HCD-GV6, HCD-GV8, LBT-GV6, LBT-GV8 - Sony Audio Service Manual (repair manual)

hcd-gv6, hcd-gv8, lbt-gv6, lbt-gv8 service manual
Model
HCD-GV6 HCD-GV8 LBT-GV6 LBT-GV8
Pages
91
Size
9.39 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-gv6-hcd-gv8-lbt-gv6-lbt-gv8.pdf
Date

Read Sony HCD-GV6 / HCD-GV8 / LBT-GV6 / LBT-GV8 Service Manual online

SERVICE MANUAL
Amplifier section
HCD-GV8
The following measured at AC 120/220/240V,
50 Hz
DIN power output (rated) 240 + 240 watts
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
320 + 320 watts
(4 ohms at 1 kHz, 10% THD)
HCD-GV6
The following measured at AC 120/220/240V,
50 Hz
DIN power output (rated) 150 + 150 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
200 + 200 watts
(6 ohms at 1 kHz, 10% THD)
Inputs
PHONO IN:
(phono jacks)
sensitivity 3 mV,
impedance 47 kilohms
MIC1/2:
(phone jack)
sensitivity 1 mV,
impedance 10 kilohms
VIDEO IN:
(phono jack)
sensitivity 250 mV,
impedance 47 kilohms
GAME IN:
(phono jack)
sensitivity 250 mV,
impedance 47 kilohms
MD IN:
(phono jack)
sensitivity 450 mV,
impedance 47 kilohms
Outputs
PHONES:
(stereo phone jack)
accepts headphones of 8
ohms or more
VIDEO OUT:
(phono jack)
voltage 250 mV
impedance 1 kilohm
MD OUT:
(phono jacks)
voltage 250 mV
impedance 1 kilohm
FRONT SPEAKER:
HCD-GV8:
accepts impedance of 4 to
16 ohms
HCD-GV6:
accepts impedance of 6 to
16 ohms
Video section
Inputs
VIDEO IN (phono jack):
1 V p-p, 75 ohms
GAME IN (phono jack):
1 V p-p, 75 ohms
Outputs
VIDEO OUT (phono jack):1 V p-p, 75 ohms
S-VIDEO OUT (4-pin/mini-DIN jack):
Y:  1 V p-p, unbalanced,
Sync negative,
C: 0.286 V p-p,
load impedance 75 ohms
VIDEO CD/CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(
λ
=780nm), Emission
duration: continuous
Wavelength:
780-790 nm
Frequency response
2 Hz – 20 kHz (
±
0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format
NTSC, PAL
CD OPTICAL DIGITAL  OUT
(Square optical connector jack, rear panel)
Wavelength:
660 nm
Output level
–18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±
3 dB),
(DOLBY NR OFF)
using Sony TYPE I cassette
40 – 14,000 Hz (
±
3 dB),
using Sony TYPE II cassette
COMPACT DISC DECK RECEIVER
E Model
SPECIFICATIONS
HCD-GV6/GV8
Photo: HCD-GV8
Ver 1.0  2001.04
9-873-826-11
Sony Corporation
2001D0500-1
Home Audio Company
C
 2001.4
Shinagawa Tec Service Manual Production Group
HCD-GV6/GV8 are the amplifier, CD
player, tape deck and tuner section in
LBT-GV6/GV8.
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol 
;
 are trade-
marks of Dolby Laboratories Licensing Corporation.
Model Name Using Similar Mechanism
HCD-XG60
CD
CD Mechanism Type
CDM37L-5BD34L
Section
Base Unit Name
BU-5BD34L
Optical Pick-up Name
KSS-213DH
TAPE
Model Name Using Similar Mechanism
HCD-XG60
Section
Tape Transport Mechanism Type
TCM-230PWR42
– Continued on next page –
2
HCD-GV6/GV8
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Middle Eastern and Philippine models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
120 V, 220 V or 230  – 240
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
HCD-GV8
300 watts
HCD-GV6
180 watts
Dimensions (w/h/d)
Approx. 355 
×
 425 
×
 450
mm
Mass :
HCD-GV8
Approx. 16.0 kg
HCD-GV6
Approx. 15.5 kg
Design and specifications are subject to change
without notice.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
3
HCD-GV6/GV8
TABLE  OF  CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
5
Setting the Time ..............................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
7
3-2. Case .................................................................................
7
3-3. Front Panel Section .........................................................
8
3-4. Cover (TC), Tape Mechanism Deck
(TCM-230PWR42) .........................................................
8
3-5. MAIN Board, Fan, D.C. (M901) ....................................
9
3-6. CD Mechanism Deck (CDM37L-5BD34L) ................... 10
3-7. Base Unit (BU-5BD34L) ................................................ 11
3-8. Disc Table ........................................................................ 11
4.
TEST  MODE
.............................................................. 12
5.
MECHANICAL  ADJUSTMENTS
....................... 14
6.
ELECTRICAL  ADJUSTMENTS
