed Wiring Boards - AUDIO IN/OUT, KEY, 
POWER SUPPLY Section - ............................................   26
6-12.  Schematic Diagram - AUDIO IN/OUT, KEY, 
POWER SUPPLY Section - ............................................   27
7. 
EXPLODED  VIEWS
7-1.  Panel (Back) Section .......................................................   33
7-2.  Panel (Front) Section ......................................................   34
7-3.  Stage (Top) Section .........................................................   35
7-4  MAIN Board Section ......................................................   36
7-5.  CD Mechanism Section 
(CDM80BT-F4BD94-WOD) ..........................................   37
7-6.  Base Unit Section (BU-F4BD94-WOD) ........................   38
8. 
ELECTRICAL  PARTS  LIST
  ..............................   39
TABLE  OF  CONTENTS
Ver. 1.1
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
SECTION  1
SERVICING  NOTES
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