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— 3 —
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside the unit.
1.
SERVICING NOTES
··················································· 3
2.
GENERAL
······································································ 6
3.
DISASSEMBLY
3-1.
Case ···················································································· 8
3-2.
Front Panel Section ···························································· 8
3-3.
Tape Mechanism Deck Section (TCM-230AWR2) ············ 9
3-4.
CD Mechanism Deck section (CDM38LH-5BD32L) ········ 9
3-5.
Main Board ······································································· 10
4.
TEST MODE
································································ 11
5.
MECHANICAL ADJUSTMENTS
·························· 13
6.
ELECTRICAL ADJUSTMENTS
··························· 13
7.
DIAGRAMS
7-1.
Circrit Boards Location ···················································· 18
7-2.
Block Diagrams ································································ 19
•
CD Section ····································································· 19
•
Tape Deck Section ························································· 21
•
Main Section ·································································· 23
•
Display/Key Con Section ·············································· 25
7-3.
Printed Wiring Board – CD Section – ······························ 29
7-4.
Schematic Diagram –CD Section – ·································· 31
7-5.
Printed Wiring Board – CD Motor Section – ··················· 33
7-6.
Schematic Diagram – CD Motor Section – ······················ 35
7-7.
Printed Wirint Board – Tape Deck Section – ··················· 37
7-8.
Schematic Diagram – Tape Deck Section – ····················· 39
7-9.
Printed Wiring Board – Leaf SW Section – ····················· 41
7-10. Schematic Diagram – Leaf SW Section – ························ 42
7-11. Printed Wiring Board – Main Section – ··························· 43
7-12. Schematic Diagram – Main Section (1/4) – ····················· 45
7-13. Schematic Diagram – Main Section (2/4) – ····················· 47
7-14. Schematic Diagram – Main Section (3/4) – ····················· 49
7-15. Schematic Diagram – Main Section (4/4) – ····················· 51
7-16. Printed Wiring Board – Panel Section – ··························· 53
7-17. Schematic Diagram – Panel Section – ····························· 55
7-18. Printed Wiring Board – AC Sec Standby Section – ·········· 57
7-19. Schematic Diagram – AC Sec Standby Section – ············ 59
7-20. Printed Wiring Board – CD SW Section – ······················· 61
7-21. Schematic Diagram – CD SW Section – ·························· 61
7-22. IC Block Diagrams ··························································· 63
7-23. IC PIN Function Description ············································ 66
7-11. Printed Wiring Board – Main Section – ··························· 43
7-12. Schematic Diagram – Main Section (1/4) – ····················· 45
7-13. Schematic Diagram – Main Section (2/4) – ····················· 47
7-14. Schematic Diagram – Main Section (3/4) – ····················· 49
7-15. Schematic Diagram – Main Section (4/4) – ····················· 51
7-16. Printed Wiring Board – Panel Section – ··························· 53
7-17. Schematic Diagram – Panel Section – ····························· 55
7-18. Printed Wiring Board – AC Sec Standby Section – ·········· 57
7-19. Schematic Diagram – AC Sec Standby Section – ············ 59
7-20. Printed Wiring Board – CD SW Section – ······················· 61
7-21. Schematic Diagram – CD SW Section – ·························· 61
7-22. IC Block Diagrams ··························································· 63
7-23. IC PIN Function Description ············································ 66
8.
EXPLODED VIEWS
8-1.
Case Section ····································································· 69
8-2.
Front Panel Section ·························································· 70
8-3.
Chassis Section ································································· 71
8-4.
CD Mechanism Deck Section-1 (CDM38LH-5BD32L) ·· 73
8-5.
CD Mechanism Deck Section-2 (CDM38LH-5BD32L) ·· 74
8-6.
Base Unit Section (BU-5BD32L) ····································· 75
8-7.
Tape Mechanism Deck Section-1 (TCM-230AWR2) ······ 76
8-8.
Tape Mechanism Deck Section-2 (TCM-230AWR2) ······ 77
9.
ELECTRICAL PARTS LIST
··································· 78
TABLE OF CONTENTS
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