HCD-GX8000, HCD-RG77 - Sony Audio Service Manual (repair manual)

Model
HCD-GX8000 HCD-RG77
Pages
71
Size
6.84 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-gx8000-hcd-rg77.pdf
Date

View Sony HCD-GX8000 / HCD-RG77 Service Manual online

SERVICE MANUAL
Amplifier section
HCD-GX8000
Total harmonic distortion
Less than 0.1 % (6 ohms
at 1 kHz, 100 W)
HCD-RG77
The following are measured at AC 120, 220, 240V
50/60 Hz
DIN power output (rated) 160 + 160 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
200 + 200 watts
(6 ohms at 1 kHz,
10% THD)
Inputs
GAME (VIDEO):
1 Vp-p, 75 ohms
(phono jack)
GAME (AUDIO):
Voltage 250 mV,
(phono jacks)
impedance 47 kilohms
MD/VIDEO (AUDIO) IN: voltage 450 mV/250 mV,
(phono jacks)
impedance 47 kilohms
MIC:
sensitivity 1 mV,
(phone jack)
impedance 10 kilohms
PHONES:
accepts headphones of
(stereo mini jack)
8 ohms or more
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
SURROUND SPEAKER: accepts impedance of
24 ohms or more
CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(
λ=795nm)
Laser Output
Max. 44.6 
µW*
*This output is the value
measured at a distance of
200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Wave length
795 nm
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length
660 nm
Output Level
–18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Latin and North American models:
530 – 1,710 kHz
(with the interval set at 10
kHz)
531 – 1,710 kHz
(with the interval set at 9
kHz)
Middle Eastern models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
AUDIO POWER SPECIFICATIONS
(HCD-GX8000 only)
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
With 6-ohm loads, both channels driven, from
120 Hz - 10 kHz; rates 200 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion from 250 miliwatts to
rated output.
Outputs
VIDEO OUT:
max. output level 1 Vp-p,
(phono jacks)
unbalanced, Sync.
negative load impedance
75 ohms
COMPACT DISC DECK RECEIVER
US Model
HCD-GX8000
E Model
HCD-RG77
SPECIFICATIONS
HCD-GX8000/RG77
Ver 1.2  2004.08
9-873-542-03
Sony Corporation
2004H05-1
Audio Group
C
 2004.08
Published by Sony Engineering Corporation
– Continued on next page –
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM58E-30BD60C (HCD-GX8000)
Section
CDM58ES-30BD60C (HCD-RG77)
Base Unit Name
BU-30BD60C
Optical Pick-up Name
A-MAX.3
TAPE
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
TCM-230AWR41CS
HCD-GX8000/RG77 are the amplifier, CD
player, tape deck and tuner section in
MHC-GX8000/RG77.
2
HCD-GX8000/RG77
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
General
Power requirements
North America and Mexican models:
120 V AC, 60 Hz
Argentina model:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 - 240
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
240 watts
Dimensions (w/h/d)
Approx. 280 x 360 x 445
mm
Mass :
Approx. 11.0 kg
Design and specifications are subject to change
without notice.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able.  (See Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15 
µ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
3
HCD-GX8000/RG77
TABLE  OF  CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
5
Setting the Clock .............................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
7
3-2. Top Case ..........................................................................
8
3-3. Loading Panel ..................................................................
8
3-4. CD Mechanism Deck ......................................................
9
3-5. Front Panel Section .........................................................
9
3-6. Back Panel Section .......................................................... 10
3-7. MAIN Board ................................................................... 10
3-8. Base Unit (BU-30BD60C) .............................................. 11
3-9. DRIVER Board, MOTOR Board and
SENSOR (CD) Board ..................................................... 11
3-10. Tape Mechanism Deck (TCM-230AWR41CS) .............. 12
3-11. Belt .................................................................................. 12
3-12. SW Board, HEAD (A) Board and HEAD (B) Board ..... 13
4.
TEST  MODE
.............................................................. 14
5.
MECHANICAL  ADJUSTMENTS
....................... 18
6.
ELECTRICAL  ADJUSTMENTS
Deck section .................................................................... 18
CD Section ...................................................................... 21
7.
DIAGRAMS
7-1. Block Diagram  – CD SERVO Section – ....................... 23
7-2. Block Diagram  – TUNER/TAPE DECK Section – ...... 24
7-3. Block Diagram  – MAIN Section – ................................ 25
7-4. Block Diagram  – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 26
7-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 27
7-6. Printed Wiring Board  – BD Board – ............................. 28
7-7. Schematic Diagram  – BD Board – ................................ 29
7-8. Printed Wiring Boards
– DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30
7-9. Schematic Diagram
– DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30
7-10. Printed Wiring Boards
– SW/HEAD (A)/HEAD (B) Boards – .......................... 31
7-11. Schematic Diagram  – SW Board – ................................ 32
7-12. Printed Wiring Board  – MAIN Board – ........................ 33
7-13. Schematic Diagram  – MAIN Board (1/4) – .................. 34
7-14. Schematic Diagram  – MAIN Board (2/4) – .................. 35
7-15. Schematic Diagram
– MAIN (3/4)/HEAD (A)/HEAD (B) Boards – ............. 36
7-16. Schematic Diagram  – MAIN Board (4/4) – .................. 37
7-17. Printed Wiring Board  – GAME IN Board – .................. 38
7-18. Schematic Diagram  – GAME IN Board – ..................... 39
7-19. Printed Wiring Boards
– POWER/SENSOR Boards – ........................................ 40
7-20. Schematic Diagram  – POWER/SENSOR Boards – ..... 41
7-21. Printed Wiring Boards
– PANEL/CD OPEN/CD SWITCH Boards – ................ 42
7-22. Schematic Diagram
– PANEL/CD OPEN/CD SWITCH Boards – ................ 43
7-23. Printed Wiring Boards
– PAD SWITCH/VOL Boards – ..................................... 44
7-24. Schematic Diagram  – PAD SWITCH/VOL Boards – ... 45
7-25. Printed Wiring Boards
– MAIN TRANS/SUB-TRANS Boards – ...................... 46
7-26. Schematic Diagram
– MAIN TRANS/SUB-TRANS Boards – ...................... 47
7-27. IC Pin Function Description ........................................... 49
8.
EXPLODED  VIEWS
8-1. Panel Section ................................................................... 53
8-2. Front Panel Section ......................................................... 54
8-3. Chassis Section ............................................................... 55
8-4. CD Mechanism Deck Section ......................................... 56
8-5. Base Unit Section (BU-30BD60C) ................................. 57
8-6. Tape Mechanism Deck Section
(TCM-230AWR41CS) .................................................... 58
9.
ELECTRICAL  PARTS  LIST
............................... 59
Ver 1.1
4
HCD-GX8000/RG77
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
SECTION  1
SERVICING  NOTES
• MODEL  IDENTIFICATION
– Back Panel –
MODEL
PART No.
E, Singapore, Chilean and Peruvian models
4-237-780-1
[]
Mexican and Argentina models
4-237-780-6
[]
US model
4-237-780-9
[]
PART No.

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