Deck section .................................................................... 14
CD Section ...................................................................... 17
Video Section .................................................................. 17
7.
DIAGRAMS
7-1. Block Diagram  – CD SERVO Section – ....................... 18
7-2. Block Diagram  – AUDIO/VIDEO CD Section – .......... 19
7-3. Block Diagram  – TUNER/TAPE DECK Section – ...... 20
7-4. Block Diagram  – MAIN Section – ................................ 21
7-5. Block Diagram  – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 22
7-6. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
7-7. Printed Wiring Board  – BD Board – ............................. 24
7-8. Schematic Diagram  – BD Board – ................................ 25
7-9. Schematic Diagram  – VIDEO Board (1/2) – ................ 26
7-10. Schematic Diagram  – VIDEO Board (2/2) – ................ 27
7-11. Printed Wiring Board  – VIDEO Board – ....................... 28
7-12. Printed Wiring Boards  – CD MOTOR Section – .......... 30
7-13. Schematic Diagram  – CD MOTOR Section – .............. 31
7-14. Printed Wiring Board  – AUDIO Board – ...................... 32
7-15. Schematic Diagram  – AUDIO Board – ......................... 33
7-16. Printed Wiring Board  – LEAF SW Board – .................. 34
7-17. Schematic Diagram  – LEAF SW Board – ..................... 34
7-18. Schematic Diagram  – MAIN Board (1/3) – .................. 35
7-19. Schematic Diagram  – MAIN Board (2/3) – .................. 36
7-20. Schematic Diagram  – MAIN Board (3/3) – .................. 37
7-21. Printed Wiring Board  – MAIN Board – ........................ 38
7-22. Printed Wiring Board  – PA Board – .............................. 40
7-23. Schematic Diagram  – PA Board – ................................. 41
7-24. Printed Wiring Boards  – MIC/FRONT INPUT/
HEADPHONES Boards – ............................................... 42
7-25. Schematic Diagram  – MIC/FRONT INPUT/
HEADPHONES  Boards – ............................................. 43
7-26. Printed Wiring Board  – PANEL FL Board – ................. 44
7-27. Schematic Diagram  – PANEL FL Board – ................... 45
7-28. Printed Wiring Boards
– PANEL VR/ILLUMINATION Boards – ..................... 46
7-29. Schematic Diagram
– PANEL VR/ILLUMINATION Boards – ..................... 47
7-30. Printed Wiring Boards  – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 48
7-31. Schematic Diagram  – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 49
7-32. Printed Wiring Board  – TRANSFORMER Section– .... 50
7-33. Schematic Diagram  – TRANSFORMER Section– ....... 50
7-34. IC Pin Function Description ........................................... 56
8.
EXPLODED  VIEWS
8-1. Case, Back Panel Section ................................................ 66
8-2. Front Panel Section-1 ...................................................... 67
8-3. Front Panel Section-2 ...................................................... 68
8-4. Chassis Section ............................................................... 69
8-5. CD Mechanism Deck Section (CDM37L-5BD34L) ...... 70
8-6. Base Unit Section (BU-5BD34L) ................................... 71
8-7. Tape Mechanism Deck Section-1
(TCM-230PWR42) ......................................................... 72
8-8. Tape Mechanism Deck Section-2
(TCM-230PWR42) ......................................................... 73
9.
ELECTRICAL  PARTS  LIST
............................... 74
4
HCD-GV6/GV8
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
SECTION  1
SERVICING  NOTES
• MODEL  IDENTIFICATION
– Rear Panel –
MODEL
PART No.
HCD-GV6: Malaysia and
Singapore models
4-232-090-0
[]
HCD-GV6: Saudi Arabia model
4-232-090-1
[]
HCD-GV8: Malaysia and
Singapore models
4-232-090-2
[]
HCD-GV6: Indonesia model
4-232-090-6
[]
SELF-DIAGNOSIS
This unit is equipped with a self-diagnosis function.
The function is used for diagnosing the conditions of the circuits
of the VIDEO board.
The circuits can be determined if normal or abnormal by the light-
ing of D502 of the VIDEO board.
Lighting of D502
When lit
: Operates normally
Blinks repeatedly: The circuit may be faulty.
D502
IC505
– VIDEO Board (Side A) –
PART No.
Page of 91
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